Semiconductor device and display device including the semiconductor device

ABSTRACT

In a transistor including an oxide semiconductor, a variation in electrical characteristics is suppressed and reliability is improved. A semiconductor device includes a transistor. The transistor includes a first gate electrode, a first insulating film over the first gate electrode, an oxide semiconductor film over the first insulating film, a second insulating film over the oxide semiconductor film, a second gate electrode over the second insulating film, and a third insulating film over the oxide semiconductor film and the second gate electrode. The oxide semiconductor film includes a channel region overlapping with the second gate electrode, a source region in contact with the third insulating film, and a drain region in contact with the third insulating film. The first gate electrode and the second gate electrode are electrically connected to each other. A difference between a minimum value and a maximum value of the field-effect mobility in the case where the field-effect mobility in a saturation region of the transistor is measured.

TECHNICAL FIELD

One embodiment of the present invention relates to a semiconductordevice including an oxide semiconductor film and a display deviceincluding the semiconductor device.

Note that one embodiment of the present invention is not limited to theabove technical field. The technical field of one embodiment of theinvention disclosed in this specification and the like relates to anobject, a method, or a manufacturing method. The present inventionrelates to a process, a machine, manufacture, or a composition ofmatter. In particular, one embodiment of the present invention relatesto a semiconductor device, a display device, a light-emitting device, apower storage device, a storage device, a driving method thereof, and amanufacturing method thereof.

In this specification and the like, a semiconductor device generallymeans a device that can function by utilizing semiconductorcharacteristics. A semiconductor element such as a transistor, asemiconductor circuit, an arithmetic device, and a memory device areeach an embodiment of a semiconductor device. An imaging device, adisplay device, a liquid crystal display device, a light-emittingdevice, an electro-optical device, a power generation device (includinga thin film solar cell, an organic thin film solar cell, and the like),and an electronic appliance may each include a semiconductor device.

BACKGROUND ART

Attention has been focused on a technique for forming a transistor usinga semiconductor thin film formed over a substrate having an insulatingsurface (also referred to as a field-effect transistor (FET) or a thinfilm transistor (TFT)). Such transistors are used in a wide range ofelectronic devices such as an integrated circuit (IC) and an imagedisplay device (display device). A semiconductor material typified bysilicon is widely known as a material for a semiconductor thin film thatcan be used for a transistor. As another material, an oxidesemiconductor has been attracting attention.

For example, a technique for forming a self-aligned top-gate transistorusing an oxide thin film is disclosed (see Patent Document 1).

In addition, a semiconductor device achieving high field-effect mobility(simply referred to as mobility or μFE in some cases) with such astructure that a plurality of oxide semiconductor layers are stacked,the oxide semiconductor layer serving as a channel in the plurality ofoxide semiconductor layers contains indium and gallium, and theproportion of indium is higher than the proportion of gallium (seePatent Document 2).

REFERENCE Patent Documents [Patent Document 1] Japanese Published PatentApplication No. 2009-278115 [Patent Document 2] Japanese PublishedPatent Application No. 2014-007399 DISCLOSURE OF INVENTION

As a structure of a transistor including an oxide semiconductor film, abottom-gate structure, a top-gate structure, and the like are given. Inthe case where a transistor including an oxide semiconductor film isused for a display device, a bottom-gate transistor is used more oftenthan a top-gate transistor because its manufacturing process isrelatively simple and its manufacturing cost is low.

However, a bottom-gate transistor has the following drawback: as thescreen size of a display device increases or the resolution of an imageof a display device increases, a typical example of which is ahigh-resolution display device with 4 k×2 k pixels (3840 pixels in thehorizontal direction and 2160 pixels in the vertical direction) or 8 k×4k pixels (7680 pixels in the horizontal direction and 4320 pixels in thevertical direction), signal delay or the like due to parasiticcapacitance between a gate electrode and source and drain electrodes ofthe transistor becomes more severe, and accordingly, the image qualityof the display device degrades. Thus, regarding a top-gate transistorincluding an oxide semiconductor film, a structure with stablesemiconductor characteristics and high reliability is desired to bedeveloped.

In view of the foregoing problems, an object of one embodiment of thepresent invention is to suppress a variation in electricalcharacteristics and improve reliability in a transistor including anoxide semiconductor. Another object of one embodiment of the presentinvention is to provide a top-gate transistor including an oxidesemiconductor. Another object of one embodiment of the present inventionis to provide a transistor including an oxide semiconductor and havinghigh on-state current. Another object of one embodiment of the presentinvention is to provide a transistor including an oxide semiconductorand having low off-state current. Another object of one embodiment ofthe present invention is to provide a semiconductor device with lowpower consumption. Another object of one embodiment of the presentinvention is to provide a novel semiconductor device.

Note that the description of the above object does not disturb theexistence of other objects. In one embodiment of the present invention,there is no need to achieve all the objects. Objects other than theabove objects will be apparent from and can be derived from thedescription of the specification and the like.

One embodiment of the present invention is a semiconductor deviceincluding a transistor. The transistor includes a first gate electrode,a first insulating film over the first gate electrode, an oxidesemiconductor film over the first insulating film, a second insulatingfilm over the oxide semiconductor film, a second gate electrode over thesecond insulating film, and a third insulating film over the oxidesemiconductor film and the second gate electrode. The oxidesemiconductor film includes a channel region overlapping with the secondgate electrode, a source region in contact with the third insulatingfilm, and a drain region in contact with the third insulating film. Thefirst gate electrode and the second gate electrode are electricallyconnected to each other. When the field-effect mobility in a saturationregion of the transistor is measured, a difference between a minimumvalue and a maximum value of the field-effect mobility is less than orequal to 15 cm²/Vs.

In the above embodiment, the field-effect mobility is preferablymeasured when voltages applied to the first gate electrode and thesecond gate electrode are in a range from 3 V to 10 V and a voltageapplied to the drain region is in a range from 10 V to 20 V.

In the above embodiment, the oxide semiconductor film preferablycontains In, M (M is Al, Ga, Y, or Sn), and Zn.

In the above embodiment, it is preferable that an atomic ratio of In toM and Zn be in a neighborhood of In:M:Zn=4:2:3, and that in the casewhere the proportion of In is 4, the proportion of M be greater than orequal to 1.5 and less than or equal to 2.5 and the proportion of Zn begreater than or equal to 2 and less than or equal to 4.

Another embodiment of the present invention is a display deviceincluding a display element and the semiconductor device of any one ofthe above embodiments. Another embodiment of the present invention is adisplay module including the display device and a touch sensor. Anotherembodiment of the present invention is an electronic device includingthe semiconductor device of any one of the above embodiments, thedisplay device, or the display module; and an operation key or abattery.

According to one embodiment of the present invention, a variation inelectrical characteristics can be suppressed and reliability can beimproved in a transistor including an oxide semiconductor. According toone embodiment of the present invention, a top-gate transistor includingan oxide semiconductor can be provided. According to one embodiment ofthe present invention, a transistor including an oxide semiconductor andhaving high on-state current can be provided. According to oneembodiment of the present invention, a transistor including an oxidesemiconductor and having low off-state current can be provided.According to one embodiment of the present invention, a semiconductordevice with low power consumption can be provided. According to oneembodiment of the present invention, a novel semiconductor device can beprovided.

Note that the description of these effects does not preclude theexistence of other effects. One embodiment of the present invention doesnot necessarily achieve all the effects listed above. Other effects willbe apparent from and can be derived from the description of thespecification, the drawings, the claims, and the like.

BRIEF DESCRIPTION OF DRAWINGS

In the accompanying drawings:

FIGS. 1A to 1C each show I_(d)-V_(g) characteristics of a transistor;

FIGS. 2A and 2B show I_(d)-V_(g) characteristics and I_(d)-V_(d)characteristics of a transistor;

FIG. 3 shows I_(d)-V_(g) characteristics and linear and saturationmobility curves which are calculated on the basis of GCA;

FIGS. 4A to 4C are a top view and cross-sectional views of a transistor;

FIG. 5 is a schematic view illustrating a concept of an effectivechannel length of a transistor;

FIGS. 6A to 6C are schematic views each illustrating a donor density;

FIG. 7 shows I_(d)-V_(g) characteristics;

FIG. 8 shows I_(d)-V_(g) characteristics;

FIG. 9 shows calculation results of a density of interface states;

FIGS. 10A and 10B show I_(d)-V_(g) characteristics;

FIG. 11 shows shapes of mobility curves;

FIG. 12 shows calculation results of mobility curves;

FIG. 13 shows results of sDOS;

FIGS. 14A and 14B are cross-sectional views illustrating a semiconductordevice;

FIGS. 15A and 15B are cross-sectional views illustrating a semiconductordevice;

FIGS. 16A and 16B are cross-sectional views illustrating a semiconductordevice;

FIGS. 17A and 17B are cross-sectional views illustrating a semiconductordevice;

FIGS. 18A and 18B are cross-sectional views illustrating a semiconductordevice;

FIGS. 19A and 19B are cross-sectional views illustrating a semiconductordevice;

FIGS. 20A and 20B are cross-sectional views illustrating a semiconductordevice;

FIGS. 21A and 21B are cross-sectional views illustrating a semiconductordevice;

FIGS. 22A to 22C each illustrate a band structure of a transistor;

FIGS. 23A to 23C each show the range of the atomic ratio of an oxidesemiconductor;

FIG. 24 illustrates a crystal of InMZnO₄;

FIG. 25 is an energy band diagram of a transistor including an oxidesemiconductor in a channel region;

FIGS. 26A to 26C are cross-sectional TEM images and a cross-sectionalHR-TEM image of an oxide semiconductor film;

FIGS. 27A to 27C are cross-sectional TEM images and a cross-sectionalHR-TEM image of an oxide semiconductor film;

FIGS. 28A to 28C are cross-sectional TEM images and a cross-sectionalHR-TEM image of an oxide semiconductor film;

FIGS. 29A to 29C show XRD measurement results and electron diffractionpatterns of an oxide semiconductor film;

FIGS. 30A to 30C show XRD measurement results and electron diffractionpatterns of an oxide semiconductor film;

FIGS. 31A to 31C show XRD measurement results and electron diffractionpatterns of an oxide semiconductor film;

FIGS. 32A and 32B show an electron diffraction pattern;

FIG. 33 shows line profiles of an electron diffraction pattern;

FIG. 34 shows a conceptual view illustrating line profiles of electrondiffraction patterns, relative luminance R of the line profiles, andhalf widths of the line profiles;

FIGS. 35A1, 35A2, 35B1, 35B2, 35C1, and 35C2 show electron diffractionpatterns and line profiles;

FIG. 36 shows relative luminance estimated from electron diffractionpatterns of oxide semiconductor films;

FIGS. 37A1, 37A2, 37B1, 37B2, 37C1, and 37C2 show cross-sectional TEMimages of oxide semiconductor films and cross-sectional TEM imagesobtained through analysis thereof;

FIGS. 38A to 38C show SIMS measurement results of oxide semiconductorfilms;

FIG. 39 is a top view illustrating one embodiment of a display device;

FIG. 40 is a cross-sectional view illustrating one embodiment of adisplay device;

FIG. 41 is a cross-sectional view illustrating one embodiment of adisplay device;

FIG. 42 is a cross-sectional view illustrating one embodiment of adisplay device;

FIGS. 43A to 43D are cross-sectional views illustrating a method forforming an EL layer;

FIG. 44 is a conceptual diagram illustrating a droplet dischargeapparatus;

FIG. 45 is a cross-sectional view illustrating one embodiment of adisplay device;

FIG. 46 is a cross-sectional view illustrating one embodiment of adisplay device;

FIGS. 47A to 47C illustrate cross sections of a semiconductor device;

FIG. 48 illustrates a cross section of a semiconductor device;

FIGS. 49A to 49C are a block diagram and circuit diagrams illustrating adisplay device;

FIGS. 50A to 50C are circuit diagrams and a timing chart illustratingone embodiment of the present invention;

FIGS. 51A to 51C are a graph and circuit diagrams illustrating oneembodiment of the present invention;

FIGS. 52A and 52B are a circuit diagram and a timing chart illustratingone embodiment of the present invention;

FIGS. 53A and 53B are a circuit diagram and a timing chart illustratingone embodiment of the present invention;

FIGS. 54A to 54E are a block diagram, circuit diagrams, and waveformdiagrams illustrating one embodiment of the present invention;

FIGS. 55A and 55B are a circuit diagram and a timing chart illustratingone embodiment of the present invention;

FIGS. 56A and 56B are circuit diagrams each illustrating one embodimentof the present invention;

FIGS. 57A to 57C are circuit diagrams each illustrating one embodimentof the present invention;

FIG. 58 illustrates a display module;

FIGS. 59A to 59E illustrate electronic devices;

FIGS. 60A to 60G illustrate electronic devices;

FIGS. 61A and 61B are perspective views illustrating a display device;

FIG. 62 shows I_(d)-V_(g) characteristics of transistors in Example;

FIG. 63 shows I_(d)-V_(g) characteristics of transistors in Example;

FIG. 64 shows I_(d)-V_(g) characteristics of transistors in Example;

FIG. 65 shows I_(d)-V_(g) characteristics of transistors in Example;

FIG. 66 shows I_(d)-V_(g) characteristics of transistors in Example;

FIG. 67 shows I_(d)-V_(g) characteristics of transistors in Example; and

FIG. 68 shows threshold voltages of transistors in Example.

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiments will be hereinafter described with reference to drawings.Note that the embodiments can be implemented in many different modes. Itwill be readily appreciated by those skilled in the art that modes anddetails can be changed in various ways without departing from the spiritand scope of the present invention. Therefore, the present inventionshould not be interpreted as being limited to the description in thefollowing embodiments.

In the drawings, the size, the layer thickness, or the region isexaggerated for clarity in some cases. Therefore, embodiments of thepresent invention are not limited to such a scale.

Note that the drawings are schematic views showing ideal examples, andembodiments of the present invention are not limited to shapes or valuesshown in the drawings.

Ordinal numbers such as “first,” “second,” and “third” in thisspecification are used in order to avoid confusion among components, andthe terms do not limit the components numerically.

In this specification, terms for describing arrangement, such as “over”and “under,” are used for convenience for describing the positionalrelation between components with reference to drawings. The positionalrelation between components is changed as appropriate in accordance witha direction in which each component is described. Thus, there is nolimitation on terms used in this specification, and description can bemade appropriately depending on the situation.

In this specification and the like, a transistor is an element having atleast three terminals of a gate, a drain, and a source. The transistorincludes a channel region between the drain (a drain terminal, a drainregion, or a drain electrode) and the source (a source terminal, asource region, or a source electrode) and current can flow between thesource and the drain through the channel region. Note that in thisspecification and the like, a channel region refers to a region throughwhich current mainly flows.

Functions of a “source” and a “drain” are sometimes replaced with eachother when a transistor of opposite polarity is used or when thedirection of current flowing is changed in circuit operation, forexample. Therefore, the terms “source” and “drain” can be replaced witheach other in this specification and the like.

In this specification and the like, the term “electrically connected”includes the case where components are connected through an objecthaving any electric function. There is no particular limitation on an“object having any electric function” as long as electric signals can betransmitted and received between components that are connected throughthe object. Examples of an “object having any electric function” includea switching element such as a transistor, a resistor, an inductor, acapacitor, and an element with a variety of functions, as well as anelectrode and a wiring.

In this specification and the like, the term “parallel” indicates thatthe angle formed between two straight lines is greater than or equal to−10° and less than or equal to 10°, and accordingly also includes thecase where the angle is greater than or equal to −5° and less than orequal to 5°. In addition, the term “perpendicular” indicates that theangle formed between two straight lines is greater than or equal to 80°and less than or equal to 100°, and accordingly also includes the casewhere the angle is greater than or equal to 85° and less than or equalto 95°.

In this specification and the like, the terms “film” and “layer” can beinterchanged with each other. For example, the term “conductive layer”can be changed into the term “conductive film” in some cases. Also, theterm “insulating film” can be changed into the term “insulating layer”in some cases.

Unless otherwise specified, the off-state current in this specificationand the like refers to a drain current of a transistor in the off state(also referred to as non-conduction state and cutoff state). Unlessotherwise specified, the off state of an n-channel transistor means thatthe voltage between its gate and source (V_(gs): gate-source voltage) islower than the threshold voltage V_(th), and the off state of ap-channel transistor means that the gate-source voltage V_(gs) is higherthan the threshold voltage V_(th). For example, the off-state current ofan n-channel transistor sometimes refers to a drain current that flowswhen the gate-source voltage V_(gs) is lower than the threshold voltageV_(th).

The off-state current of a transistor depends on V_(gs) in some cases.Thus, “the off-state current of a transistor is lower than or equal toI” may mean there is V_(gs) at which the off-state current of thetransistor is lower than or equal to I. The off-state current of atransistor may refer to off-state current at a given V_(gs), at V_(gs)in a given range, or at V_(gs) at which sufficiently low off-statecurrent is obtained, for example.

As an example, the assumption is made of an n-channel transistor wherethe threshold voltage V_(th) is 0.5 V and the drain current is 1×10⁻⁹ Aat V_(gs) of 0.5 V, 1×10⁻¹³ A at V_(gs) of 0.1 V, 1×10⁻¹⁹ A at V_(gs) of−0.5 V, and 1×10⁻²² A at V_(gs) of −0.8 V. The drain current of thetransistor is 1×10⁻¹⁹ A or lower at V_(gs) of −0.5 V or at V_(gs) in therange of −0.8 V to −0.5 V; therefore, it can be said that the off-statecurrent of the transistor is 1×10⁻¹⁹ A or lower. Since there is V_(gs)at which the drain current of the transistor is 1×10⁻²² A or lower, itmay be said that the off-state current of the transistor is 1×10⁻²² A orlower.

In this specification and the like, the off-state current of atransistor with a channel width W is sometimes represented by a currentvalue per channel width W or by a current value per given channel width(e.g., 1 μm). In the latter case, the off-state current may berepresented by current per length (e.g., A/μm).

The off-state current of a transistor depends on temperature in somecases. Unless otherwise specified, the off-state current in thisspecification may be an off-state current at room temperature, 60° C.,85° C., 95° C., or 125° C. Alternatively, the off-state current may bean off-state current at a temperature at which the reliability of asemiconductor device or the like including the transistor is ensured ora temperature at which the semiconductor device or the like is used(e.g., temperature in the range of 5° C. to 35° C.). The state in whichthe off-state current of a transistor is I or lower may indicate thatthe off-state current of the transistor at room temperature, 60° C., 85°C., 95° C., 125° C., a temperature at which the reliability of asemiconductor device or the like including the transistor is ensured, ora temperature at which the semiconductor device or the like is used(e.g., a temperature in the range of 5° C. to 35° C.) is I or lower at acertain V_(gs).

The off-state current of a transistor depends on voltage V_(ds) betweenits drain and source in some cases. Unless otherwise specified, theoff-state current in this specification may be an off-state current atV_(ds) of 0.1 V, 0.8 V, 1 V, 1.2 V, 1.8 V, 2.5 V, 3 V, 3.3 V, 10 V, 12V, 16 V, or 20 V. Alternatively, the off-state current may be anoff-state current at V_(ds) at which the reliability of a semiconductordevice or the like including the transistor is ensured or V_(ds) used inthe semiconductor device or the like. The state in which the off-statecurrent of a transistor is lower than or equal to I may indicate thatthe off-state current of the transistor at V_(ds) of 0.1 V, 0.8 V, 1 V,1.2 V, 1.8 V, 2.5 V, 3 V, 3.3 V, 10 V, 12 V, 16 V, or 20 V, at V_(ds) atwhich the reliability of a semiconductor device or the like includingthe transistor is ensured, or at V_(ds) used in the semiconductor deviceor the like is lower than or equal to I at a certain V_(gs).

In the above description of off-state current, a drain may be replacedwith a source. That is, the off-state current sometimes refers to acurrent that flows through a source of a transistor in the off state.

In this specification and the like, the term “leakage current” sometimesexpresses the same meaning as off-state current. In this specificationand the like, the off-state current sometimes refers to a current thatflows between a source and a drain when a transistor is off, forexample.

In this specification and the like, the threshold voltage of atransistor refers to a gate voltage (V_(g)) at which a channel is formedin the transistor. Specifically, in a graph where the horizontal axisrepresents the gate voltage (V_(g)) and the vertical axis represents thesquare root of drain current (I_(d)), the threshold voltage of atransistor may refer to a gate voltage (V_(g)) at the intersection ofthe square root of drain current (I_(d)) of 0 (I_(d)=0 A) and anextrapolated straight line that is tangent with the highest inclinationto a plotted curve (V_(g)-√I_(d) characteristics). Alternatively, thethreshold voltage of a transistor may refer to a gate voltage (V_(g)) atwhich the value of I_(d) [A]×L [μm]/W [μm] is 1×10⁻⁹ [A] where L ischannel length and W is channel width.

In this specification and the like, a “semiconductor” includescharacteristics of an “insulator” in some cases when the conductivity issufficiently low, for example. Furthermore, a “semiconductor” and an“insulator” cannot be strictly distinguished from each other in somecases because a border between the “semiconductor” and the “insulator”is not clear. Accordingly, a “semiconductor” in this specification andthe like can be called an “insulator” in some cases. Similarly, an“insulator” in this specification and the like can be called a“semiconductor” in some cases. Alternatively, an “insulator” in thisspecification and the like can be called a “semi-insulator” in somecases.

In this specification and the like, a “semiconductor” includescharacteristics of a “conductor” in some cases when the conductivity issufficiently high, for example. Furthermore, a “semiconductor” and a“conductor” cannot be strictly distinguished from each other in somecases because a border between the “semiconductor” and the “conductor”is not clear. Accordingly, a “semiconductor” in this specification andthe like can be called a “conductor” in some cases. Similarly, a“conductor” in this specification and the like can be called a“semiconductor” in some cases.

In this specification and the like, an impurity in a semiconductorrefers to an element that is not a main component of the semiconductor.For example, an element with a concentration lower than 0.1 atomic % isan impurity. If a semiconductor contains an impurity, the density ofstates (DOS) may be formed therein, the carrier mobility may bedecreased, or the crystallinity may be decreased, for example. In thecase where the semiconductor includes an oxide semiconductor, examplesof an impurity which changes the characteristics of the semiconductorinclude Group 1 elements, Group 2 elements, Group 14 elements, Group 15elements, and transition metals other than the main components; specificexamples are hydrogen (also included in water), lithium, sodium,silicon, boron, phosphorus, carbon, and nitrogen. In an oxidesemiconductor, an oxygen vacancy may be formed by entry of an impuritysuch as hydrogen. Furthermore, in the case where the semiconductorincludes silicon, examples of an impurity which changes thecharacteristics of the semiconductor include oxygen, Group 1 elementsexcept hydrogen, Group 2 elements, Group 13 elements, and Group 15elements.

In this specification and the like, a metal oxide means an oxide ofmetal in a broad sense. Metal oxides are classified into an oxideinsulator, an oxide conductor (including a transparent oxide conductor),an oxide semiconductor (also simply referred to as an OS), and the like.For example, a metal oxide used in an active layer of a transistor iscalled an oxide semiconductor in some cases. In other words, an OS FETis a transistor including a metal oxide or an oxide semiconductor.

In this specification and the like, a metal oxide including nitrogen isalso called a metal oxide in some cases. Moreover, a metal oxideincluding nitrogen may be called a metal oxynitride.

In this specification and the like, “c-axis aligned crystal (CAAC)” or“cloud-aligned composite (CAC)” might be stated. CAAC refers to anexample of a crystal structure, and CAC refers to an example of afunction or a material composition.

An example of a crystal structure of an oxide semiconductor or a metaloxide is described. Note that an oxide semiconductor deposited by asputtering method using an In—Ga—Zn oxide target (In:Ga:Zn=4:2:4.1 in anatomic ratio) is described below as an example. An oxide semiconductorformed by a sputtering method using the above-mentioned target at asubstrate temperature of higher than or equal to 100° C. and lower thanor equal to 130° C. is referred to as sIGZO, and an oxide semiconductorformed by a sputtering method using the above-mentioned target with thesubstrate temperature set at room temperature (R.T.) is referred to astIGZO. For example, sIGZO has one or both crystal structures of nanocrystal (nc) and CAAC. Furthermore, tIGZO has a crystal structure of nc.Note that room temperature (R.T.) herein also refers to a temperature ofthe time when a substrate is not heated intentionally.

In this specification and the like, CAC-OS or CAC-metal oxide has afunction of a conductor in a part of the material and has a function ofa dielectric (or insulator) in another part of the material; as a whole,CAC-OS or CAC-metal oxide has a function of a semiconductor. In the casewhere CAC-OS or CAC-metal oxide is used in an active layer of atransistor, the conductor has a function of letting electrons (or holes)serving as carriers flow, and the dielectric has a function of notletting electrons serving as carriers flow. By the complementary actionof the function as a conductor and the function as a dielectric, CAC-OSor CAC-metal oxide can have a switching function (on/off function). Inthe CAC-OS or CAC-metal oxide, separation of the functions can maximizeeach function.

In this specification and the like, CAC-OS or CAC-metal oxide includesconductor regions and dielectric regions. The conductor regions have theabove-described function of the conductor, and the dielectric regionshave the above-described function of the dielectric. In some cases, theconductor regions and the dielectric regions in the material areseparated at the nanoparticle level. In some cases, the conductorregions and the dielectric regions are unevenly distributed in thematerial. When observed, the conductor regions are coupled in acloud-like manner with their boundaries blurred, in some cases.

In other words, CAC-OS or CAC-metal oxide can be called a matrixcomposite or a metal matrix composite.

Furthermore, in the CAC-OS or CAC-metal oxide, the conductor regions andthe dielectric regions each have a size of more than or equal to 0.5 nmand less than or equal to 10 nm, preferably more than or equal to 0.5 nmand less than or equal to 3 nm and are dispersed in the material, insome cases.

Embodiment 1

In this embodiment, a semiconductor device of one embodiment of thepresent invention is described with reference to FIGS. 1A to 1C, FIGS.2A and 2B, FIG. 3, FIGS. 4A to 4C, FIG. 5, FIGS. 6A to 6C, FIG. 7, FIG.8, FIG. 9, FIGS. 10A and 10B, FIG. 11, FIG. 12, FIG. 13, FIGS. 14A and14B, FIGS. 15A and 15B, FIGS. 16A and 16B, FIGS. 17A and 17B, FIGS. 18Aand 18B, FIGS. 19A and 19B, FIGS. 20A and 20B, FIGS. 21A and 21B, andFIGS. 22A to 22C.

One embodiment of the present invention is a semiconductor deviceincluding a transistor. The transistor includes a first gate electrode,a first insulating film over the first gate electrode, an oxidesemiconductor film over the first insulating film, a second insulatingfilm over the oxide semiconductor film, a second gate electrode over thesecond insulating film, and a third insulating film over the oxidesemiconductor film and the second gate electrode. The oxidesemiconductor film includes a channel region overlapping with the secondgate electrode, a source region in contact with the third insulatingfilm, and a drain region in contact with the third insulating film. Thefirst gate electrode and the second gate electrode are electricallyconnected to each other.

In a saturation region of the above transistor, a difference between aminimum value and a maximum value of the field-effect mobility is lessthan or equal to 15 cm²/Vs.

In other words, the semiconductor device of one embodiment of thepresent invention is a transistor in which an oxide semiconductor filmis included in a channel region, and a variation in the field-effectmobility in a saturation region of the transistor is extremely small.When such a semiconductor device is used as a transistor for a pixel ofan organic EL display, for example, high reliability can be obtained.

<1-1. Characteristics of Transistor>

First, general characteristics of a transistor are described withreference to FIGS. 2A and 2B and FIG. 3.

[I_(d)-V_(g) Characteristics of Transistor]

First, drain current-gate voltage characteristics (I_(d)-V_(g)characteristics) of a transistor are described. FIG. 2A illustrates anexample of I_(d)-V_(g) characteristics of the transistor. FIG. 2A showsthe case where polycrystalline silicon is used for an active layer ofthe transistor for easy understanding. In FIG. 2A, the vertical axis andthe horizontal axis represent I_(d) and V_(g), respectively.

As illustrated in FIG. 2A, I_(d)-V_(g) characteristics are broadlydivided into three regions. A first region, a second region, and a thirdregion are referred to as an off region (OFF region), a subthresholdregion, and an on region (ON region), respectively. A gate voltage at aboundary between the subthreshold region and the on region is referredto as a threshold voltage (V_(th)).

To obtain favorable characteristics of the transistor, it is preferablethat the drain current in the off region (also referred to as off-statecurrent or I_(off)) be low and the drain current in the on region (alsoreferred to as on-state current or I_(on)) be high. As an index of theon-state current of the transistor, the field-effect mobility is oftenused. The details of the field-effect mobility are described later.

To drive the transistor at a low voltage, the slope of the I_(d)-V_(g)characteristics in the subthreshold region is preferably steep. An indexof the degree of change in the I_(d)-V_(g) characteristics in thesubthreshold region is referred to as subthreshold swing (SS) or an Svalue. The S value is represented by the following formula (1).

$\begin{matrix}\lbrack {{Formula}\mspace{14mu} 1} \rbrack & \; \\{{SS} = {\min ( \frac{\partial V_{g}}{\partial{\log_{10}( I_{d} )}} )}} & (1)\end{matrix}$

The S value is a minimum value of the amount of change in gate voltagewhich is needed for changing a drain current by an order of magnitude inthe subthreshold region. As the S value is smaller, switching operationbetween on and off states can be performed rapidly.

[I_(d)-V_(d) Characteristics of Transistor]

Next, drain current-drain voltage characteristics (I_(d)-V_(d)characteristics) of a transistor are described. FIG. 2B illustrates anexample of I_(d)-V_(d) characteristics of the transistor. In FIG. 2B,the vertical axis and the horizontal axis represent I_(d) and V_(d),respectively.

As illustrated in FIG. 2B, the on region is further divided into tworegions. A first region and a second region are referred to as a linearregion and a saturation region, respectively. In the linear region,drain current increases in a parabola shape in accordance with theincrease in drain voltage. On the other hand, in the saturation region,drain current does not greatly change even when drain voltage changes.According to a vacuum tube, the linear region and the saturation regionare referred to as a triode region and a pentode region in some cases.

The linear region indicates the state where V_(g) is higher than V_(d)(V_(d)<V_(g)) in some cases. The saturation region indicates the statewhere V_(d) is higher than V_(g) (V_(g)<V_(d)) in some cases. However,in practice, the threshold voltage of the transistor needs to beconsidered. Thus, the state where a value obtained by subtracting thethreshold voltage of the transistor from the gate voltage is higher thanthe drain voltage (V_(d)<V_(g)−V_(th)) is referred to as the linearregion in some cases. Similarly, the state where a value obtained bysubtracting the threshold voltage of the transistor from the gatevoltage is lower than the drain voltage (V_(g)−V_(th)<V_(d)) is referredto as the saturation region in some cases.

The I_(d)-V_(d) characteristics of the transistor with which current inthe saturation region is constant are expressed as “favorablesaturation” in some cases. The favorable saturation of the transistor isimportant particularly when the transistor is used in an organic ELdisplay. For example, a transistor with favorable saturation is used asa transistor of a pixel of an organic EL display, whereby a change inluminance of the pixel can be suppressed even when the drain voltage ischanged.

[Analysis Model of Drain Current]

Next, an analysis model of the drain current is described. As theanalysis model of the drain current, analytic formulae of drain currentbased on gradual channel approximation (GCA) is known. On the basis ofGCA, the drain current of the transistor is represented by the followingformula (2).

$\begin{matrix}\lbrack {{Formula}\mspace{14mu} 2} \rbrack & \; \\{I_{d} = \{ \begin{matrix}{\mu \; \frac{W}{L}{C_{OX}\lbrack {{( {V_{g} - V_{th}} )V_{d}} - {\frac{1}{2}V_{d}^{2}}} \rbrack}\mspace{14mu} \ldots \mspace{14mu} ( {{V_{g} - V_{th}} > V_{d}} )} \\{\mu \; \frac{W}{2L}{C_{OX}( {V_{g} - V_{th}} )}^{2}\mspace{14mu} \ldots \mspace{14mu} ( {{V_{g} - V_{th}} \leq V_{d}} )}\end{matrix} } & (2)\end{matrix}$

In the formula (2), the upper formula is a formula for drain current ina linear region and the lower formula is a formula for drain current ina saturation region.

[Field-Effect Mobility]

Next, field-effect mobility is described. As an index of current drivecapability of a transistor, the field-effect mobility is used. Asdescribed above, the on region of the transistor is divided into thelinear region and the saturation region. From the characteristics in theregions, the field-effect mobility of the transistor can be calculatedon the basis of the analytic formulae of the drain current based on GCA.The field-effect mobility in the linear region and the field-effectmobility in the saturation region are referred to as linear mobility andsaturation mobility, respectively, when they need to be distinguishedfrom each other. The linear mobility is represented by the followingformula (3) and the saturation mobility is represented by the followingformula (4).

$\begin{matrix}\lbrack {{Formula}\mspace{14mu} 3} \rbrack & \; \\{\mu_{FE}^{lin} = {\frac{L}{{WC}_{OX}}\frac{\partial I_{d}}{\partial V_{g}}\frac{1}{V_{d}}}} & (3) \\\lbrack {{Formula}\mspace{14mu} 4} \rbrack & \; \\{\mu_{FE}^{sat} = {\frac{2L}{{WC}_{OX}}( \frac{\partial\sqrt{I_{d}}}{\partial V_{g}} )^{2}}} & (4)\end{matrix}$

In this specification and the like, curves calculated from the formula(3) and the formula (4) are referred to as mobility curves. FIG. 3 showsmobility curves calculated from the analytic formulae of drain currentbased on GCA. In FIG. 3, the I_(d)-V_(g) characteristics of thetransistor and the mobility curves of the linear mobility and thesaturation mobility overlap with each other.

In FIG. 3, the I_(d)-V_(g) characteristics are calculated from theanalytic formulae of drain current based on GCA. The shapes of themobility curves can be a lead to understanding the state of the insideof the transistor.

For example, the shape of the curve of the saturation mobility in FIG. 3is focused on. When the gate voltage increases, carriers (electrons orholes) of the transistor are accelerated by an electric field to gainenergy. Thus, the carriers gain certain energy by an electric field, andthe saturation mobility is increased. However, the carriers are notaccelerated limitlessly, and collide with thermally vibratinginterstitial atoms, ionized impurity atoms, or the like to lose energy;as a result, the saturation mobility is gradually decreased.

<1-2. Fabrication of Transistor for Evaluating Characteristics>

Next, the structure of the transistor of one embodiment of the presentinvention is described, and evaluation results of electricalcharacteristics of the transistor which was fabricated are shown.

[Structure Example 1 of Transistor]

FIG. 4A is a top view of a transistor 100A. FIG. 4B is a cross-sectionalview taken along the dashed-dotted line X1-X2 in FIG. 4A. FIG. 4C is across-sectional view taken along the dashed-dotted line Y1-Y2 in FIG.4A. For clarity, some components such as an insulating film 110 are notillustrated in FIG. 4A. As in FIG. 4A, some components are notillustrated in some cases in top views of transistors described below.In addition, the direction of the dashed-dotted line X1-X2 may bereferred to as the channel length (L) direction, and the direction ofthe dashed-dotted line Y1-Y2 may be referred to as the channel width (W)direction.

The transistor 100A illustrated in FIGS. 4A to 4C includes a conductivefilm 106 over a substrate 102, an insulating film 104 over theconductive film 106, an oxide semiconductor film 108 over the insulatingfilm 104, the insulating film 110 over the oxide semiconductor film 108,a conductive film 112 over the insulating film 110, and an insulatingfilm 116 over the insulating film 104, the oxide semiconductor film 108,and the conductive film 112. The oxide semiconductor film 108 includes achannel region 108 i overlapping with the conductive film 112, a sourceregion 108 s in contact with the insulating film 116, and a drain region108 d in contact with the insulating film 116.

The insulating film 116 contains nitrogen or hydrogen. The insulatingfilm 116 is in contact with the source region 108 s and the drain region108 d, so that nitrogen or hydrogen that is contained in the insulatingfilm 116 is added to the source region 108 s and the drain region 108 d.The source region 108 s and the drain region 108 d each have a highcarrier density when nitrogen or hydrogen is added thereto.

The transistor 100A may further include an insulating film 118 over theinsulating film 116, a conductive film 120 a electrically connected tothe source region 108 s through an opening 141 a provided in theinsulating films 116 and 118, and a conductive film 120 b electricallyconnected to the drain region 108 d through an opening 141 b provided inthe insulating films 116 and 118. In addition, an insulating film 122may be provided over the insulating film 118, the conductive film 120 a,and the conductive film 120 b. Although the structure where theinsulating film 122 is provided is shown in FIGS. 4B and 4C, oneembodiment of the present invention is not limited thereto, and theinsulating film 122 is not necessarily provided.

In this specification and the like, the insulating film 104 may bereferred to as a first insulating film, the insulating film 110 may bereferred to as a second insulating film, the insulating film 116 may bereferred to as a third insulating film, the insulating film 118 may bereferred to as a fourth insulating film, and the insulating film 122 maybe referred to as a fifth insulating film. The insulating film 104functions as a first gate insulating film and the insulating film 110functions as a second gate insulating film. The insulating films 116 and118 function as a protective insulating film and the insulating film 122functions as a planarization film.

The insulating film 110 includes an excess oxygen region. Since theinsulating film 110 includes the excess oxygen region, excess oxygen canbe supplied to the channel region 108 i included in the oxidesemiconductor film 108. As a result, oxygen vacancies that might beformed in the channel region 108 i can be filled with excess oxygen,which can provide a highly reliable semiconductor device.

To supply excess oxygen to the oxide semiconductor film 108, excessoxygen may be supplied to the insulating film 104 that is formed underthe oxide semiconductor film 108. In that case, excess oxygen containedin the insulating film 104 might also be supplied to the source region108 s and the drain region 108 d included in the oxide semiconductorfilm 108. When excess oxygen is supplied to the source region 108 s andthe drain region 108 d, the resistance of the source region 108 s andthe drain region 108 d might be increased.

In contrast, in the structure in which the insulating film 110 formedover the oxide semiconductor film 108 contains excess oxygen, excessoxygen can be selectively supplied only to the channel region 108 i.Alternatively, the carrier density of the source and drain regions 108 sand 108 d can be selectively increased after excess oxygen is suppliedto the channel region 108 i and the source and drain regions 108 s and108 d, in which case an increase in the resistance of the source anddrain regions 108 s and 108 d can be prevented.

Furthermore, each of the source region 108 s and the drain region 108 dincluded in the oxide semiconductor film 108 preferably contains anelement that forms an oxygen vacancy or an element that is bonded to anoxygen vacancy. Typical examples of the element that forms an oxygenvacancy or the element that is bonded to an oxygen vacancy includehydrogen, boron, carbon, nitrogen, fluorine, phosphorus, sulfur,chlorine, titanium, and a rare gas. Typical examples of the rare gaselement include helium, neon, argon, krypton, and xenon. The elementthat forms an oxygen vacancy is diffused from the insulating film 116 tothe source region 108 s and the drain region 108 d in the case where theinsulating film 116 contains one or more such elements. In addition oralternatively, the element that forms an oxygen vacancy is added to thesource region 108 s and the drain region 108 d by impurity additiontreatment.

An impurity element added to the oxide semiconductor film cuts a bondbetween a metal element and oxygen in the oxide semiconductor film, sothat an oxygen vacancy is formed. Alternatively, when an impurityelement is added to the oxide semiconductor film, oxygen bonded to ametal element in the oxide semiconductor film is bonded to the impurityelement and detached from the metal element, so that an oxygen vacancyis formed. As a result, the oxide semiconductor film has a highercarrier density, and thus, the conductivity thereof becomes higher.

The conductive film 106 functions as a first gate electrode and theconductive film 112 functions as a second gate electrode. The conductivefilm 120 a functions as a source electrode and the conductive film 120 bfunctions as a drain electrode.

As illustrated in FIG. 4C, an opening 143 is provided in the insulatingfilms 104 and 110. The conductive film 106 is electrically connected tothe conductive film 112 through the opening 143. Thus, the samepotential is applied to the conductive film 106 and the conductive film112. Note that different potentials may be applied to the conductivefilm 106 and the conductive film 112 without providing the opening 143.Alternatively, the conductive film 106 may be used as a light-shieldingfilm without providing the opening 143. For example, when the conductivefilm 106 is formed using a light-shielding material, light irradiationof the channel region 108 i from the bottom can be reduced.

As illustrated in FIGS. 4B and 4C, the oxide semiconductor film 108faces the conductive film 106 functioning as a first gate electrode andthe conductive film 112 functioning as a second gate electrode and ispositioned between the two conductive films functioning as the gateelectrodes.

Furthermore, the length of the conductive film 112 in the channel widthdirection is larger than the length of the oxide semiconductor film 108in the channel width direction. In the channel width direction, thewhole oxide semiconductor film 108 is covered with the conductive film112 with the insulating film 110 placed therebetween. Since theconductive film 112 is connected to the conductive film 106 through theopening 143 provided in the insulating films 104 and 110, a side surfaceof the oxide semiconductor film 108 in the channel width direction facesthe conductive film 112 with the insulating film 110 placedtherebetween.

In other words, in the channel width direction of the transistor 100A,the conductive films 106 and 112 are connected to each other through theopening 143 provided in the insulating films 104 and 110, and theconductive films 106 and 112 surround the oxide semiconductor film 108with the insulating films 104 and 110 positioned therebetween.

Such a structure enables the oxide semiconductor film 108 included inthe transistor 100A to be electrically surrounded by electric fields ofthe conductive film 106 functioning as a first gate electrode and theconductive film 112 functioning as a second gate electrode. A devicestructure of a transistor, like that of the transistor 100A, in whichelectric fields of a first gate electrode and a second gate electrodeelectrically surround the oxide semiconductor film 108 in which achannel region is formed can be referred to as a surrounded channel(S-channel) structure.

Since the transistor 100A has the S-channel structure, an electric fieldfor inducing a channel can be effectively applied to the oxidesemiconductor film 108 by the conductive film 106 or the conductive film112; thus, the current drive capability of the transistor 100A can beimproved and high on-state current characteristics can be obtained. As aresult of the high on-state current, it is possible to reduce the sizeof the transistor 100A. Furthermore, since the transistor 100A has astructure in which the oxide semiconductor film 108 is surrounded by theconductive film 106 and the conductive film 112, the mechanical strengthof the transistor 100A can be increased.

When seen in the channel width direction of the transistor 100A, anopening different from the opening 143 may be formed on the side of theoxide semiconductor film 108 on which the opening 143 is not formed.

[Fabrication of Transistors]

Next, transistors which correspond to the above-described transistor100A were formed and the electrical characteristics of the transistorswere evaluated. In this embodiment, Samples A1 to A3 described belowwere fabricated.

Samples A1 to A3 are each a sample in which a transistor with a channellength L of 2 μm and a channel width W of 3 μm is formed. Samples A1 andA2 are each a sample in which a transistor for comparison is formed andSample A3 is a sample in which the transistor of one embodiment of thepresent invention is formed. Samples A1 to A3 were fabricated in thefollowing manner: the deposition conditions of the oxide semiconductorfilms are different from each other and the other steps are the same.

[Fabrication Methods of Samples A1 to A3]

First, a 10-nm-thick titanium film and a 100-nm-thick copper film wereformed over a glass substrate with a sputtering apparatus. Next, theconductive film was processed by a photolithography method.

A stack including four insulating films was formed over the substrateand the conductive film. The insulating films were formed in successionin a vacuum with a plasma-enhanced chemical deposition (PECVD)apparatus. As the insulating films, a 50-nm-thick silicon nitride film,a 300-nm-thick silicon nitride film, a 50-nm-thick silicon nitride film,and a 50-nm-thick silicon oxynitride film were used and stacked in thisorder.

Next, an oxide semiconductor film was formed over the insulating filmand was processed into an island shape, whereby a semiconductor layerwas formed. A 40-nm-thick oxide semiconductor film was formed as theoxide semiconductor film 108. Samples A1 to A3 are different from eachother in the deposition condition of the oxide semiconductor film.

The oxide semiconductor film used for Sample A1 was formed under thefollowing conditions: the substrate temperature was 170° C.; an argongas with a flow rate of 140 sccm and an oxygen gas with a flow rate of60 sccm were introduced into a chamber of the sputtering apparatus; thepressure was set to 0.6 Pa; and an AC power of 2.5 kW was applied to ametal oxide target containing indium, gallium, and zinc (with an atomicration of In:Ga:Zn=4:2:4.1). The proportion of oxygen in the wholedeposition gas is referred to as an oxygen flow rate percentage in somecases. The oxygen flow rate percentage in deposition of the oxidesemiconductor film of Sample A1 was 30%.

The oxide semiconductor film used for Sample A2 was formed under thefollowing conditions: the substrate temperature was 130° C.; an argongas with a flow rate of 180 sccm and an oxygen gas with a flow rate of20 sccm were introduced into a chamber of the sputtering apparatus; thepressure was set to 0.6 Pa; and an AC power of 2.5 kW was applied to ametal oxide target containing indium, gallium, and zinc (with an atomicration of In:Ga:Zn=4:2:4.1). The oxygen flow rate percentage indeposition of the oxide semiconductor film of Sample A2 was 10%.

The oxide semiconductor film used for Sample A3 was formed under thefollowing conditions: the substrate temperature was room temperature(R.T.); an argon gas with a flow rate of 180 sccm and an oxygen gas witha flow rate of 20 sccm were introduced into a chamber of the sputteringapparatus; the pressure was set to 0.6 Pa; and an AC power of 2.5 kW wasapplied to a metal oxide target containing indium, gallium, and zinc(with an atomic ration of In:Ga:Zn=4:2:4.1). The oxygen flow ratepercentage in deposition of the oxide semiconductor film of Sample A3was 10%.

Next, an insulating film was formed over the insulating film and theoxide semiconductor layer. As the insulating film, a 150-nm-thicksilicon oxynitride film was formed with a PECVD apparatus.

Next, heat treatment was performed. The heat treatment was performed at350° C. for one hour in a mixed gas atmosphere of nitrogen and oxygen.

An opening was formed in a desired region of the insulating film. Theopening was formed by a dry etching method.

Then, a 100-nm-thick oxide semiconductor film was formed over theinsulating film and in the opening and the oxide semiconductor film wasprocessed into an island shape, whereby a conductive film was formed. Inaddition, the insulating film in contact with the bottom surface of theconductive film was processed in succession after the formation of theconductive film, whereby the insulating film was formed.

As the conductive film, a 10-nm-thick oxide semiconductor film, a50-nm-thick titanium nitride film, and a 100-nm-thick copper film wereformed in this order. The oxide semiconductor film was formed under thefollowing conditions: the substrate temperature was 170° C.; an oxygengas with a flow rate of 200 sccm was introduced into a chamber of thesputtering apparatus; the pressure was set to 0.6 Pa; and an AC power of2.5 kW was applied to a metal oxide target containing indium, gallium,and zinc (with an atomic ratio of In:Ga:Zn=4:2:4.1). The titaniumnitride film and the copper film were each formed using a sputteringapparatus.

Next, plasma treatment was performed from above the oxide semiconductorfilm, the insulating film, and the conductive film. The plasma treatmentwas performed with a PECVD apparatus at a substrate temperature 220° C.in a mixed gas atmosphere containing an argon gas and a nitrogen gas.

Next, an insulating film was formed over the oxide semiconductor film,the insulating film, and the conductive film. The insulating film wasformed by stacking a 100-nm-thick silicon nitride film and a300-nm-thick silicon oxynitride film with a PECVD apparatus.

Then, a mask was formed over the formed insulating film and an openingwas formed in the insulating film with use of the mask.

A conductive film was formed to fill the opening and was processed intoan island shape, whereby the conductive film serving as a sourceelectrode and a drain electrode was formed. For the conductive films, a10-nm-thick titanium film and a 100-nm-thick copper film were formedwith a sputtering apparatus.

After that, an insulating film was formed over the insulating film andthe conductive film. A 1.5-μm-thick acrylic-based photosensitive resinwas used for the insulating film.

In the above manner, Samples A1 to A3 were fabricated.

[I_(d)-V_(g) Characteristics of Transistors]

Next, I_(d)-V_(g) characteristics of the fabricated transistors ofSamples A1 to A3 were measured. As conditions for measuring theI_(d)-V_(g) characteristics of each transistor, a voltage applied to theconductive film serving as a first gate electrode (hereinafter thevoltage is also referred to as gate voltage (V_(g))) and a voltageapplied to the conductive film serving as the second gate electrode(hereinafter the voltage is also referred to as back gate voltage(V_(bg))) were changed from −10 V to +10 V in increments of 0.25 V. Avoltage applied to the conductive film serving as a source electrode(hereinafter the voltage is also referred to as source voltage (V_(s)))was 0 V (comm) and voltages applied to the conductive film serving as adrain electrode (hereinafter the voltages are also referred to as drainvoltage (V_(d))) were 0.1 V and 20 V.

FIGS. 1A, 1B, and 1C show the results of I_(d)-V_(g) characteristics ofSamples A1, A2, and A3, respectively. In FIGS. 1A to 1C, the firstvertical axis represents I_(d) (A), the second vertical axis representsfield-effect mobility (μFE) (cm²/Vs), and the horizontal axis representsV_(g) (V). Note that the field-effect mobility was measured when V_(d)was 20 V.

As shown in FIGS. 1A to 1C, when the deposition condition of the oxidesemiconductor film is varied, I_(d)-V_(g) characteristics of thetransistors have different tendencies. In particular, there aredifferences between the shapes of the mobility curves of thefield-effect mobilities of the transistors.

From the shapes of the mobility curves of Samples A1 to A3 shown inFIGS. 1A to 1C, the minimum values and the maximum values of thefield-effect mobilities in the saturation regions of the transistors andthe values each obtained by subtracting the minimum value from themaximum value are calculated. Here, the saturation region of thetransistor is in a range where V_(g) is greater than or equal to 3 V andless than or equal to 10 V. A gate voltage in this range is generallyused for applications such as display.

In Sample A1, the minimum value of the field-effect mobility in thesaturation region of the transistor is 9.8 cm²/Vs and the maximum valuethereof is 28.3 cm²/Vs. That is, a difference between the minimum valueand the maximum value of the field-effect mobility in the saturationregion of the transistor of Sample A1 is 18.5 cm²/Vs. In Sample A2, theminimum value of the field-effect mobility in the saturation region ofthe transistor is 23.3 cm²/Vs and the maximum value thereof is 51.1cm²/Vs. That is, a difference between the minimum value and the maximumvalue of the field-effect mobility in the saturation region of thetransistor of Sample A2 is 27.8 cm²/Vs. In Sample A3, the minimum valueof the field-effect mobility in the saturation region of the transistoris 55.8 cm²/Vs and the maximum value thereof is 67.0 cm²/Vs. That is, adifference between the minimum value and the maximum value of thefield-effect mobility in the saturation region of the transistor ofSample A3 is 11.2 cm²/Vs.

In other words, in Sample A1, the minimum value of the field-effectmobility in the saturation region of the transistor is lower than themaximum value of the field-effect mobility by approximately 65.3%. InSample A2, the minimum value of the field-effect mobility in thesaturation region of the transistor is lower than the maximum value ofthe field-effect mobility by approximately 54.4%. In Sample A3, theminimum value of the field-effect mobility in the saturation region ofthe transistor is lower than the maximum value of the field-effectmobility by approximately 16.7%. As described above, Sample A3 in whichthe transistor of one embodiment of the present invention is formed hascharacteristics that the minimum value of the field-effect mobility inthe saturation region of the transistor is lower than the maximum valueof the field-effect mobility by 30% or lower, preferably 20% or lower.

In this manner, Sample A3 in which the transistor of one embodiment ofthe present invention is formed has characteristics that a differencebetween the minimum value and the maximum value of the field-effectmobility in the saturation region of the transistor is less than orequal to 15 cm²/Vs, which is extremely small. In addition, Sample A3 hashigh field-effect mobility in a low V_(g) region (e.g., a region whereV_(g) is greater than 0 V and less than or equal to 5 V). Whentransistors having such characteristics are used as transistors forpixels of an organic EL display, for example, high current drivecapability and high reliability can be obtained.

<1-3. Examination of Shape of Mobility Curve by Device Simulation>

There is a difference between the shapes of the mobility curves of thefield-effect mobilities of the transistors shown in FIGS. 1A to 1C;thus, the shapes of mobility curves were examined by device simulation.

In the device simulation, as factors which determine the shape of themobility curve, three factors were assumed: 1. Temperature dependence ofmobility; 2. Donor density distribution in channel region; and 3.Density of shallow defect states in oxide semiconductor film.

[1. Temperature Dependence of Mobility]

In a transistor including an oxide semiconductor film, the field-effectmobility is increased rapidly due to self-heating. The temperaturedependence of electron mobility (μ_(n)) of the oxide semiconductor filmis represented by the following formula (5).

$\begin{matrix}\lbrack {{Formula}\mspace{14mu} 5} \rbrack & \; \\{\mu_{n} = {\mu_{n\; 300}( \frac{T_{L}}{300} )}^{1.5}} & (5)\end{matrix}$

In the formula (5), μ_(n300) represents electron mobility of the oxidesemiconductor film at room temperature and T_(L) represents latticetemperature. As shown in the formula (5), the field-effect mobility ofthe transistor including the oxide semiconductor film increases inproportion to approximately the temperature T to the power of 1.5.

[2. Donor Density Distribution in Channel Region]

The transistors of the fabricated Sample A1 to A3 have different donordensity distributions in channel regions because the depositionconditions of the oxide semiconductor films are varied. In other words,the transistors of Samples A1 to A3 have different effective channellengths.

Here, the effective channel lengths of the transistors of Samples A1 toA3 are described with reference to FIG. 5.

FIG. 5 is a schematic view illustrating a concept of an effectivechannel length of a transistor.

In FIG. 5, GE, GI, and OS refer to a gate electrode, a gate insulatingfilm, and an oxide semiconductor film, respectively. In the oxidesemiconductor film, an n-type region is formed. The effective channellength (L_(eff)) of the transistor is represented by the followingformula (6).

[Formula 6]

L _(eff) =L _(g)−2ΔL  (6)

In the formula (6), L_(g) represents a gate length and ΔL represents areduction width of a channel length.

The effective channel length of the transistor can be obtained bytransmission line model (TLM) analysis, for example.

In the following description, a model in which a donor density isgradually decreased from an n-type region to a channel region is assumedon the basis of the above-described effective channel length. That is,donors are decreased toward the channel region in accordance with theGaussian distribution. FIGS. 6A to 6C show schematic views illustratingdonor densities of Samples A1 to A3. FIGS. 6A, 6B, and 6C illustrate adonor density of Sample A1, a donor density of Sample A2, and a donordensity of Sample A3, respectively.

In FIGS. 6A to 6C, GE, GI, and OS refer to a gate electrode, a gateinsulating film, and an oxide semiconductor film, respectively. In theoxide semiconductor films illustrated in FIGS. 6A to 6C, a region wherea donor density is higher than or equal to 5×10¹⁸ cm⁻³ is shown in grayand a region where a donor density is lower than or equal to 1×10¹⁶ cm⁻³is shown in black.

From the results shown in FIGS. 6A to 6C, the effective channel lengthsin Samples A1, A2, and A3 are estimated to be 2.0 μm, 1.2 μm, and 0.8μm, respectively. In other words, ΔL of Sample A1, ΔL of Sample A2, andΔL of Sample A3 are estimated to be 0 μm, 0.4 μm, and 0.6 μm,respectively.

[3. Density of Shallow Defect States in Oxide Semiconductor Film]

Next, a density of shallow defect states (also referred to as sDOS) inan oxide semiconductor film is described. The sDOS of an oxidesemiconductor film can be estimated from electrical characteristics of atransistor including the oxide semiconductor film. In the descriptionbelow, the density of interface states of the transistor was measured.In addition, a method for estimating subthreshold leakage current inconsideration of the density of interface states and the number ofelectrons trapped by the interface states, N_(trap) is described.

The number of electrons trapped by the interface state, N_(trap), can bemeasured by comparing drain current-gate voltage (I_(d)-V_(g)) of thetransistor that was actually measured and drain current-gate voltage(I_(d)-V_(g)) characteristics that was calculated.

FIG. 7 illustrates ideal I_(d)-V_(g) characteristics obtained bycalculation and the actually measured I_(d)-V_(g) characteristics of thetransistor when a source voltage V_(s) is 0 V and a drain voltage V_(d)is 0.1 V. Note that only values more than or equal to 1×10⁻¹³ A at whichdrain voltage I_(d) can be easily measured were plotted among themeasurement results of the transistor.

A change of the drain current I_(d) with respect to the gate voltageV_(g) is more gradual in the actually measured I_(d)-V_(g)characteristics than in the ideal I_(d)-V_(g) characteristics obtainedby calculation. This is probably because an electron is trapped by ashallow interface state positioned near energy at the bottom of theconduction band (represented as Ec). In this measurement, the density ofinterface surface N_(it) can be estimated more accurately inconsideration of the number of electrons (per unit area and unit energy)trapped by a shallow interface state, N_(trap), with use of the Fermidistribution function.

First, a method for evaluating the number of electrons trapped by aninterface trap state, N_(trap), by using schematic I_(d)-V_(g)characteristics illustrated in FIG. 8 is described. The dashed lineindicates ideal I_(d)-V_(g) characteristics without trap state and isobtained by the calculation. On the dashed line, a change in gatevoltage V_(g) when the drain current changes from I_(d) 1 to I_(d) 2 isrepresented by ΔV_(id). The solid line indicates the actually measuredI_(d)-V_(g) characteristics. On the solid line, a change in gate voltageV_(g) when the drain current changes from I_(d) 1 to I_(d) 2 isrepresented by ΔV_(ex). The potential at the target interface when thedrain current is I_(d) 1, the potential at the target interface when thedrain current is I_(d) 2, and the amount of change are represented byφ_(it1), φ_(it2), and Δφ_(it), respectively.

The slope of the actually measured values is smaller than that of thecalculated values in FIG. 8, which indicates that ΔV_(ex) is alwayslarger than ΔV_(id). Here, a difference between ΔV_(ex) and ΔV_(id)corresponds to a potential difference that is needed for trapping of anelectron in a shallow interface state. Therefore, ΔQ_(trap) which theamount of change in charge due to trapped electrons can be expressed bythe following formula (7).

[Formula 7]

ΔQ _(trap) =−C _(tg)(ΔV _(ex) −ΔV _(id))  (7)

C_(tg) is combined capacitance of an insulator and a semiconductor perunit area. In addition, ΔQ_(trap) can be expressed by the formula (8) byusing the number of trapped electrons N_(trap) (per unit area and perunit energy). Note that q represents elementary charge.

[Formula 8]

ΔQ _(trap) =−qN _(trap)Δφ_(it)  (8)

Simultaneously solving the formulae (7) and (8) gives the formula (9).

[Formula 9]

−C _(tg)(ΔV _(ex) −ΔV _(id))=−qN _(trap)Δφ_(it)  (9)

Then, taking the limit zero of Δφ_(it) in the formula (9) gives theformula (10).

$\begin{matrix}\lbrack {{Formula}\mspace{14mu} 10} \rbrack & \; \\{N_{trap} = {{\frac{C_{tg}}{q}{\lim\limits_{{\Delta \; \varphi_{it}}->0}( {\frac{\Delta \; V_{ex}}{\Delta \; \varphi_{d}} - \frac{\Delta \; V_{id}}{\Delta \; \varphi_{it}}} )}} = {C_{tg}( {\frac{\partial V_{ex}}{\partial\varphi_{it}} - \frac{\partial V_{id}}{\partial\varphi_{it}}} )}}} & (10)\end{matrix}$

In other words, the number of electrons trapped by an interface surface,N_(trap), can be estimated by using the ideal I_(d)-V_(g)characteristics, the actually measured I_(d)-V_(g) characteristics, andthe formula (10). Note that the relationship between the drain currentand the potential at the interface surface can be obtained bycalculation with the device simulator described above.

The relationship between the number of electrons N_(trap) per unit areaand per unit energy and the density of interface surface N_(it) isexpressed by the formula (11).

$\begin{matrix}\lbrack {{Formula}\mspace{14mu} 11} \rbrack & \; \\{N_{trap} = {\frac{\partial}{\partial\varphi_{it}}{\int_{- \infty}^{\infty}{{N_{it}(E)}{f(E)}{dE}}}}} & (11)\end{matrix}$

Here, f(E) is Fermi distribution function. The N_(trap) obtained fromthe formula (10) is fitted with the formula (11) to determine N_(it).The conduction characteristics including I_(d)<0.1 pA can be obtained bythe device simulator to which the N_(it) is set.

The actually measured I_(d)-V_(g) characteristics in FIG. 7 is appliedto the formula (10) and the results of extracting N_(trap) are plottedas white circles in FIG. 9. The vertical axis in FIG. 9 represents Fermienergy Ef at the bottom of the conduction band Ec of a semiconductor.The maximum value is positioned on the dashed line just under Ec. Whentail distribution of the formula (12) is assumed as N_(it) of theformula (11), N_(trap) can be fitted well like the dashed line in FIG.9. As a result, the peak value N_(ta)=1.67×10¹³ cm⁻² eV⁻¹ and thecharacteristic width W_(ta)=0.105 eV are obtained as the fittingparameters.

$\begin{matrix}\lbrack {{Formula}\mspace{14mu} 12} \rbrack & \; \\{{N_{it}(E)} = {N_{ta}{\exp \lbrack \frac{E - E_{c}}{W_{ta}} \rbrack}}} & (12)\end{matrix}$

FIGS. 10A and 10B show the inverse calculation results of I_(d)-V_(g)characteristics by feeding back the obtained fitting curve of interfacestate to the calculation using the device simulator. FIG. 10A shows thecalculated I_(d)-V_(g) characteristics when the drain voltage V_(d) is0.1 V and 1.8V and the actually measured I_(d)-V_(g) characteristicswhen the drain voltage V_(d) is 0.1 V and 1.8V. FIG. 10B is a graph inwhich the drain current I_(d) is a logarithm in FIG. 10A.

The curve obtained by the calculation substantially matches with theplot of the actually measured values, which suggests that the calculatedvalues and the measured values are highly reproducible. Accordingly, theabove method is quite appropriate as a method for calculating thedensity of shallow defect states.

[Calculation Results of Mobility Curve]

The sDOS in the oxide semiconductor film influences the mobility curveof the field-effect mobility. In particular, in the vicinity of thethreshold voltage, the shape of the mobility curve is changed becauseelectrons are trapped by the sDOS. The sDOS in the oxide semiconductorfilm is represented by the product of N_(ta) and W_(ta) in the formula(12) and the thickness of the oxide semiconductor film (t_(OS)). Then,the mobility curve was calculated on the basis of the formula (12).Table 1 shows parameters used for the calculation.

TABLE 1 Structure L length 2 μm W width 3 μm S/D electrode Material Cu —Work function 4.6 eV Thickness 110 μm Directly under n+ 5.00E+18 cm⁻³S/D and entire Loff region Passivation film Material SiON — Relative 3.9— permittivity ε Thickness 400 nm Material SiN — Relative 7.5 —permittivity ε Thickness 50 nm Upper gate Material W — electrode Workfunction 5.0 — Thickness 110 nm Upper GI Material SiON — Relative 3.9 —permittivity ε Thickness 150 nm OS Composition IGZO (4:2:4.1) — formulaElectron affinity 4.4 eV Eg 3.0 eV Relative 15 — permittivity ε Donordensity 6.60E−09 cm⁻³ Electron mobility 15 cm²/Vs Hole mobility 0.01cm²/Vs Nc 5.00E+18 cm⁻³ Nv 5.00E+18 cm⁻³ Thermal 0.014 W/cmKconductivity Thickness 40 nm Lower GI Material SiON — Relative 3.9 —permittivity ε Thickness 50 nm Material SiN — Relative 7.5 —permittivity ε Thickness 400 — Lower gate Material W — electrode Workfunction 5.0 — Thickness 110 nm

In this embodiment, the mobility curve in the case where the value ofW_(ta) was varied was calculated. FIG. 11 shows the shapes of themobility curves with different values of W_(ta). In FIG. 11, N_(ta) is2.5×10¹⁹ cm⁻³ eV⁻¹ and ΔL is 0. In addition, there were seven conditionswhere W_(ta) was 0.015 eV, 0.02 eV, 0.025 eV, 0.03 eV, 0.035 eV, 0.04eV, and 0.045 eV.

As shown in FIG. 11, as the value of W_(ta) is smaller, that is, as theenergy width of the sDOS is narrower, the mobility curve rises moresteeply. In addition, it is found that as the energy width of the sDOSis narrower, the peak value of the mobility curve is shifted from thehigh V_(g) side to the low V_(g) side and reduced.

Next, on the basis of donor density distributions of Samples A1 to A3illustrated in FIGS. 6A to 6C and the shapes of the mobility curvesshown in FIG. 11, the shapes of the mobility curves of modelscorresponding to Samples A1 to A3 were calculated. FIG. 12 showscalculation results of the mobility curves.

FIG. 12 shows the calculation results of the mobility curves of modelscorresponding to Samples A1 to A3. In Sample A1, N_(ta) is 3.0×10¹⁹ cm⁻³eV⁻¹, ΔL is 0, and W_(ta) is 0.045 eV. In Sample A2, N_(ta) is 3.0×10¹⁹cm⁻³ eV⁻¹, ΔL is 0.4 μm, and W_(ta) is 0.035 eV. In Sample A3, N_(ta) is2.5×10¹⁹ cm⁻³ eV⁻¹, ΔL is 0.6 μm, and W_(ta) is 0.025 eV.

It can be thought that FIG. 12 shows results substantially reflectingthe shapes of the mobility curves of Samples A1 to A3 shown in FIGS. 1Ato 1C.

As described above, it is indicated that the sDOS greatly influences theshape of the mobility curve of the field-effect mobility of thetransistor. Thus, Samples A1 to A3 described above may have differentvalues of sDOS in the oxide semiconductor films.

Then, to measure sDOS in the oxide semiconductor films of Samples A1 toA3, Samples B1 to B3 were fabricated. Samples B1 to B3 were differentfrom Samples A1 to A3 only in the size of the transistor. Samples B1,B2, and B3 were fabricated using the same methods as those of SamplesA1, A2, and A3, respectively.

FIG. 13 shows results of sDOS of Samples B1 to B3. The size of thetransistor in each of Samples B1 to B3 was L/W=6 μm/50 μm.

As shown in FIG. 13, the highest sDOS in the oxide semiconductor filmwas observed from Sample B1, followed by Sample B2 and then Sample B3.That is, it is found that the highest sDOS in the oxide semiconductorfilm was observed from Sample A1, followed by Sample A2 and then SampleA3 and the results of device simulation that is shown above are valid.

Furthermore, in each of Samples B1 to B3, the peak value of sDOS islower than 5×10¹² cm⁻² eV⁻¹, which indicates that Samples B1 to B3 eachhave extremely low sDOS. The peak value of sDOS in the oxidesemiconductor film is preferably lower than 2.5×10¹² cm⁻² eV⁻¹, furtherpreferably lower than 1.5×10¹² cm⁻² eV⁻¹, and still further preferablylower than 1.0×10¹² cm⁻² eV⁻¹.

In this manner, when sDOS in the oxide semiconductor film is reduced,the mobility curve can rise steeply. In addition, the peak value of themobility curve on the high V_(g) side can be shifted to the low V_(g)side and reduced. That is, when sDOS in the oxide semiconductor film isreduced, the mobility curve of the field-effect mobility of thetransistor including the oxide semiconductor film can rise steeply andthe saturation of the mobility curve can be improved.

<1-4. Components of Transistor>

Next, details of the components of the transistor in FIGS. 4A to 4C willbe described.

[Substrate]

The substrate 102 can be formed using a material having heat resistancehigh enough to withstand heat treatment in the manufacturing process.

Specifically, non-alkali glass, soda-lime glass, potash glass, crystalglass, quartz, sapphire, or the like can be used. Alternatively, aninorganic insulating film may be used. Examples of the inorganicinsulating film include a silicon oxide film, a silicon nitride film, asilicon oxynitride film, and an aluminum oxide film.

The non-alkali glass may have a thickness of greater than or equal to0.2 mm and less than or equal to 0.7 mm, for example. The non-alkaliglass may be polished to obtain the above thickness.

As the non-alkali glass, a large-area glass substrate having any of thefollowing sizes can be used: the 6th generation (1500 mm×1850 mm), the7th generation (1870 mm×2200 mm), the 8th generation (2200 mm×2400 mm),the 9th generation (2400 mm×2800 mm), and the 10th generation (2950mm×3400 mm). Thus, a large-sized display device can be manufactured.

Alternatively, as the substrate 102, a single-crystal semiconductorsubstrate or a polycrystalline semiconductor substrate made of siliconor silicon carbide, a compound semiconductor substrate made of silicongermanium or the like, an SOI substrate, or the like may be used.

For the substrate 102, an inorganic material such as a metal may beused. Examples of the inorganic material such as a metal includestainless steel and aluminum.

Alternatively, for the substrate 102, an organic material such as aresin, a resin film, or plastic may be used. Examples of the resin filminclude polyester, polyolefin, polyamide (e.g., nylon or aramid),polyimide, polycarbonate, polyurethane, an acrylic resin, an epoxyresin, polyethylene terephthalate (PET), polyethylene naphthalate (PEN),polyether sulfone (PES), and a resin having a siloxane bond such assilicone.

For the substrate 102, a composite material of an inorganic material andan organic material may be used. Examples of the composite materialinclude a resin film to which a metal plate or a thin glass plate isbonded, a resin film into which a fibrous or particulate metal or afibrous or particulate glass is dispersed, and an inorganic materialinto which a fibrous or particulate resin is dispersed.

The substrate 102 can at least support films or layers formed thereoveror thereunder and may be one or more of an insulating film, asemiconductor film, and a conductive film.

[First Insulating Film]

The insulating film 104 can be formed by a sputtering method, a CVDmethod, an evaporation method, a pulsed laser deposition (PLD) method, aprinting method, a coating method, or the like as appropriate. Forexample, the insulating film 104 can be formed to have a single-layerstructure or stacked-layer structure of an oxide insulating film and/ora nitride insulating film. To improve the properties of the interfacewith the oxide semiconductor film 108, at least a region of theinsulating film 104 which is in contact with the oxide semiconductorfilm 108 is preferably formed using an oxide insulating film. When theinsulating film 104 is formed using an oxide insulating film from whichoxygen is released by heating, oxygen contained in the insulating film104 can be moved to the oxide semiconductor film 108 by heat treatment.

The thickness of the insulating film 104 can be greater than or equal to50 nm, greater than or equal to 100 nm and less than or equal to 3000nm, or greater than or equal to 200 nm and less than or equal to 1000nm. By increasing the thickness of the insulating film 104, the amountof oxygen released from the insulating film 104 can be increased, andinterface states at the interface between the insulating film 104 andthe oxide semiconductor film 108 and oxygen vacancies included in thechannel region 108 i of the oxide semiconductor film 108 can be reduced.

For example, the insulating film 104 can be formed to have asingle-layer structure or stacked-layer structure of a silicon oxidefilm, a silicon oxynitride film, a silicon nitride oxide film, a siliconnitride film, an aluminum oxide film, a hafnium oxide film, a galliumoxide film, a Ga—Zn oxide film, or the like. In this embodiment, theinsulating film 104 has a stacked-layer structure of a silicon nitridefilm and a silicon oxynitride film. With the insulating film 104 havingsuch a layered structure including a silicon nitride film as a lowerlayer and a silicon oxynitride film as an upper layer, oxygen can beefficiently introduced into the oxide semiconductor film 108.

[Oxide Semiconductor Film]

The oxide semiconductor film 108 is described in detail in Embodiment 2.

[Second Insulating Film]

The insulating film 110 has a function of supplying oxygen to the oxidesemiconductor film 108, particularly to the channel region 108 i. Theinsulating film 110 can be formed to have a single-layer structure or astacked-layer structure of an oxide insulating film or a nitrideinsulating film, for example. To improve the interface properties withthe oxide semiconductor film 108, a region which is in the insulatingfilm 110 and in contact with the oxide semiconductor film 108 ispreferably formed using at least an oxide insulating film. For example,a silicon oxide film, a silicon oxynitride film, a silicon nitride oxidefilm, or a silicon nitride film may be used as the insulating film 110.

The thickness of the insulating film 110 can be greater than or equal to5 nm and less than or equal to 400 nm, greater than or equal to 5 nm andless than or equal to 300 nm, or greater than or equal to 10 nm and lessthan or equal to 250 nm.

It is preferable that the insulating film 110 have few defects andtypically have as few signals observed by electron spin resonance (ESR)spectroscopy as possible. Examples of the signals include a signal dueto an E′ center observed at a g-factor of 2.001. Note that the E′ centeris due to the dangling bond of silicon. As the insulating film 110, asilicon oxide film or a silicon oxynitride film whose spin density of asignal due to the E′ center is lower than or equal to 3×10¹⁷ spins/cm³and preferably lower than or equal to 5×10¹⁶ spins/cm³ may be used.

In addition to the above-described signal, a signal due to nitrogendioxide (NO₂) might be observed in the insulating film 110. The signalis divided into three signals according to the N nuclear spin; a firstsignal, a second signal, and a third signal. The first signal isobserved at a g-factor of greater than or equal to 2.037 and less thanor equal to 2.039. The second signal is observed at a g-factor ofgreater than or equal to 2.001 and less than or equal to 2.003. Thethird signal is observed at a g-factor of greater than or equal to 1.964and less than or equal to 1.966.

It is suitable to use an insulating film whose spin density of a signaldue to nitrogen dioxide (NO₂) is higher than or equal to 1×10¹⁷spins/cm³ and lower than 1×10¹⁸ spins/cm³ as the insulating film 110,for example.

Note that a nitrogen oxide (NO_(x)) such as nitrogen dioxide (NO₂) formsa state in the insulating film 110. The state is positioned in theenergy gap of the oxide semiconductor film 108. Thus, when nitrogenoxide (NO_(x)) is diffused to the interface between the insulating film110 and the oxide semiconductor film 108, an electron might be trappedby the state on the insulating film 110 side. As a result, the trappedelectron remains in the vicinity of the interface between the insulatingfilm 110 and the oxide semiconductor film 108, leading to a positiveshift of the threshold voltage of the transistor. Accordingly, the useof a film with a low nitrogen oxide content as the insulating film 110can reduce a shift of the threshold voltage of the transistor.

As an insulating film that releases a small amount of nitrogen oxide(NO_(x)), for example, a silicon oxynitride film can be used. Thesilicon oxynitride film releases more ammonia than nitrogen oxide(NO_(x)) in thermal desorption spectroscopy (TDS); the typical releasedamount of ammonia is greater than or equal to 1×10¹⁸ cm⁻³ and less thanor equal to 5×10¹⁹ cm⁻³. Note that the released amount of ammonia is thetotal amount of ammonia released by heat treatment in a range of 50° C.to 650° C. or 50° C. to 550° C. in TDS.

Since nitrogen oxide (NO_(x)) reacts with ammonia and oxygen in heattreatment, the use of an insulating film that releases a large amount ofammonia reduces nitrogen oxide (NO_(x)).

Note that in the case where the insulating film 110 is analyzed by SIMS,nitrogen concentration in the film is preferably lower than or equal to6×10²⁰ atoms/cm³.

The insulating film 110 may be formed using a high-k material such ashafnium silicate (HfSiO_(x)), hafnium silicate containing nitrogen(HfSi_(x)O_(y)N_(z)), hafnium aluminate containing nitrogen(HfAl_(x)O_(y)N_(z)), or hafnium oxide. The use of such a high-kmaterial enables a reduction in gate leakage current of a transistor.

[Third Insulating Film]

The insulating film 116 contains nitrogen or hydrogen. The insulatingfilm 116 may contain fluorine. As the insulating film 116, for example,a nitride insulating film can be used. The nitride insulating film canbe formed using silicon nitride, silicon nitride oxide, siliconoxynitride, silicon nitride fluoride, silicon fluoronitride, or thelike. The hydrogen concentration in the insulating film 116 ispreferably higher than or equal to 1×10²² atoms/cm³. Furthermore, theinsulating film 116 is in contact with the source region 108 s and thedrain region 108 d of the oxide semiconductor film 108. Thus, theconcentration of an impurity (nitrogen or hydrogen) in the source region108 s and the drain region 108 d in contact with the insulating film 116is increased, leading to an increase in the carrier density of thesource region 108 s and the drain region 108 d.

[Fourth Insulating Film]

As the insulating film 118, an oxide insulating film can be used.Alternatively, a layered film of an oxide insulating film and a nitrideinsulating film can be used as the insulating film 118. The insulatingfilm 118 can be formed using, for example, silicon oxide, siliconoxynitride, silicon nitride oxide, aluminum oxide, hafnium oxide,gallium oxide, or Ga—Zn oxide.

Furthermore, the insulating film 118 preferably functions as a barrierfilm against hydrogen, water, and the like from the outside.

The thickness of the insulating film 118 can be greater than or equal to30 nm and less than or equal to 500 nm, or greater than or equal to 100nm and less than or equal to 400 nm.

[Fifth Insulating Film]

The insulating film 122 has an insulating property and is formed usingan inorganic material or an organic material. Examples of the inorganicmaterial include silicon oxide, silicon oxynitride, silicon nitrideoxide, silicon nitride, aluminum oxide, and aluminum nitride. Examplesof the organic material include photosensitive resin materials such asan acrylic resin and a polyimide resin.

[Conductive Film]

The conductive films 106, 112, 120 a, and 120 b can be formed by asputtering method, a vacuum evaporation method, a PLD method, a thermalCVD method, or the like. As each of the conductive films 106, 112, 120a, and 120 b, a conductive metal film, a conductive film that has afunction of reflecting visible light, or a conductive film having afunction of transmitting visible light may be used.

A material containing a metal element selected from aluminum, gold,platinum, silver, copper, chromium, tantalum, titanium, molybdenum,tungsten, nickel, iron, cobalt, palladium, and manganese can be used forthe metal film having conductivity. Alternatively, an alloy containingany of the above metal elements may be used.

For the metal film having conductivity, specifically a two-layerstructure in which a copper film is stacked over a titanium film, atwo-layer structure in which a copper film is stacked over a titaniumnitride film, a two-layer structure in which a copper film is stackedover a tantalum nitride film, a three-layer structure in which atitanium film, a copper film, and a titanium film are stacked in thisorder, or the like may be used. In particular, a conductive filmcontaining a copper element is preferably used because the resistancecan be reduced. As an example of the conductive film containing a copperelement, an alloy film containing copper and manganese is given. Thealloy film is favorable because it can be processed by a wet etchingmethod.

Note that a tantalum nitride film is preferably used for the conductivefilms 106, 112, 120 a, and 120 b. A tantalum nitride film hasconductivity and a high barrier property against copper or hydrogen.Because a tantalum nitride film releases little hydrogen from itself, itcan be favorably used as a metal film in contact with the oxidesemiconductor film 108 or a metal film in the vicinity of the oxidesemiconductor film 108.

As the conductive film having conductivity, a conductive macromoleculeor a conductive polymer may be used.

For the conductive film having a function of reflecting visible light, amaterial containing a metal element selected from gold, silver, copper,and palladium can be used. In particular, a conductive film containing asilver element is preferably used because reflectance of visible lightcan be improved.

For the conductive film having a function of transmitting visible light,a material containing an element selected from indium, tin, zinc,gallium, and silicon can be used. Specifically, an In oxide, a Zn oxide,an In—Sn oxide (also referred to as ITO), an In—Sn—Si oxide (alsoreferred to as ITSO), an In—Zn oxide, an In—Ga—Zn oxide, or the like canbe used.

As the conductive film having a function of transmitting visible light,a film containing graphene or graphite may be used. The film containinggraphene can be formed in the following manner: a film containinggraphene oxide is formed and is reduced. As a reducing method, a methodwith application of heat, a method using a reducing agent, or the likecan be employed.

The conductive films 112, 120 a, and 120 b can be formed by electrolessplating. As a material that can be deposited by electroless plating, forexample, one or more elements selected from Cu, Ni, Al, Au, Sn, Co, Ag,and Pd can be used. It is further favorable to use Cu or Ag because theresistance of the conductive film can be reduced.

When the conductive film is formed by electroless plating, a diffusionprevention film may be formed under the conductive film to preventcomponent elements of the conductive film from diffusing outward. A seedlayer that can make the conductive film grow may be formed between thediffusion prevention film and the conductive film. The diffusionprevention film can be formed by sputtering, for example. For thediffusion prevention film, a tantalum nitride film or a titanium nitridefilm can be used, for example. The seed layer can be formed byelectroless plating. For the seed layer, a material similar to thematerial for the conductive film that can be formed by electrolessplating can be used.

Note that an oxide semiconductor typified by an In—Ga—Zn oxide may beused for the conductive film 112. The oxide semiconductor can have ahigh carrier density when nitrogen or hydrogen is supplied from theinsulating film 116. In other words, the oxide semiconductor functionsas an oxide conductor (OC). Accordingly, the oxide semiconductor can beused for a gate electrode.

The conductive film 112 can have, for example, a single-layer structureof an oxide conductor (OC), a single-layer structure of a metal film, ora stacked-layer structure of an oxide conductor (OC) and a metal film.

Note that it is suitable that the conductive film 112 has a single-layerstructure of a light-shielding metal film or a stacked-layer structureof an oxide conductor (OC) and a light-shielding metal film because thechannel region 108 i formed under the conductive film 112 can beshielded from light. In the case where the conductive film 112 has astacked-layer structure of an oxide semiconductor or an oxide conductor(OC) and a light-shielding metal film, formation of a metal film (e.g.,a titanium film or a tungsten film) over the oxide semiconductor or theoxide conductor (OC) produces any of the following effects: theresistance of the oxide semiconductor or the oxide conductor (OC) isreduced by the diffusion of the constituent element of the metal film tothe oxide semiconductor or oxide conductor (OC) side, the resistance isreduced by damage (e.g., sputtering damage) during the deposition of themetal film, and the resistance is reduced when oxygen vacancies areformed by the diffusion of oxygen in the oxide semiconductor or theoxide conductor (OC) to the metal film.

The thickness of the conductive films 106, 112, 120 a, and 120 b can begreater than or equal to 30 nm and less than or equal to 500 nm, orgreater than or equal to 100 nm and less than or equal to 400 nm.

<1-5. Structure Example 2 of Transistor>

Next, structures of transistors different from the structure of thetransistor illustrated in FIGS. 4A to 4C will be described withreference to FIGS. 14A and 14B, FIGS. 15A and 15B, and FIGS. 16A and16B.

FIGS. 14A and 14B are cross-sectional views of a transistor 100B. FIGS.15A and 15B are cross-sectional views of a transistor 100C. FIGS. 16Aand 16B are cross-sectional views of a transistor 100D. The top views ofthe transistors 100B, 100C, and 100D are not illustrated because theyare similar to the top view of the transistor 100A in FIG. 4A.

The transistor 100B illustrated in FIGS. 14A and 14B is different fromthe transistor 100A in the layered structure of the conductive film 112,the shape of the conductive film 112, and the shape of the insulatingfilm 110.

The conductive film 112 in the transistor 100B includes a conductivefilm 112_1 over the insulating film 110 and the conductive film 112_2over the conductive film 112_1. For example, an oxide conductive film isused as the conductive film 112_1, so that excess oxygen can be added tothe insulating film 110. The oxide conductive film can be formed by asputtering method in an atmosphere containing an oxygen gas. As theoxide conductive film, an oxide film containing indium and tin, an oxidefilm containing tungsten and indium, an oxide film containing tungsten,indium, and zinc, an oxide film containing titanium and indium, an oxidefilm containing titanium, indium, and tin, an oxide film containingindium and zinc, an oxide film containing silicon, indium, and tin, oran oxide film containing indium, gallium, and zinc can be used, forexample.

As illustrated in FIG. 14B, the conductive film 112_2 is connected tothe conductive film 106 through the opening 143. By forming the opening143 after a conductive film to be the conductive film 112_1 is formed,the shape illustrated in FIG. 14B can be obtained. In the case where anoxide conductive film is used as the conductive film 112_1, thestructure in which the conductive film 112_2 is connected to theconductive film 106 can decrease the contact resistance between theconductive film 112 and the conductive film 106.

The conductive film 112 and the insulating film 110 in the transistor100B have a tapered shape. More specifically, the lower edge portion ofthe conductive film 112 is positioned outside the upper edge portion ofthe conductive film 112. The lower edge portion of the insulating film110 is positioned outside the upper edge portion of the insulating film110. In addition, the lower edge portion of the conductive film 112 isformed in substantially the same position as that of the upper edgeportion of the insulating film 110.

It is suitable that the conductive film 112 and the insulating film 110have tapered shapes as in the transistor 100B, because the coverage withthe insulating film 116 can be high as compared with the case of thetransistor 100A in which the conductive film 112 and the insulating film110 are rectangular.

The other components of the transistor 100B are similar to those of thetransistor 100A described above and have similar effects.

The transistor 100C illustrated in FIGS. 15A and 15B is different fromthe transistor 100A in the layered structure of the conductive film 112,the shape of the conductive film 112, and the shape of the insulatingfilm 110.

The conductive film 112 in the transistor 100C includes the conductivefilm 112_1 over the insulating film 110 and the conductive film 112_2over the conductive film 112_1. A lower end portion of the conductivefilm 112_1 is located outward from a lower end portion of the conductivefilm 112_2. The conductive film 112_1, the conductive film 112_2, andthe insulating film 110 can be formed by processing with the same mask.To obtain the above structure, for example, the conductive film 112_2 isprocessed by a wet etching method and the conductive film 112_1 and theinsulating film 110 are processed by a dry etching method.

With the structure of the transistor 100C, regions 108 f are formed inthe oxide semiconductor film 108 in some cases. The regions 108 f areformed between the channel region 108 i and the source region 108 s andbetween the channel region 108 i and the drain region 108 d.

The regions 108 f function as high-resistance regions or low-resistanceregions. The high-resistance regions have the same level of resistanceas the channel region 108 i and do not overlap with the conductive film112 functioning as a gate electrode. In the case where the regions 108 fare high-resistance regions, the regions 108 f function as offsetregions. To suppress a decrease in the on-state current of thetransistor 100C, the regions 108 f functioning as offset regions mayeach have a length of 1 μm or less in the channel length (L) direction.

The low-resistance regions have a resistance that is lower than that ofthe channel region 108 i and higher than that of the source region 108 sand the drain region 108 d. In the case where the regions 108 f arelow-resistance regions, the regions 108 f function as lightly dopeddrain (LDD) regions. The regions 108 f functioning as LDD regions canrelieve an electric field in the drain region, thereby reducing a changein the threshold voltage of the transistor due to the electric field inthe drain region.

Note that in the case where the regions 108 f serve as LDD regions, forexample, the regions 108 f are formed by supplying one or more ofnitrogen, hydrogen, and fluorine from the insulating film 116 to theregions 108 f or by adding an impurity element from above the conductivefilm 112_1 using the insulating film 110 and the conductive film 112_1as a mask so that the impurity element is added to the oxidesemiconductor film 108 through the conductive film 112_1 and theinsulating film 110.

As illustrated in FIG. 15B, the conductive film 112_2 is connected tothe conductive film 106 through the opening 143.

The other components of the transistor 100C are similar to those of thetransistor 100A described above and have similar effects.

The transistor 100D illustrated in FIGS. 16A and 16B is different fromthe transistor 100A in the layered structure of the conductive film 112,the shape of the conductive film 112, and the shape of the insulatingfilm 110.

The conductive film 112 in the transistor 100D includes the conductivefilm 112_1 over the insulating film 110 and the conductive film 112_2over the conductive film 112_1. A lower end portion of the conductivefilm 112_1 is located outward from a lower end portion of the conductivefilm 112_2. Furthermore, a lower end portion of the insulating film 110is located outward from the lower end portion of the conductive film112_1. The conductive film 112_1, the conductive film 112_2, and theinsulating film 110 can be formed by processing with the same mask. Toobtain the above structure, for example, the conductive film 112_2 andthe conductive film 112_1 are processed by a wet etching method and theinsulating film 110 is processed by a dry etching method.

Like the transistor 100C, regions 108 f are formed in the oxidesemiconductor film 108 in the transistor 100D, in some cases. Theregions 108 f are formed between the channel region 108 i and the sourceregion 108 s and between the channel region 108 i and the drain region108 d.

As illustrated in FIG. 16B, the conductive film 112_2 is connected tothe conductive film 106 through the opening 143.

The other components of the transistor 100D are similar to those of thetransistor 100A described above and have similar effects.

<1-6. Structure Example 3 of Transistor>

Next, structures of transistors different from the structure of thetransistor 100A illustrated in FIGS. 4A to 4C will be described withreference to FIGS. 17A and 17B, FIGS. 18A and 18B, FIGS. 19A and 19B,FIGS. 20A and 20B, and FIGS. 21A and 21B.

FIGS. 17A and 17B are cross-sectional views of a transistor 100E. FIGS.18A and 18B are cross-sectional views of a transistor 100F. FIGS. 19Aand 19B are cross-sectional views of a transistor 100G. FIGS. 20A and20B are cross-sectional views of a transistor 100H. FIGS. 21A and 21Bare cross-sectional views of a transistor 100J. The top views of thetransistors 100E, 100F, 100G, 100H, and 100J are not illustrated becausethey are similar to the top view of the transistor 100A in FIG. 4A.

The transistors 100E, 100F, 100G, 100H, and 100J are different from theabove-described the transistor 100A in the structure of the oxidesemiconductor film 108. The other components are similar to those of thetransistor 100A and have similar effects.

The oxide semiconductor film 108 of the transistor 100E illustrated inFIGS. 17A and 17B includes an oxide semiconductor film 108_1 over theinsulating film 104, an oxide semiconductor film 108_2 over the oxidesemiconductor film 108_1, and an oxide semiconductor film 108_3 over theoxide semiconductor film 108_2. The channel region 108 i, the sourceregion 108 s, and the drain region 108 d each have a three-layerstructure of the oxide semiconductor film 108_1, the oxide semiconductorfilm 108_2, and the oxide semiconductor film 108_3.

The oxide semiconductor film 108 of the transistor 100F illustrated inFIGS. 18A and 18B includes the oxide semiconductor film 108_2 over theinsulating film 104, and the oxide semiconductor film 108_3 over theoxide semiconductor film 108_2. The channel region 108 i, the sourceregion 108 s, and the drain region 108 d each have a two-layer structureof the oxide semiconductor film 108_2 and the oxide semiconductor film108_3.

The oxide semiconductor film 108 of the transistor 100G illustrated inFIGS. 19A and 19B includes the oxide semiconductor film 108_1 over theinsulating film 104, and the oxide semiconductor film 108_2 over theoxide semiconductor film 108_1. The channel region 108 i, the sourceregion 108 s, and the drain region 108 d each have a two-layer structureof the oxide semiconductor film 108_1 and the oxide semiconductor film108_2.

The oxide semiconductor film 108 of the transistor 100H illustrated inFIGS. 20A and 20B includes the oxide semiconductor film 108_1 over theinsulating film 104, the oxide semiconductor film 108_2 over the oxidesemiconductor film 108_1, and the oxide semiconductor film 108_3 overthe oxide semiconductor film 108_2. The channel region 108 i has athree-layer structure of the oxide semiconductor film 108_1, the oxidesemiconductor film 108_2, and the oxide semiconductor film 108_3. Thesource region 108 s and the drain region 108 d each have a two-layerstructure of the oxide semiconductor film 108_1 and the oxidesemiconductor film 108_2. Note that in the cross section of thetransistor 100H in the channel width (W) direction, the oxidesemiconductor film 108_3 covers side surfaces of the oxide semiconductorfilm 108_1 and the oxide semiconductor film 108_2.

The oxide semiconductor film 108 of the transistor 100J illustrated inFIGS. 21A and 21B includes the oxide semiconductor film 108_2 over theinsulating film 104, and the oxide semiconductor film 108_3 over theoxide semiconductor film 108_2. The channel region 108 i has a two-layerstructure of the oxide semiconductor film 108_2 and the oxidesemiconductor film 108_3. The source region 108 s and the drain region108 d each have a single-layer structure of the oxide semiconductor film108_2. Note that in the cross section of the transistor 100J in thechannel width (W) direction, the oxide semiconductor film 108_3 coversside surfaces of the oxide semiconductor film 108_2.

A side surface of the channel region 108 i in the channel width (W)direction or a region in the vicinity of the side surface is easilydamaged by processing, resulting in a defect (e.g., oxygen vacancy), oreasily contaminated by an impurity attached thereto. Therefore, evenwhen the channel region 108 i is substantially intrinsic, stress such asan electric field applied thereto activates the side surface of thechannel region 108 i in the channel width (W) direction or the region inthe vicinity of the side surface and turns it into a low-resistance(n-type) region easily. Moreover, if the side surface of the channelregion 108 i in the channel width (W) direction or the region in thevicinity of the side surface is an n-type region, a parasitic channelmay be formed because the n-type region serves as a carrier path.

Thus, in the transistor 100H and the transistor 100J, the channel region108 i has a stacked-layer structure and side surfaces of the channelregion 108 i in the channel width (W) direction are covered with onelayer of the stacked layers. With such a structure, defects on or in thevicinity of the side surfaces of the channel region 108 i can besuppressed or adhesion of an impurity to the side surfaces of thechannel region 108 i or to regions in the vicinity of the side surfacescan be reduced.

[Band Structure]

Here, a band structure of the insulating film 104, the oxidesemiconductor films 108_1, 108_2, and 108_3, and the insulating film110, a band structure of the insulating film 104, the oxidesemiconductor films 108_2 and 108_3, and the insulating film 110, and aband structure of the insulating film 104, the oxide semiconductor films108_1 and 108_2, and the insulating film 110 will be described withreference to FIGS. 22A to 22C. Note that FIGS. 22A to 22C are each aband structure of the channel region 108 i.

FIG. 22A shows an example of a band structure in the thickness directionof a stack including the insulating film 104, the oxide semiconductorfilms 108_1, 108_2, and 108_3, and the insulating film 110. FIG. 22Bshows an example of a band structure in the thickness direction of astack including the insulating film 104, the oxide semiconductor films108_2 and 108_3, and the insulating film 110. FIG. 22C shows an exampleof a band structure in the thickness direction of a stack including theinsulating film 104, the oxide semiconductor films 108_1 and 108_2, andthe insulating film 110. For easy understanding, the band structuresshow the conduction band minimum (E_(c)) of the insulating film 104, theoxide semiconductor films 108_1, 108_2, and 108_3, and the insulatingfilm 110.

In the band structure of FIG. 22A, a silicon oxide film is used as eachof the insulating films 104 and 110, an oxide semiconductor film formedusing a metal oxide target whose atomic ratio of In to Ga and Zn is1:3:2 is used as the oxide semiconductor film 108_1, an oxidesemiconductor film formed using a metal oxide target whose atomic ratioof In to Ga and Zn is 4:2:4.1 is used as the oxide semiconductor film108_2, and an oxide semiconductor film formed using a metal oxide targetwhose atomic ratio of In to Ga and Zn is 1:3:2 is used as the oxidesemiconductor film 108_3.

In the band structure of FIG. 22B, a silicon oxide film is used as eachof the insulating films 104 and 110, an oxide semiconductor film formedusing a metal oxide target whose atomic ratio of In to Ga and Zn is4:2:4.1 is used as the oxide semiconductor film 108_2, and an oxidesemiconductor film formed using a metal oxide target whose atomic ratioof In to Ga and Zn is 1:3:2 is used as the oxide semiconductor film108_3.

In the band structure of FIG. 22C, a silicon oxide film is used as eachof the insulating films 104 and 110, an oxide semiconductor film formedusing a metal oxide target whose atomic ratio of In to Ga and Zn is1:3:2 is used as the oxide semiconductor film 108_1, and an oxidesemiconductor film formed using a metal oxide target whose atomic ratioof In to Ga and Zn is 4:2:4.1 is used as the oxide semiconductor film108_2.

As illustrated in FIG. 22A, the conduction band minimum gradually variesbetween the oxide semiconductor films 108_1, 108_2, and 108_3. Asillustrated in FIG. 22B, the conduction band minimum gradually variesbetween the oxide semiconductor films 108_2 and 108_3. As illustrated inFIG. 22C, the conduction band minimum gradually varies between the oxidesemiconductor films 108_1 and 108_2. In other words, the conduction bandminimum is continuously changed or continuously connected. To obtainsuch a band structure, there exists no impurity, which forms a defectstate such as a trap center or a recombination center, at the interfacebetween the oxide semiconductor films 108_1 and 108_2 or the interfacebetween the oxide semiconductor films 108_2 and 108_3.

To form a continuous junction between the oxide semiconductor films108_1, 108_2, and 108_3, it is necessary to form the films successivelywithout exposure to the air with a multi-chamber deposition apparatus(sputtering apparatus) provided with a load lock chamber.

With the band structure of FIG. 22A, FIG. 22B, or FIG. 22C, the oxidesemiconductor film 108_2 serves as a well, and a channel region isformed in the oxide semiconductor film 108_2 in the transistor with thestacked-layer structure.

By providing the oxide semiconductor films 108_1 and 108_3, the oxidesemiconductor film 108_2 can be distanced away from defect states.

In addition, the defect states might be more distant from the vacuumlevel than the conduction band minimum (E_(c)) of the oxidesemiconductor film 108_2 functioning as a channel region, so thatelectrons are likely to be accumulated in the defect states. When theelectrons are accumulated in the defect states, the electrons becomenegative fixed electric charge, so that the threshold voltage of thetransistor is shifted in the positive direction. Therefore, it ispreferable that the defect states be closer to the vacuum level than theconduction band minimum (E_(c)) of the oxide semiconductor film 108_2.Such a structure inhibits accumulation of electrons in the defectstates. As a result, the on-state current and the field-effect mobilityof the transistor can be increased.

The conduction band minimum of each of the oxide semiconductor films108_1 and 108_3 is closer to the vacuum level than that of the oxidesemiconductor film 108_2. A typical difference between the conductionband minimum of the oxide semiconductor film 108_2 and the conductionband minimum of each of the oxide semiconductor films 108_1 and 108_3 is0.15 eV or more or 0.5 eV or more and 2 eV or less or 1 eV or less. Thatis, the difference between the electron affinity of each of the oxidesemiconductor films 108_1 and 108_3 and the electron affinity of theoxide semiconductor film 108_2 is 0.15 eV or more or 0.5 eV or more and2 eV or less or 1 eV or less.

In such a structure, the oxide semiconductor film 108_2 serves as a mainpath of a current. In other words, the oxide semiconductor film 108_2serves as a channel region, and the oxide semiconductor films 108_1 and108_3 serve as oxide insulating films. It is preferable that the oxidesemiconductor films 108_1 and 108_3 each include one or more metalelements constituting a part of the oxide semiconductor film 108_2 inwhich a channel region is formed. With such a structure, interfacescattering hardly occurs at the interface between the oxidesemiconductor film 108_1 and the oxide semiconductor film 108_2 or atthe interface between the oxide semiconductor film 108_2 and the oxidesemiconductor film 108_3. Thus, the transistor can have highfield-effect mobility because the movement of carriers is not hinderedat the interface.

To prevent each of the oxide semiconductor films 108_1 and 108_3 fromfunctioning as part of a channel region, a material having sufficientlylow conductivity is used for the oxide semiconductor films 108_1 and108_3. Thus, the oxide semiconductor films 108_1 and 108_3 can bereferred to as oxide insulating films for such properties and/orfunctions. Alternatively, a material that has a smaller electronaffinity (a difference between the vacuum level and the conduction bandminimum) than the oxide semiconductor film 108_2 and has a difference inthe conduction band minimum from the oxide semiconductor film 108_2(band offset) is used for the oxide semiconductor films 108_1 and 108_3.Furthermore, to inhibit generation of a difference in threshold voltagedue to the value of the drain voltage, it is preferable to form theoxide semiconductor films 108_1 and 108_3 using a material whoseconduction band minimum is closer to the vacuum level than that of theoxide semiconductor film 108_2. For example, a difference between theconduction band minimum of the oxide semiconductor film 108_2 and theconduction band minimum of each of the oxide semiconductor films 108_1and 108_3 is preferably greater than or equal to 0.2 eV, furtherpreferably greater than or equal to 0.5 eV.

It is preferable that the oxide semiconductor films 108_1 and 108_3 nothave a spinel crystal structure. This is because if the oxidesemiconductor films 108_1 and 108_3 have a spinel crystal structure,constituent elements of the conductive films 120 a and 120 b might bediffused into the oxide semiconductor film 108_2 at the interfacebetween the spinel crystal structure and another region. Note that eachof the oxide semiconductor films 108_1 and 108_3 is preferably a CAAC-OSfilm described later, in which case a higher blocking property againstconstituent elements of the conductive films 120 a and 120 b, forexample, copper elements, can be obtained.

Although the example where an oxide semiconductor film formed using ametal oxide target whose atomic ratio of In to Ga and Zn is 1:3:2, isused as each of the oxide semiconductor films 108_1 and 108_3 isdescribed in this embodiment, one embodiment of the present invention isnot limited thereto. For example, an oxide semiconductor film formedusing a metal oxide target whose atomic ratio of In to Ga and Zn is1:1:1, 1:1:1.2, 1:3:4, 1:3:6, 1:4:5, 1:5:6, or 1:10:1 may be used aseach of the oxide semiconductor films 108_1 and 108_3. Alternatively,oxide semiconductor films formed using a metal oxide target whose atomicratio of Ga to Zn is 10:1 may be used as the oxide semiconductor films108_1 and 108_3. It is suitable that an oxide semiconductor film formedusing a metal oxide target whose atomic ratio of In to Ga and Zn is1:1:1 is used as the oxide semiconductor film 108_2 and an oxidesemiconductor film formed using a metal oxide target whose atomic ratioof Ga to Zn is 10:1 is used as each of the oxide semiconductor films108_1 and 108_3 because the difference between the conduction bandminimum of the oxide semiconductor film 108_2 and the conduction bandminimum of the oxide semiconductor film 108_1 or 108_3 can be 0.6 eV ormore.

When the oxide semiconductor films 108_1 and 108_3 are formed using ametal oxide target whose atomic ratio of In to Ga and Zn is 1:1:1, theatomic ratio of In to Ga and Zn in the oxide semiconductor films 108_1and 108_3 might be 1:β1:β2 (0<β1≦2, 0<β2≦2). When the oxidesemiconductor films 108_1 and 108_3 are formed using a metal oxidetarget whose atomic ratio of In to Ga and Zn is 1:3:4, the atomic ratioof In to Ga and Zn in the oxide semiconductor films 108_1 and 108_3might be 1:β3:β4 (1≦β3≦5, 2≦β4≦6). When the oxide semiconductor films108_1 and 108_3 are formed using a metal oxide target whose atomic ratioof In to Ga and Zn is 1:3:6, the atomic ratio of In to Ga and Zn in theoxide semiconductor films 108_1 and 108_3 might be 1:β5:β6 (1≦β5≦5,4≦β6≦8).

At least part of this embodiment can be implemented in combination withany of the other embodiments described in this specification asappropriate.

Embodiment 2

In this embodiment, the composition, the structure, and the like of anoxide semiconductor film that can be used in one embodiment of thepresent invention are described with reference to FIGS. 23A to 23C, FIG.24, FIG. 25, FIGS. 26A to 26C, FIGS. 27A to 27C, FIGS. 28A to 28C, FIGS.29A to 29C, FIGS. 30A to 30C, FIGS. 31A to 31C, FIGS. 32A and 32B, FIG.33, FIG. 34, FIGS. 35A1 to 35C2, FIG. 36, FIGS. 37A1 to 37C2, and FIGS.38A to 38C.

<2-1. Composition of Oxide Semiconductor Film>

First, the composition of an oxide semiconductor film is described.

An oxide semiconductor film preferably contains at least indium or zinc.In particular, indium and zinc are preferably contained. In addition,aluminum, gallium, yttrium, tin, or the like is preferably contained.Furthermore, one or more elements selected from boron, silicon,titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum,cerium, neodymium, hafnium, tantalum, tungsten, magnesium, and the likemay be contained.

Here, the case where an oxide semiconductor film contains indium, anelement M, and zinc is considered. The element M is aluminum, gallium,yttrium, tin, or the like. Alternatively, the element M can be boron,silicon, titanium, iron, nickel, germanium, zirconium, molybdenum,lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, magnesium, orthe like. Note that two or more of the above elements may be used incombination as the element M.

First, preferred ranges of the atomic ratio of indium, the element M,and zinc contained in an oxide semiconductor film according to anembodiment of the present invention are described with reference toFIGS. 23A to 23C. Note that the proportion of oxygen atoms is not shown.The terms of the atomic ratio of indium, the element M, and zinccontained in the oxide semiconductor film are denoted by [In], [M], and[Zn], respectively.

In FIGS. 23A to 23C, broken lines indicate a line where the atomic ratio[In]:[M]:[Zn] is (1+α):(1−α):1, where −1≦α≦1, a line where the atomicratio [In]:[M]:[Zn] is (1+α):(1−α):2, a line where the atomic ratio[In]:[M]:[Zn] is (1+α):(1−α):3, a line where the atomic ratio[In]:[M]:[Zn] is (1+α):(1−α):4, and a line where the atomic ratio[In]:[M]:[Zn] is (1+α):(1−α):5.

Dashed-dotted lines indicate a line where the atomic ratio [In]:[M]:[Zn]is 1:1:β, where β≧0, a line where the atomic ratio [In]:[M]:[Zn] is1:2:β, a line where the atomic ratio [In]:[M]:[Zn] is 1:3:β, a linewhere the atomic ratio [In]:[M]:[Zn] is 1:4:β, a line where the atomicratio [In]:[M]:[Zn] is 2:1:β, and a line where the atomic ratio[In]:[M]:[Zn] is 5:1:β.

Dashed-double dotted lines is a line indicating the atomic ratio[In]:[M]:[Zn]=(1+γ):2:(1−γ) (−1≦γ≦1). The oxide semiconductor film shownin FIGS. 23A to 23C with an atomic ratio of [In]:[M]:[Zn]=0:2:1 or anatomic ratio that is in the neighborhood thereof is likely to have aspinel crystal structure.

FIGS. 23A and 23B show examples of the preferred ranges of the atomicratio of indium, the element M, and zinc contained in an oxidesemiconductor film in one embodiment of the present invention.

FIG. 24 shows an example of the crystal structure of InMZnO₄ whoseatomic ratio [In]:[M]:[Zn] is 1:1:1. The crystal structure shown in FIG.24 is InMZnO₄ observed from a direction parallel to a b-axis. Note thata metal element in a layer that contains M, Zn, and oxygen (hereinafter,this layer is referred to as an “(M,Zn) layer”) in FIG. 24 representsthe element M or zinc. In that case, the proportion of the element M isthe same as the proportion of zinc. The element M and zinc can bereplaced with each other, and their arrangement is random.

InMZnO₄ has a layered crystal structure (also referred to as a layeredstructure) and includes one layer that contains indium and oxygen(hereinafter referred to as an In layer) for every two (M,Zn) layersthat contain the element M, zinc, and oxygen, as shown in FIG. 24.

Indium and the element M can be replaced with each other. Thus, when theelement M in the (M,Zn) layer is replaced with indium, the layer canalso be referred to as an (In,M,Zn) layer. In that case, a layeredstructure that contains one In layer for every two (In,M,Zn) layers isobtained.

An oxide whose atomic ratio [In]:[M]:[Zn] is 1:1:2 has a layeredstructure that contains one In layer for every three (M,Zn) layers. Inother words, if [Zn] is higher than [In] and [M], the proportion of the(M,Zn) layer to the In layer becomes higher when the oxide iscrystallized.

Note that in the case where the number of (M,Zn) layers with respect toone In layer is not an integer in the oxide, the oxide might have aplurality of kinds of layered structures where the number of (M,Zn)layers with respect to one In layer is an integer. For example, in thecase of [In]:[M]:[Zn]=1:1:1.5, the oxide may have a mix of a layeredstructure including one In layer for every two (M,Zn) layers and alayered structure including one In layer for every three (M,Zn) layers.

For example, in the case where the oxide is formed with a sputteringapparatus, a film having an atomic ratio deviated from the atomic ratioof a target is formed. In particular, [Zn] in the film might be smallerthan [Zn] in the target depending on the substrate temperature indeposition.

A plurality of phases (e.g., two phases or three phases) exist in theoxide in some cases. For example, with an atomic ratio [In]:[M]:[Zn]that is close to 0:2:1, two phases of a spinel crystal structure and alayered crystal structure are likely to exist. In addition, with anatomic ratio [In]:[M]:[Zn] that is close to 1:0:0, two phases of abixbyite crystal structure and a layered crystal structure are likely toexist. In the case where a plurality of phases exist in the oxide, agrain boundary might be formed between different crystal structures.

In addition, the oxide containing indium in a higher proportion can havehigh carrier mobility (electron mobility).

In contrast, when the indium content and the zinc content in an oxidebecome lower, carrier mobility becomes lower. Thus, with atomic ratiosof [In]:[M]:[Zn]=0:1:0 and in the vicinity thereof (e.g., a region C inFIG. 23C), insulation performance becomes better.

Accordingly, an oxide in one embodiment of the present inventionpreferably has an atomic ratio represented by a region A in FIG. 23A.With the atomic ratio, a layered structure with high carrier mobilityand a few grain boundaries is easily obtained.

A region B in FIG. 23B represents an atomic ratio of [In]:[M]:[Zn]=4:2:3to 4:2:4.1 and the vicinity thereof. The vicinity includes an atomicratio of [In]:[M]:[Zn]=5:3:4. An oxide with an atomic ratio representedby the region B is an excellent oxide that has particularly highcrystallinity and high carrier mobility.

In the case where the oxide semiconductor film is an In-M-Zn oxide, itis preferable that the atomic ratio of metal elements of a sputteringtarget used for forming a film of the In-M-Zn oxide satisfy In≧M andZn≧M. As the atomic ratio of metal elements in such a sputtering target,In:M:Zn=1:1:1, In:M:Zn=1:1:1.2, In:M:Zn=2:1:1.5, In:M:Zn=2:1:2.3,In:M:Zn=2:1:3, In:M:Zn=3:1:2, In:M:Zn=4:2:4.1, and In:M:Zn=5:1:7 arepreferable. Note that the atomic ratio of metal elements in the formedoxide semiconductor film may vary from the above atomic ratio of metalelements in the sputtering target within a range of approximately ±40%.For example, when a sputtering target with an atomic ratio of In to Gaand Zn of 4:2:4.1 is used, an atomic ratio of In to Ga and Zn in theformed oxide semiconductor film may be 4:2:3 or in the neighborhood of4:2:3.

In this specification and the like, “neighborhood” means a range of ±1,preferably ±0.5 with respect to the proportion of atoms of the metalelement M. For example, in the case where the oxide semiconductor filmhas a composition in the neighborhood of In:Ga:Zn=4:2:3, the proportionof Ga may be greater than or equal to 1 and less than or equal to 3(1≦Ga≦3) and the proportion of Zn is greater than or equal to 2 and lessthan or equal to 4 (2≦Zn≦4), preferably the proportion of Ga is greaterthan or equal to 1.5 and less than or equal to 2.5 (1.5≦Ga≦2.5) and theproportion of Zn is greater than or equal to 2 and less than or equal to4 (2≦Zn≦4).

A condition where an oxide semiconductor film forms a layered structureis not uniquely determined by an atomic ratio. There is a difference inthe degree of difficulty in forming a layered structure among atomicratios. Even with the same atomic ratio, whether a layered structure isformed or not depends on a formation condition. Thus, the illustratedregions each represent an atomic ratio with which an oxide semiconductorfilm has a layered structure, and boundaries of the regions A to C arenot clear.

<2-2. Carrier Density of Oxide Semiconductor Film>

Next, the carrier density of an oxide semiconductor film will bedescribed below.

Examples of a factor affecting the carrier density of an oxidesemiconductor film include oxygen vacancy (V_(O)) and impurities in theoxide semiconductor film.

As the amount of oxygen vacancy in the oxide semiconductor filmincreases, the density of defect states increases when hydrogen isbonded to the oxygen vacancy (this state is also referred to as V_(O)H).The density of defect states also increases with an increase in theamount of impurity in the oxide semiconductor film. Hence, the carrierdensity of an oxide semiconductor film can be controlled by controllingthe density of defect states in the oxide semiconductor film.

A transistor using the oxide semiconductor film in a channel region willbe described below.

The carrier density of the oxide semiconductor film is preferablyreduced in order to inhibit the negative shift of the threshold voltageof the transistor or reduce the off-state current of the transistor. Inorder to reduce the carrier density of the oxide semiconductor film, theimpurity concentration in the oxide semiconductor film is reduced sothat the density of defect states can be reduced. In this specificationand the like, a state with a low impurity concentration and a lowdensity of defect states is referred to as a highly purified intrinsicor substantially highly purified intrinsic state. The carrier density ofa highly purified intrinsic oxide semiconductor film is lower than8×10¹⁵ cm⁻³, preferably lower than 1×10¹¹ cm⁻³, and further preferablylower than 1×10¹⁰ cm⁻³ and is higher than or equal to 1×10⁻⁹ cm⁻³.

In contrast, the carrier density of the oxide semiconductor film ispreferably increased in order to improve the on-state current of thetransistor or improve the field-effect mobility of the transistor. Inorder to increase the carrier density of the oxide semiconductor film,the impurity concentration or the density of defect states in the oxidesemiconductor film is slightly increased. Alternatively, the bandgap ofthe oxide semiconductor film is preferably narrowed. For example, anoxide semiconductor film that has a slightly high impurity concentrationor a slightly high density of defect states in the range where afavorable on/off ratio is obtained in the I_(d)-V_(g) characteristics ofthe transistor can be regarded as substantially intrinsic. Furthermore,an oxide semiconductor film that has a high electron affinity and thushas a narrow bandgap so as to increase the density of thermally excitedelectrons (carriers) can be regarded as substantially intrinsic. Notethat a transistor using an oxide semiconductor film with higher electronaffinity has lower threshold voltage.

The carrier density of a substantially intrinsic oxide semiconductorfilm is preferably higher than or equal to 1×10⁵ cm⁻³ and lower than1×10¹⁸ cm⁻³, further preferably higher than or equal to 1×10⁷ cm⁻³ andlower than or equal to 1×10¹⁷ cm⁻³, still further preferably higher thanor equal to 1×10⁹ cm⁻³ and lower than or equal to 5×10¹⁶ cm⁻³, yetfurther preferably higher than or equal to 1×10¹⁰ cm⁻³ and lower than orequal to 1×10¹⁶ cm⁻³, and yet still preferably higher than or equal to1×10¹¹ cm⁻³ and lower than or equal to 1×10¹⁵ cm⁻³.

The use of the substantially intrinsic oxide semiconductor film mayimprove the reliability of a transistor. Here, the reason for theimprovement in the reliability of a transistor which uses the oxidesemiconductor film in its channel region is described with reference toFIG. 25. FIG. 25 is an energy band diagram of the transistor which usesthe oxide semiconductor film in its channel region.

In FIG. 25, GE, GI, OS, and SD refer to a gate electrode, a gateinsulating film, an oxide semiconductor film, and a source/drainelectrode, respectively. In other words, FIG. 25 shows an example ofenergy bands of the gate electrode, the gate insulating film, the oxidesemiconductor film, and the source/drain electrode in contact with theoxide semiconductor film.

In FIG. 25, a silicon oxide film and an In—Ga—Zn oxide are used as thegate insulating film and the oxide semiconductor film, respectively. Thetransition level (∈f) of a defect that might be formed in the siliconoxide film is assumed to be formed at a position approximately 3.1 eVaway from the conduction band minimum of the gate insulating film.Furthermore, the Fermi level (Ef) of the silicon oxide film at theinterface between the oxide semiconductor film and the silicon oxidefilm when the gate voltage (V_(g)) is 30 V is assumed to be formed at aposition approximately 3.6 eV away from the conduction band minimum ofthe gate insulating film. Note that the Fermi level of the silicon oxidefilm changes depending on the gate voltage. For example, the Fermi level(Ef) of the silicon oxide film at the interface between the oxidesemiconductor film and the silicon oxide film is lowered as the gatevoltage is increased. A white circle and x in FIG. 25 represent anelectron (carrier) and a defect state in the silicon oxide film,respectively.

As shown in FIG. 25, when thermal excitation of carriers occurs duringthe application of a gate voltage, the carriers are trapped by thedefect states (x in the diagram) and the charge state of each of thedefect states is changed from positive (“+”) to neutral (“0”). In otherwords, when the value obtained by adding the thermal excitation energyto the Fermi level (E_(f)) of the silicon oxide film becomes greaterthan the transition level (∈_(f)) of the defect, the charge state of thedefect states in the silicon oxide film is changed from positive toneutral, so that the threshold voltage of the transistor shifts in thepositive direction.

When an oxide semiconductor film with a different electron affinity isused, the Fermi level of the interface between the gate insulating filmand the oxide semiconductor film might be changed. When an oxidesemiconductor film with a higher electron affinity is used, theconduction band minimum of the gate insulating film becomes relativelyhigh at the interface between the gate insulating film and the oxidesemiconductor film or in the vicinity of the interface. In that case,the defect state (x in FIG. 25) which might be formed in the gateinsulating film also becomes relatively high, so that the energydifference between the Fermi level of the gate insulating film and theFermi level of the oxide semiconductor film is increased. The increasein energy difference leads to a reduction in the amount of chargetrapped in the gate insulating film. For example, a change in the chargestate of the defect states which might be formed in the silicon oxidefilm becomes smaller, so that a change in the threshold voltage of thetransistor by gate bias temperature (GBT) stress can be reduced.

Note that when the oxide semiconductor film is used for a channel regionof a transistor, carrier scattering or the like at a grain boundary canbe reduced; thus, the transistor can have high field-effect mobility. Inaddition, the transistor can have high reliability.

Charge trapped by the defect states in the oxide semiconductor filmtakes a long time to be released and may behave like fixed charge. Thus,the transistor in which a channel region is formed in the oxidesemiconductor film having a high density of defect states might haveunstable electrical characteristics.

To obtain stable electrical characteristics of the transistor, it iseffective to reduce the concentration of impurities in the oxidesemiconductor film. In order to reduce the concentration of impuritiesin the oxide semiconductor film, the concentration of impurities in afilm which is adjacent to the oxide semiconductor film is preferablyreduced. As examples of the impurities, hydrogen, nitrogen, alkalimetal, alkaline earth metal, iron, nickel, silicon, and the like aregiven.

Here, the influence of impurities in the oxide semiconductor film isdescribed.

When silicon or carbon that is one of Group 14 elements is contained inthe oxide semiconductor film, defect states are formed. Thus, theconcentration of silicon or carbon in the oxide semiconductor film andaround an interface with the oxide semiconductor film (measured bysecondary ion mass spectrometry (SIMS)) is set lower than or equal to2×10¹⁸ atoms/cm³, and preferably lower than or equal to 2×10¹⁷atoms/cm³.

When the oxide semiconductor film contains alkali metal or alkalineearth metal, defect states are formed and carriers are generated, insome cases. Thus, a transistor including an oxide semiconductor filmthat contains alkali metal or alkaline earth metal is likely to benormally-on. Therefore, it is preferable to reduce the concentration ofalkali metal or alkaline earth metal in the oxide semiconductor film.Specifically, the concentration of alkali metal or alkaline earth metalin the oxide semiconductor film measured by SIMS is set lower than orequal to 1×10¹⁸ atoms/cm³, and preferably lower than or equal to 2×10¹⁶atoms/cm³.

Hydrogen contained in an oxide semiconductor film reacts with oxygenbonded to a metal atom to be water, and thus causes an oxygen vacancy,in some cases. Due to entry of hydrogen into the oxygen vacancy, anelectron serving as a carrier is generated in some cases. Furthermore,in some cases, bonding of part of hydrogen to oxygen bonded to a metalatom causes generation of an electron serving as a carrier. Thus, atransistor including an oxide semiconductor film that contains hydrogenis likely to be normally-on. Accordingly, it is preferable that hydrogenin the oxide semiconductor film be reduced as much as possible.Specifically, the hydrogen concentration of the oxide semiconductor filmmeasured by SIMS is set lower than 1×10²⁰ atoms/cm³, preferably lowerthan 1×10¹⁹ atoms/cm³, further preferably lower than 5×10¹⁸ atoms/cm³,and still further preferably lower than 1×10¹⁸ atoms/cm³.

When an oxide semiconductor film with sufficiently reduced impurityconcentration is used for a channel formation region in a transistor,the transistor can have stable electrical characteristics.

The energy gap of the oxide semiconductor film is preferably 2 eV ormore or 2.5 eV or more.

The thickness of the oxide semiconductor film is greater than or equalto 3 nm and less than or equal to 200 nm, preferably greater than orequal to 3 nm and less than or equal to 100 nm, further preferablygreater than or equal to 3 nm and less than or equal to 60 nm.

<2-3. Structure of Oxide Semiconductor>

Next, a structure of an oxide semiconductor is described.

An oxide semiconductor is classified into a single-crystal oxidesemiconductor and a non-single-crystal oxide semiconductor. Examples ofthe non-single-crystal oxide semiconductor include a c-axis alignedcrystalline oxide semiconductor (CAAC-OS), a polycrystalline oxidesemiconductor, a nanocrystalline oxide semiconductor (nc-OS), anamorphous-like oxide semiconductor (a-like OS), and an amorphous oxidesemiconductor.

From another perspective, an oxide semiconductor is classified into anamorphous oxide semiconductor and a crystalline oxide semiconductor.Examples of the crystalline oxide semiconductor include a single-crystaloxide semiconductor, a CAAC-OS, a polycrystalline oxide semiconductor,and an nc-OS.

An amorphous structure is generally thought to be isotropic and have nonon-uniform structure, to be metastable and have no fixed atomicarrangement, to have a flexible bond angle, and to have a short-rangeorder but have no long-range order, for example.

In other words, a stable oxide semiconductor cannot be regarded as acompletely amorphous oxide semiconductor. Moreover, an oxidesemiconductor that is not isotropic (e.g., an oxide semiconductor thathas a periodic structure in a microscopic region) cannot be regarded asa completely amorphous oxide semiconductor. In contrast, an a-like OS,which is not isotropic, has an unstable structure that contains a void.Because of its instability, an a-like OS has physical properties similarto those of an amorphous oxide semiconductor.

[CAAC-OS]

First, a CAAC-OS is described.

A CAAC-OS is one of oxide semiconductors and has a plurality of c-axisaligned crystal parts (also referred to as pellets).

The CAAC-OS is an oxide semiconductor with high crystallinity. Entry ofimpurities, formation of defects, or the like might decrease thecrystallinity of an oxide semiconductor. This means that the CAAC-OS hasfew impurities and defects (e.g., oxygen vacancies).

Note that an impurity means an element other than the main components ofan oxide semiconductor, such as hydrogen, carbon, silicon, or atransition metal element. For example, an element (e.g., silicon) havingstronger bonding force to oxygen than a metal element constituting apart of an oxide semiconductor extracts oxygen from the oxidesemiconductor, which results in a disordered atomic arrangement andreduced crystallinity of the oxide semiconductor. A heavy metal such asiron or nickel, argon, carbon dioxide, or the like has a large atomicradius (or molecular radius), and thus disturbs the atomic arrangementof the oxide semiconductor and decreases crystallinity.

[nc-OS]

Next, an nc-OS is described.

Analysis of an nc-OS by XRD is described. When the structure of an nc-OSis analyzed by an out-of-plane method, a peak indicating orientationdoes not appear. That is, a crystal of an nc-OS does not haveorientation.

The nc-OS is an oxide semiconductor that has higher regularity than anamorphous oxide semiconductor. Thus, the nc-OS has a lower density ofdefect states than the a-like OS and the amorphous oxide semiconductor.Note that there is no regularity of crystal orientation betweendifferent pellets in the nc-OS. Therefore, the nc-OS has a higherdensity of defect states than the CAAC-OS in some cases.

[a-Like OS]

An a-like OS has a structure between the structure of an nc-OS and thestructure of an amorphous oxide semiconductor.

The a-like OS contains a void or a low-density region. The a-like OS hasan unstable structure because it contains a void.

The a-like OS has a lower density than the nc-OS and the CAAC-OS becauseit contains a void. Specifically, the density of the a-like OS is higherthan or equal to 78.6% and lower than 92.3% of the density of thesingle-crystal oxide semiconductor having the same composition. Thedensity of the nc-OS and the density of the CAAC-OS are each higher thanor equal to 92.3% and lower than 100% of the density of thesingle-crystal oxide semiconductor having the same composition. It isdifficult to deposit an oxide semiconductor having a density lower than78% of the density of the single-crystal oxide semiconductor.

For example, in the case of an oxide semiconductor whose atomic ratio ofIn to Ga and Zn is 1:1:1, the density of single-crystal InGaZnO₄ with arhombohedral crystal structure is 6.357 g/cm³. Accordingly, in the caseof the oxide semiconductor whose atomic ratio of In to Ga and Zn is1:1:1, the density of the a-like OS is higher than or equal to 5.0 g/cm³and lower than 5.9 g/cm³, for example. In the case of the oxidesemiconductor whose atomic ratio of In to Ga and Zn is 1:1:1, thedensity of the nc-OS and the density of the CAAC-OS are each higher thanor equal to 5.9 g/cm³ and lower than 6.3 g/cm³, for example.

In the case where an oxide semiconductor having a certain compositiondoes not exist in a single-crystal state, single-crystal oxidesemiconductors with different compositions are combined at an adequateratio, which makes it possible to calculate a density equivalent to thatof a single-crystal oxide semiconductor with the desired composition.The density of a single-crystal oxide semiconductor having the desiredcomposition may be calculated using a weighted average with respect tothe combination ratio of the single-crystal oxide semiconductors withdifferent compositions. Note that it is preferable to use as few kindsof single-crystal oxide semiconductors as possible to calculate thedensity.

As described above, oxide semiconductors have various structures andvarious properties. In the oxide semiconductor film of one embodiment ofthe present invention, two or more of an amorphous oxide semiconductor,an a-like OS, an nc-OS, and a CAAC-OS may be mixed. An example of such acase is described below.

The oxide semiconductor film of one embodiment of the present inventioncan include two kinds of crystal parts. That is, two kinds of crystalparts are mixed in the oxide semiconductor film. One is a crystal part(also referred to as a first crystal part) having orientation in thethickness direction (also referred to as a film-plane direction, or adirection perpendicular to a formation surface or a film surface), i.e.,a crystal part having c-axis alignment. The other is a crystal part(also referred to as a second crystal part) which does not have c-axisalignment and has random orientation.

Although crystal parts are divided into the two categories forsimplicity: the first crystal part having c-axis alignment and thesecond crystal part having no c-axis alignment, the first crystal partand the second crystal part cannot be distinguished from each other insome cases because there is not much difference in crystallinity,crystal size, and the like. That is, the oxide semiconductor film of oneembodiment of the present invention can be described without adistinction between the first crystal part and the second crystal part.

For example, the oxide semiconductor film of one embodiment of thepresent invention includes a plurality of crystal parts, and at leastone of the crystal parts may have c-axis alignment. Furthermore, in thecrystal parts existing in the film, the proportion of crystal partshaving no c-axis alignment may be higher than that of crystal partshaving c-axis alignment. For example, in a transmission electronmicroscope image of a cross section of the oxide semiconductor filmwhich is one embodiment of the present invention in the thicknessdirection, a plurality of crystal parts are observed and the secondcrystal parts having no c-axis alignment are observed at a higherproportion than the first crystal parts having c-axis alignment in somecases. In other words, the oxide semiconductor film of one embodiment ofthe present invention has a high proportion of second crystal partshaving no c-axis alignment.

When the oxide semiconductor film has a high proportion of secondcrystal parts having no c-axis alignment, the following effects can beobtained.

In the case where a source which supplies sufficient oxygen is providedin the vicinity of the oxide semiconductor film, the second crystal parthaving no c-axis alignment can serve as an oxygen diffusion path. Thus,in the case where a source which supplies sufficient oxygen is providedin the vicinity of the oxide semiconductor film, oxygen can be suppliedfrom the source to the first crystal part having c-axis alignmentthrough the second crystal part having no c-axis alignment. Accordingly,the amount of oxygen vacancy in the oxide semiconductor film can bereduced. When such an oxide semiconductor film is used as asemiconductor film of a transistor, high reliability and highfield-effect mobility can be obtained.

In the first crystal part, particular crystal planes are aligned in thethickness direction. Accordingly, when an X-ray diffraction (XRD)measurement is performed in a direction substantially perpendicular tothe top surface of the oxide semiconductor film including the firstcrystal parts, a diffraction peak derived from the first crystal partsis observed at a predetermined diffraction angle (2θ). However, evenwhen the oxide semiconductor film includes the first crystal parts, adiffraction peak is not sufficiently observed in some cases because ofx-rays scattering or increase in background due to a support substrate.Note that the higher the proportion of the first crystal parts in theoxide semiconductor film is, the higher the diffraction peak becomes;thus, the height (intensity) of the diffraction peak can be an indicatorof crystallinity of the oxide semiconductor film.

As an example of a method for evaluating crystallinity of the oxidesemiconductor film, electron diffraction can be given. For example, inthe case where an electron diffraction measurement is performed on across section of the oxide semiconductor film of one embodiment of thepresent invention and an electron diffraction pattern thereof isobserved, first regions including diffraction spots derived from thefirst crystal parts and second regions including diffraction spotsderived from the second crystal parts are observed.

The first regions including diffraction spots derived from the firstcrystal parts are derived from crystal parts having c-axis alignment.The second regions including diffraction spots derived from the secondcrystal parts are derived from crystal parts having no orientation orcrystal parts having random orientation. Therefore, different patternsare observed in accordance with the diameter of an electron beam, i.e.,the area of an observed region in some cases. Note that in thisspecification and the like, electron diffraction with an electron beamhaving a diameter of 1 nmφ to 100 nmφ inclusive is referred to asnanobeam electron diffraction (NBED).

Note that the crystallinity of the oxide semiconductor film of oneembodiment of the present invention may be evaluated by a methoddifferent from NBED. As examples of a method for evaluatingcrystallinity of the oxide semiconductor film, electron diffraction,x-ray diffraction, neutron diffraction, and the like can be given. Amongthe electron diffractions, transmission electron microscopy (TEM),scanning electron microscopy (SEM), convergent beam electron diffraction(CBED), selected-area electron diffraction (SAED), and the like can befavorably used in addition to the above NBED.

In NBED, a ring-like pattern is observed in a nanobeam electrondiffraction pattern obtained by using an electron beam having a largediameter (e.g., greater than or equal to 25 nmφ and less than or equalto 100 nmφ, or greater than or equal to 50 nmφ and less than or equal to100 nmφ). The ring-like pattern has luminance distribution in a radialdirection in some cases. On the other hand, in an electron diffractionpattern of NBED obtained by using an electron beam having a sufficientlysmall diameter (e.g., greater than or equal to 1 nmφ and less than orequal to 10 nmφ), a plurality of spots distributed in a circumferentialdirection (also referred to as θ direction) are observed at the positionof the ring-like pattern. That is, the ring-like pattern obtained byusing an electron beam having a large diameter is formed from anaggregate of the plurality of spots.

<2-4. Evaluation of Crystallinity of Oxide Semiconductor Film>

Three samples (Samples X1 to X3) each including an oxide semiconductorfilm were fabricated and the crystallinity of each of the samples wasevaluated. Three kinds of oxide semiconductor films were formed indifferent conditions. First, methods for fabricating Samples X1 to X3are described.

[Sample X1]

Sample X1 is a sample in which an approximately 100-nm-thick oxidesemiconductor film is formed over a glass substrate. The oxidesemiconductor film contains indium, gallium, and zinc. The oxidesemiconductor film used for Sample X1 was formed under the followingconditions: the substrate temperature was 170° C.; an argon gas with aflow rate of 140 sccm and an oxygen gas with a flow rate of 60 sccm wereintroduced into a chamber of the sputtering apparatus; the pressure wasset to 0.6 Pa; and an AC power of 2.5 kW was applied to a metal oxidetarget containing indium, gallium, and zinc (with an atomic ratio ofIn:Ga:Zn=4:2:4.1). Note that the oxygen flow rate percentage under theformation conditions for Sample X1 was 30%.

[Sample X2]

Sample X2 is a sample in which an approximately 100-nm-thick oxidesemiconductor film is formed over a glass substrate. The oxidesemiconductor film used for Sample X2 was formed under the followingconditions: the substrate temperature was 130° C.; and an argon gas witha flow rate of 180 sccm and an oxygen gas with a flow rate of 20 sccmwere introduced into a chamber of the sputtering apparatus. The oxygenflow rate percentage under the formation conditions for Sample X2 was10%. Note that the conditions other than the substrate temperature andthe oxygen flow rate percentage are the same as those for Sample X1.

[Sample X3]

Sample X3 is a sample in which an approximately 100-nm-thick oxidesemiconductor film is formed over a glass substrate. The oxidesemiconductor film used for Sample X3 was formed under the followingconditions: the substrate temperature was room temperature (R.T.); anargon gas with a flow rate of 180 sccm and an oxygen gas with a flowrate of 20 sccm were introduced into a chamber of the sputteringapparatus. The oxygen flow rate percentage under the formationconditions for Sample X3 was 10%. Note that the conditions other thanthe substrate temperature and the oxygen flow rate percentage are thesame as those for Sample X1.

The conditions for forming Samples X1 to X3 are shown in Table 2.

TABLE 2 Oxygen Substrate flow rate temperature Pressure percentageTarget [atomic ratio] [° C.] [Pa] [%] Sample X1 In:Ga:Zn = 4:2:4.1 1700.6 30 Sample X2 In:Ga:Zn = 4:2:4.1 130 0.6 10 Sample X3 In:Ga:Zn =4:2:4.1 R.T. 0.6 10

Next, the crystallinity of Samples X1 to X3 was evaluated. In thisembodiment, cross-sectional TEM observation, XRD measurement, andelectron diffraction were performed to evaluate crystallinity.

[Cross-Sectional TEM Observation]

FIGS. 26A to 26C, FIGS. 27A to 27C, and FIGS. 28A to 28C showcross-sectional TEM observation results of Samples X1 to X3. FIGS. 26Aand 26B are cross-sectional TEM images of Sample X1. FIGS. 27A and 27Bare cross-sectional TEM images of Sample X2. FIGS. 28A and 28B arecross-sectional TEM images of Sample X3.

FIG. 26C, FIG. 27C, and FIG. 28C are cross-sectional high resolutiontransmission electron microscope (HR-TEM) images of Sample X1, SampleX2, and Sample X3, respectively. The cross-sectional HR-TEM images maybe obtained with a spherical aberration corrector function. Thehigh-resolution TEM image obtained with a spherical aberration correctorfunction is particularly referred to as a Cs-corrected high-resolutionTEM image. The Cs-corrected high-resolution TEM image can be observedwith, for example, an atomic resolution analytical electron microscopeJEM-ARM200F manufactured by JEOL Ltd.

As shown in FIGS. 26A to 26C and FIGS. 27A to 27C, crystal parts inwhich atoms are aligned in a layered manner in the thickness directionare observed in Sample X1 and Sample X2. In particular, in HR-TEMimages, crystal parts in which atoms are aligned in a layered manner areeasily observed. As shown in FIGS. 28A to 28C, the state where atoms arealigned in a layered manner in the thickness direction is unlikely to beobserved in Sample X3.

[XRD Measurement]

Next, XRD measurement results of the samples will be described.

FIG. 29A, FIG. 30A, and FIG. 31A show XRD measurement results of SampleX1, Sample X2, and Sample X3, respectively.

The XRD measurement was conducted by a powder method (also referred toas a θ-2θ method) which is a kind of an out-of-plane method. Note thatin a θ-2θ method, X-ray diffraction intensity is measured while anincident angle of an X-ray is changed and the angle of a detector facingan X-ray source is equal to the incident angle. Note that agrazing-incidence XRD (GIXRD) method (also referred to as a thin filmmethod or a Seemann-Bohlin method) may be used. The GIXRD method is akind of an out-of-plane method for measuring X-ray diffraction intensityin which X-ray is incident at an angle approximately 0.40° from a filmsurface with use of a variable-angle detector. In FIG. 29A, FIG. 30A,and FIG. 31A, the vertical axis represents diffraction intensity inarbitrary unit and the horizontal axis represents the angle 2θ.

As shown in FIG. 29A and FIG. 30A, a peak of diffraction intensity isobserved at around 2θ=31° in each of Sample X1 and Sample X2. Incontrast, as shown in FIG. 31A, in Sample X3, a peak of diffractionintensity at around 2θ=31° is unlikely to be observed. Alternatively, apeak of diffraction intensity at around 2θ=31° is extremely small ordoes not exist.

The diffraction angle (at around 2θ=31°) at which the peak of thediffraction intensity was observed corresponds to a diffraction angle onthe (009) plane of the structure model of single crystal InGaZnO₄.Accordingly, the above peaks indicate that each of Samples X1 and X2includes a crystal part where the c-axes are aligned in the thicknessdirection (hereinafter also referred to as a crystal part having c-axisalignment or a first crystal part). Note that it is difficult todetermine, by XRD measurement, whether a crystal part having c-axisalignment is included in Sample X3.

[Electron Diffraction]

Next, electron diffraction measurement results of Samples X1 to X3 aredescribed below. In the electron diffraction measurement, an electrondiffraction pattern was obtained in such a manner that each of thesamples is irradiated with an electron beam incident in a directionperpendicular to its cross section. The electron-beam diameters were setto 1 nmφ and 100 nmφ.

In electron diffraction, as the diameter of an incident electron beam islarger and the thickness of sample is larger, information of the samplein the depth direction is likely to be shown in the electron diffractionpattern. Therefore, the information of local regions can be obtained byreducing not only the diameter of the electron beam but also thethickness of the sample in the depth direction. In contrast, when thethickness of the sample in the depth direction is too small (e.g., thethickness of the sample in the depth direction is less than or equal to5 nm), information of only submicroscopic region is obtained. Thus, anelectron diffraction pattern obtained when a crystal exists in thesubmicroscopic region is similar to an electron diffraction pattern of asingle crystal in some cases. When the aim is not to analyze thesubmicroscopic region, the thickness of the sample in the depthdirection is preferably greater than or equal to 10 nm and less than orequal to 100 nm, typically greater than or equal to 10 nm and less thanor equal to 50 nm.

FIGS. 29B and 29C show electron diffraction patterns of Sample X1. FIGS.30B and 30C show electron diffraction patterns of Sample X2. FIGS. 31Band 31C show electron diffraction patterns of Sample X3.

The contrast of the electron diffraction patterns shown in FIGS. 29B and29C, FIGS. 30B and 30C, and FIGS. 31B and 31C is adjusted for clarity.In FIGS. 29B and 29C, FIGS. 30B and 30C, and FIGS. 31B and 31C, thebrightest luminescent spot at the center of the pattern is derived fromthe incident electron beam and is the center of the electron diffractionpattern (also referred to as a direct spot or a transmitted wave).

As shown in FIG. 29B, when the diameter of the incident electron beam isset to 1 nmφ, a plurality of spots circumferentially distributed can beobserved. This indicates that the oxide semiconductor film contains aplurality of submicroscopic crystal parts having random surfaceorientation. As shown in FIG. 29C, when the diameter of the incidentelectron beam is set to 100 nmφ, the luminances of a sequence of aplurality of diffraction spots derived from these plurality of crystalparts are averaged to be a ring-like diffraction pattern. Two ring-likediffraction patterns with different radii are observed in FIG. 29C. Therings are referred to as a first ring and a second ring in ascendingorder of radius. It is observed that the luminance of the first ring ishigher than that of the second ring. In addition, two spots (referred toas first regions) with high luminance are observed at a positionoverlapping with the first ring.

The distance from the center to the first ring in a radial directionsubstantially corresponds to the distance from the center to adiffraction spot on the (009) plane of the structure model of singlecrystal InGaZnO₄ in a radical direction. The first regions arediffraction spots derived from c-axis alignment.

As shown in FIG. 29C, the observations of the ring-like diffractionpatterns indicate that crystal parts having random orientation(hereinafter also referred to as crystal parts having no c-axisalignment or second crystal parts) exist in the oxide semiconductorfilm.

In addition, two first regions are presumed to have two-hold symmetrybecause the regions are disposed symmetrically with respect to thecenter point of the electron diffraction pattern and the luminances ofthe regions are substantially equal to each other. As described above,since the two first regions are diffraction spots which are derived fromthe c-axis alignment, the orientation of a straight line which passesthrough the two first regions and the center is aligned with that of thec-axis of the crystal part. The thickness direction is the verticaldirection of FIG. 29C, which suggests the presence of crystal part inwhich the c-axis is aligned in the thickness direction in the oxidesemiconductor film.

As described above, the oxide semiconductor film of Sample X1 isconfirmed to be a film including both crystal parts having c-axisalignment and crystal parts having no c-axis alignment.

The results of the electron diffraction patterns shown in FIGS. 30B and30C and FIGS. 31B and 31C are substantially the same as those of theelectron diffraction patterns shown in FIGS. 29B and 29C. The luminanceof the two spots (first regions) derived from c-axis alignment is highin the order of Sample X1, Sample X2 and Sample X3. This indicates thatthe proportion of crystal parts having c-axis alignment is high in thatorder.

[Quantification Method of Crystallinity of Oxide Semiconductor Film]

Next, an example of a quantification method of crystallinity of an oxidesemiconductor film is described with reference to FIGS. 32A and 32B,FIG. 33, and FIG. 34.

First, an electron diffraction pattern is prepared (see FIG. 32A).

FIG. 32A shows an electron diffraction pattern obtained by measuring a100-nm-thick oxide semiconductor film using an electron beam with adiameter of 100 nmφ. FIG. 32B shows an electron diffraction patternobtained by adjusting contrast of the electron diffraction pattern shownin FIG. 32A.

In FIG. 32B, two clear spots (first regions) are observed over and undera direct spot. The two spots (first regions) are derived fromdiffraction spots corresponding to (001) in a structure model ofInGaZnO₄, that is, crystal parts having c-axis alignment. In addition tothe first regions, a ring-like pattern (second regions) with a lowluminance positioned on an approximately concentric circle of the firstregion is observed. The ring-like pattern is obtained when theluminances of spots derived from structures of crystal parts having noc-axis alignment (second crystal parts) are averaged by using theelectron beam with a diameter of 100 nmφ.

Here, in the electron diffraction pattern, the first regions includingdiffraction spots derived from the crystal parts having c-axis alignmentand the second regions including diffraction spots derived from thesecond crystal parts are observed to overlap with each other. Thus, aline profile including the first regions and line profiles including thesecond regions are obtained and compared with each other, whereby thecrystallinity of the oxide semiconductor film can be quantified.

The line profile including the first regions and the line profilesincluding the second regions are described with reference to FIG. 33.

FIG. 33 shows a simulation pattern of electron diffraction that isobtained when an electron beam is emitted to the (100) plane of thestructure model of InGaZnO₄. In the simulation pattern, auxiliary linesof a region A-A′, a region B-B′, and a region C-C′ are drawn.

The region A-A′ in FIG. 33 includes a straight line passing through twodiffraction spots derived from the first crystal parts having c-axisalignment and a direct spot. The regions B-B′ and C-C′ in FIG. 33 eachinclude a straight line passing through regions where no diffractionspot derived from the first crystal part having c-axis alignment isobserved and a direct spot. An angle between the region A-A′ and theregion B-B′ or C-C′ is approximately 34°, specifically, larger than orequal to 30° and smaller than or equal to 38°, preferably larger than orequal to 32° and smaller than or equal to 36°, further preferably largerthan or equal to 33° and smaller than or equal to 35°.

The line profiles have the tendencies shown in FIG. 34 in accordancewith the structure of the oxide semiconductor film. FIG. 34 shows imagediagrams of line profiles, relative luminance R, and a half width (FWHM:full width at half maximum) of a spectrum derived from c-axis alignmentthat is obtained from an electron diffraction pattern of each structure.

Relative luminance R in FIG. 34 is obtained by dividing the integratedintensity of luminance of the region A-A′ by the integrated intensity ofluminance of the region B-B′ or the integrated intensity of luminance ofthe region C-C′. Note that the integrated intensity of luminance of eachof the regions A-A′, B-B′, and C-C′ is obtained by removing theluminance of background derived from the direct spot which appears atthe center.

When the relative luminance R is calculated, the intensity of c-axisalignment can be quantitatively defined. For example, as shown in FIG.34, in a single-crystal oxide semiconductor film, the peak intensity ofdiffraction spots derived from the first crystal parts having c-axisalignment in the region A-A′ is high and there is no diffraction spotderived from the first crystal part having c-axis alignment in theregions B-B′ and C-C′; thus, the relative luminance R is much largerthan 1. The relative luminance R decreases in the order of singlecrystal, only CAAC (details of CAAC will be described later),CAAC+nanocrystal, nanocrystal, and amorphous. In particular, innanocrystal and amorphous, which have no particular orientation, therelative luminance R is equal to 1.

As the periodicity of the crystal is higher, the intensity of thespectrum derived from the first crystal part having c-axis alignmentbecomes high and the half width of the spectrum becomes small. Thus, thehalf width of single crystal is the smallest, and the half width isincreased in the order of only CAAC, CAAC+nanocrystal, and nanocrystal.The half width of amorphous is extremely large and the profile thereofis called a “halo”.

[Analysis Using Line Profile]

As described above, the ratio of the integrated intensity of luminanceof the first regions to the integrated intensity of luminance of thesecond regions is important information to presume the proportion ofcrystal parts having orientation.

Then, from electron diffraction patterns of Samples X1 to X3 that aredescribed above, analysis with line profiles was performed.

FIGS. 35A1 and 35A2 show results of analysis with line profiles ofSample X1. FIGS. 35B1 and 35B2 show results of analysis with lineprofiles of Sample X2. FIGS. 35C1 and 35C2 show results of analysis withline profiles of Sample X3.

FIG. 35A1 shows the electron diffraction pattern in FIG. 29C in whichthe regions A-A′, B-B′, and C-C′ are drawn. FIG. 35B1 shows the electrondiffraction pattern in FIG. 30C in which the regions A-A′, B-B′, andC-C′ are drawn. FIG. 35C1 shows the electron diffraction pattern in FIG.31C in which the regions A-A′, B-B′, and C-C′ are drawn.

The regions A-A′, B-B′, and C-C′ can each be obtained by normalizingline profiles using the luminance of the direct spot as a reference.Note that the direct spot appears at the center of an electrondiffraction pattern. With the regions, Samples X1 to X3 can berelatively compared.

When the profile of the luminance is calculated, a component of theluminance derived from inelastic scatterings and the like from Sample issubtracted as the background, in which case comparison with higheraccuracy can be performed. Because the component of the luminancederived from inelastic scatterings shows an extremely broad profile in aradial direction, the luminance of the background may be obtained by alinear approximation. For example, a straight line is drawn along thetails of a target peak, and a region positioned on the luminance sidelower than the straight line can be subtracted as the background.

Here, the integrated intensity of the luminance of each of the regionsA-A′, B-B′, and C-C′ is calculated from data in which the background issubtracted by the method described above. Then, the relative luminance Ris obtained by dividing the integrated intensity of the luminance of theregion A-A′ by the integrated intensity of the luminance of the regionB-B′ or the integrated intensity of the luminance of the region C-C′.

FIG. 36 shows the relative luminance R of Samples X1 to X3. In FIG. 36,in a spectrum on the left side and the right side of the direct spot inthe profiles of the luminance in each of FIGS. 35A2, 35B2, and 35C2, avalue obtained by dividing the integrated intensity of the luminance ofthe region A-A′ by the integrated intensity of the luminance of theregion B-B′ and a value obtained by dividing the integrated intensity ofthe luminance of the region A-A′ by the integrated intensity of theluminance of the region C-C′ are calculated.

As shown in FIG. 36, the relative luminance of Samples X1 to X3 is asfollows. The relative luminance R of Sample X1 is 25.00. The relativeluminance R of Sample X2 is 3.04. The relative luminance R of Sample X3is 1.05. Note that the relative luminance R is an average value ofrelative luminances at four points. As described above, the relativeluminance R is high in the order of Sample X1, Sample X2, and Sample X3.

When the oxide semiconductor film of one embodiment of the presentinvention is used as a semiconductor film in which a channel of atransistor is formed, the relative luminance R is preferably greaterthan 1 and less than or equal to 40, further preferably greater than 1and less than or equal to 10, still further preferably greater than 1and less than or equal to 3. With use of such an oxide semiconductorfilm as a semiconductor film, both high stability of electricalcharacteristics and high field-effect mobility in a low-gate-voltageregion can be achieved.

<2-5. Proportion of Crystal Part>

The proportion of crystal parts in an oxide semiconductor film can beestimated by analyzing its cross-sectional TEM image.

A method for analyzing the image is described. An image is analyzed asfollows. First, a high-resolution TEM image is subjected totwo-dimensional fast Fourier transform (FFT), whereby an FFT image isobtained. The obtained FFT image is subjected to a mask processing sothat a region other than a region having a periodic structure isremoved. After the mask processing, the FFT image is subjected totwo-dimensional inverse fast Fourier transform (IFFT), whereby an FFTfiltering image is obtained.

In this manner, a real-space image in which only crystal parts areextracted can be obtained. Then, the proportion of crystal parts can beestimated from the proportion of area of the remaining image. Moreover,the proportion of area other than the crystal parts can be estimated bysubtracting the remaining region from the area of the region used forcalculation (also referred to as the area of the original image).

FIG. 37A1 shows a cross-sectional TEM image of Sample X1. FIG. 37A2shows an image obtained through the analysis of the cross-sectional TEMimage of Sample X1. FIG. 37B1 shows a cross-sectional TEM image ofSample X2. FIG. 37B2 shows an image obtained through the analysis of thecross-sectional TEM image of Sample X2. FIG. 37C1 shows across-sectional TEM image of Sample X3. FIG. 37C2 shows an imageobtained through the analysis of the cross-sectional TEM image of SampleX3.

White regions in the oxide semiconductor film in the images obtainedthrough the analysis correspond to regions including crystal partshaving orientation. Black regions correspond to regions includingcrystal parts having no orientation or crystal parts with randomorientation.

From the result shown in FIG. 37A2, the proportion of the area otherthan the region including crystal parts having orientation isapproximately 43.1% in Sample X1. From the result shown in FIG. 37B2,the proportion of the area other than the region including crystal partshaving orientation is approximately 61.7% in Sample X2. From the resultshown in FIG. 37C2, the proportion of the area other than the regionincluding crystal parts having orientation is approximately 89.5% inSample X3.

The proportion of the region other than crystal parts having orientationin an oxide semiconductor film, which is estimated in the above manner,is preferably greater than or equal to 5% and less than 40% because theoxide semiconductor film has extremely high crystallinity and extremelyhigh stability of electrical characteristics and hardly generates oxygenvacancies. In contrast, when the proportion of the region other thancrystal parts having orientation in an oxide semiconductor film ishigher than or equal to 40% and lower than 100%, preferably higher thanor equal to 60% and lower than or equal to 90%, the oxide semiconductorfilm includes both the crystal parts having orientation and the crystalparts having no orientation at an appropriate ratio and thus can achieveboth high stability of electrical characteristics and high mobility.

Here, a region other than the crystal parts that can be easily observedin a cross-sectional TEM image or a cross-sectional TEM image obtainedthrough analysis can be referred to as a lateral growth buffer region(LGBR).

<2-6. Oxygen Diffusion to Oxide Semiconductor Film>

Next, the evaluation results of ease of oxygen diffusion to oxidesemiconductor films are described.

The following three samples (Samples Y1 to Y3) were fabricated.

[Sample Y1]

First, an approximately 50-nm-thick oxide semiconductor film was formedover a glass substrate in a manner similar to that of Sample X1. Next,an approximately 30-nm-thick silicon oxynitride film, an approximately100-nm-thick silicon oxynitride film, and an approximately 20-nm-thicksilicon oxynitride film were stacked over the oxide semiconductor filmby a plasma CVD method. Note that in the following description, an oxidesemiconductor film and a silicon oxynitride film are referred to as OSand GI, respectively, in some cases.

Then, heat treatment was performed at 350° C. for one hour in a nitrogenatmosphere.

Next, a 5-nm-thick In—Sn—Si oxide film was formed by a sputteringmethod.

Next, oxygen was added to the silicon oxynitride film. The oxygenaddition treatment was performed with an ashing apparatus under theconditions where the substrate temperature was 40° C., an oxygen gas(¹⁶O) at a flow rate of 150 sccm and an oxygen gas (¹⁸O) at a flow rateof 100 sccm were introduced into a chamber, the pressure was 15 Pa, andan RF power of 4500 W was supplied for 600 sec. between parallel-plateelectrodes provided in the ashing apparatus so that a bias would beapplied to the substrate side. Since the silicon oxynitride filmcontained oxygen (¹⁶O) at a main component level, an oxygen gas (¹⁸O)was used to exactly measure the amount of oxygen added by the oxygenaddition treatment.

Then, an approximately 100-nm-thick silicon nitride film was formed by aplasma CVD method.

[Sample Y2]

Sample Y2 is a sample whose oxide semiconductor film was formed indifferent conditions from those of Sample Y1. In Sample Y2, anapproximately 50-nm-thick oxide semiconductor film was formed in amanner similar to that of Sample X2.

[Sample Y3]

Sample Y3 is a sample whose oxide semiconductor film was formed indifferent conditions from those of Sample Y1. In Sample Y3, anapproximately 50-nm-thick oxide semiconductor film was formed in amanner similar to that of Sample X3.

Through the above process, Samples Y1 to Y3 were fabricated.

[SIMS Analysis]

The concentration of ¹⁸O in Samples Y1 to Y3 was measured by secondaryion mass spectrometry (SIMS) analysis. The SIMS analysis was performedunder three conditions: a condition in which Samples Y1 to Y3 were notsubjected to heat treatment; a condition in which Samples Y1 to Y3 weresubjected to heat treatment at 350° C. for one hour in a nitrogenatmosphere; and a condition in which Samples Y1 to Y3 were subjected toheat treatment at 450° C. for one hour in a nitrogen atmosphere.

FIGS. 38A to 38C show SIMS measurement results. FIG. 38A, FIG. 38B, andFIG. 38C show SIMS measurement results of Sample Y1, Sample Y2, andSample Y3, respectively.

FIGS. 38A to 38C show the analysis results of a region including GI andOS. Note that FIGS. 38A to 38C show results of SIMS (also referred to assubstrate side depth profile (SSDP)-SIMS) analysis performed from thesubstrate side.

In FIGS. 38A to 38C, a gray dashed line indicates a profile of Sample inwhich heat treatment was not performed, a black dashed line indicates aprofile of Sample in which heat treatment was performed at 350° C., anda black solid line indicates a profile of Sample in which heat treatmentwas performed at 450° C.

In each of Samples Y1 to Y3, it is found that ¹⁸O was diffused to GI andalso to OS. Furthermore, the position where ¹⁸O was diffused was deeperin the order of Sample Y1, Sample Y2, and Sample Y3. In addition, whenheat treatment was performed at 350° C. or 450° C., ¹⁸O was more deeplydiffused.

From the above results, it is found that an oxide semiconductor filmincluding both crystal parts having orientation and crystal parts havingno orientation and a low proportion of crystal parts having orientationis a film which easily transmits oxygen, in other words, a film in whichoxygen is easily diffused. In addition, when heat treatment is performedat 350° C. or 450° C., oxygen in a GI film is diffused to OS.

The above results show that the higher the proportion (density) ofcrystal parts having orientation is, the more difficult it is for oxygento be diffused in the thickness direction, and the lower the density is,the easier it is for oxygen to be diffused in the thickness direction.The ease of oxygen diffusion to the oxide semiconductor film can beconsidered as follows.

In an oxide semiconductor film containing both crystal parts havingorientation and submicroscopic crystal parts having no orientation, aregion other than the crystal parts which can be obviously observed in across-sectional observation image (LGBR) can be a region in which oxygenis easily diffused, that is, can serve as an oxygen diffusion path. As aresult, in the case where a source which supplies sufficient oxygen isprovided in the vicinity of the oxide semiconductor film, oxygen can beeasily supplied through the LGBR to the crystal parts havingorientation, and the amount of oxygen vacancy in the film can bereduced.

For example, an oxide film which easily releases oxygen is formed to bein contact with the oxide semiconductor film and heat treatment isperformed, so that oxygen released from the oxide film is diffused tothe oxide semiconductor film in the thickness direction through theLGBR. Through the LGBR, oxygen can be supplied laterally to crystalparts having orientation. Accordingly, oxygen is easily suppliedsufficiently to the crystal parts having orientation and a region otherthan the crystal parts in the oxide semiconductor film, which leads toan effective reduction of oxygen vacancy in the film.

For example, when a hydrogen atom which is not bonded to a metal atomexists in the oxide semiconductor film, an oxygen atom is bonded to thehydrogen atom, and then OH is formed and fixed in some cases. The statein which a certain amount (e.g., approximately 1×10¹⁷ cm⁻³) of hydrogenatoms trapped in oxygen vacancy (V_(O)) in the oxide semiconductor film(such a hydrogen atom is referred to as V_(O)H) is formed in thedeposition at a low temperature, whereby generation of OH is inhibited.A certain amount of carriers exists in the oxide semiconductor filmbecause V_(O)H generates a carrier. Thus, the oxide semiconductor filmwith an increased carrier density can be formed. Although oxygen vacancyis formed concurrently with the deposition, the oxygen vacancy can bereduced by introducing oxygen through the LGBR as described above. Inthis manner, the oxide semiconductor film with a relatively high carrierdensity and a sufficiently reduced amount of oxygen vacancy can beformed.

A clear grain boundary cannot be observed in the oxide semiconductorfilm because submicroscopic crystal parts having no orientation at thetime of the deposition is formed in a region other than crystal partshaving orientation. The submicroscopic crystal part is positionedbetween a plurality of crystal parts having orientation. Thesubmicroscopic crystal part is bonded to an adjacent crystal part havingorientation by growing in the lateral direction with heat at the time ofthe deposition. The submicroscopic crystal part functions as a regionwhere a carrier is generated. The oxide semiconductor film with such astructure is expected to improve field-effect mobility considerably whenused in a transistor.

In addition, plasma treatment in an oxygen atmosphere is preferablyperformed after the oxide semiconductor film is formed and an oxideinsulating film such as a silicon oxide film is formed over the oxidesemiconductor film. The treatment can supply oxygen to the film andreduce the hydrogen concentration. For example, during plasma treatment,fluorine which remains in the chamber is doped at the same time to theoxide semiconductor film in some cases. Fluorine exists as a fluorineatom with negative charges and is bonded to a hydrogen atom withpositive charges by Coulomb force, and then HF is generated. HF isreleased to the outside of the oxide semiconductor film during theplasma treatment, and as a result, the hydrogen concentration in theoxide semiconductor film can be reduced. In the plasma treatment, H₂O inwhich an oxygen atom and hydrogen atoms are bonded is released to theoutside of the film in some cases.

A structure in which a silicon oxide film (or a silicon oxynitride film)is stacked over the oxide semiconductor film is considered. Fluorine inthe silicon oxide film does not affect electrical characteristics of theoxide semiconductor film because fluorine is bonded to hydrogen in thefilm and can exist as HF which is electrically neutral. Note that Si—Fbond is generated in some cases, which is also electrically neutral.Furthermore, HF in the silicon oxide film does not affect the diffusionof oxygen.

According to the above mechanism, oxygen vacancy in the oxidesemiconductor film can be reduced and hydrogen which is not bonded to ametal atom in the film can be reduced, which leads to the improvement ofreliability. The electrical characteristics are expected to be improvedbecause the carrier density of the oxide semiconductor film is greaterthan or equal to a certain amount.

<2-7. Deposition Method of Oxide Semiconductor Film>

A deposition method of the oxide semiconductor film of one embodiment ofthe present invention is described below.

The oxide semiconductor film of one embodiment of the present inventioncan be formed by a sputtering method under an atmosphere containingoxygen.

The substrate temperature during the deposition is higher than or equalto room temperature and lower than or equal to 150° C., preferablyhigher than or equal to 50° C. and lower than or equal to 150° C.,further preferably higher than or equal to 100° C. and lower than orequal to 150° C., typified by 130° C. The substrate temperature withinthe above range can control the ratio of crystal parts havingorientation to crystal parts having no orientation.

The oxygen flow rate ratio (partial pressure of oxygen) during thedeposition is preferably higher than or equal to 1% and lower than 33%,further preferably higher than or equal to 5% and lower than or equal to30%, still further preferably higher than or equal to 5% and lower thanor equal to 20%, and yet still further preferably higher than or equalto 5% and lower than or equal to 15%, typified by 10%. Low oxygen flowrate can result in a large number of crystal parts having no orientationin the film.

Accordingly, setting the substrate temperature and the oxygen flow rateduring the deposition within the above ranges can result in an oxidesemiconductor film containing both crystal parts having orientation andcrystal parts having no orientation. Furthermore, the proportions ofcrystal parts having orientation and crystal parts having no orientationcan be adjusted by setting the substrate temperature and the oxygen flowrate within the above ranges.

An oxide target that can be used for forming the oxide semiconductorfilm is not limited to an In—Ga—Zn-based oxide; for example, anIn-M-Zn-based oxide (M is Al, Ga, Y, or Sn) can be used.

When an oxide semiconductor film containing crystal parts is formed asthe oxide semiconductor film using a sputtering target containing apolycrystalline oxide having a plurality of crystal grains, an oxidesemiconductor film with crystallinity can be obtained more easily thanthe case of using a sputtering target not containing a polycrystallineoxide.

The consideration of the deposition mechanism of the oxide semiconductorfilm is made below. In the case where a sputtering target contains aplurality of crystal grains each of which has a layered structure and aninterface at which the crystal grain is easily cleaved, ion collisionwith the sputtering target might cleave crystal grains to makeplate-like or pellet-like sputtering particles. The obtained plate-likeor pellet-like sputtering particles are deposited on a substrate, whichprobably results in formation of an oxide semiconductor film containingnanocrystals. An oxide semiconductor film containing crystal partshaving orientation is likely to be formed when the substrate is heatedbecause the nanocrystals are then bonded to each other or rearranged ata substrate surface.

Note that the above consideration is made on the assumption that asputtering method is used; a sputtering method is particularlypreferable because the crystallinity can be easily adjusted. Instead ofa sputtering method, a pulsed laser deposition (PLD) method, aplasma-enhanced chemical vapor deposition (PECVD) method, a thermalchemical vapor deposition (CVD) method, an atomic layer deposition (ALD)method, a vacuum evaporation method, or the like may be used. As anexample of the thermal CVD method, a metal organic chemical vapordeposition (MOCVD) method can be given.

At least part of this embodiment can be implemented in combination withany of the other embodiments described in this specification asappropriate.

Embodiment 3

In this embodiment, an example of a display device that includes thesemiconductor device of one embodiment of the present invention will bedescribed below with reference to FIG. 39, FIG. 40, FIG. 41, FIG. 42,FIGS. 43A to 43D, FIG. 44, FIG. 45, and FIG. 46.

FIG. 39 is a top view illustrating an example of a display device. Adisplay device 700 illustrated in FIG. 39 includes a pixel portion 702provided over a first substrate 701; a source driver circuit portion 704and a gate driver circuit portion 706 provided over the first substrate701; a sealant 712 provided to surround the pixel portion 702, thesource driver circuit portion 704, and the gate driver circuit portion706; and a second substrate 705 provided to face the first substrate701. The first substrate 701 and the second substrate 705 are sealedwith the sealant 712. That is, the pixel portion 702, the source drivercircuit portion 704, and the gate driver circuit portion 706 are sealedwith the first substrate 701, the sealant 712, and the second substrate705. Although not illustrated in FIG. 39, a display element is providedbetween the first substrate 701 and the second substrate 705.

In the display device 700, a flexible printed circuit (FPC) terminalportion 708 electrically connected to the pixel portion 702, the sourcedriver circuit portion 704, and the gate driver circuit portion 706 isprovided in a region different from the region which is surrounded bythe sealant 712 and positioned over the first substrate 701.Furthermore, an FPC 716 is connected to the FPC terminal portion 708,and a variety of signals and the like are supplied to the pixel portion702, the source driver circuit portion 704, and the gate driver circuitportion 706 through the FPC 716. Furthermore, a signal line 710 isconnected to the pixel portion 702, the source driver circuit portion704, the gate driver circuit portion 706, and the FPC terminal portion708. The variety of signals and the like are applied to the pixelportion 702, the source driver circuit portion 704, the gate drivercircuit portion 706, and the FPC terminal portion 708 via the signalline 710 from the FPC 716.

A plurality of gate driver circuit portions 706 may be provided in thedisplay device 700. An example of the display device 700 in which thesource driver circuit portion 704 and the gate driver circuit portion706 are formed over the first substrate 701 where the pixel portion 702is also formed is described; however, the structure is not limitedthereto. For example, only the gate driver circuit portion 706 may beformed over the first substrate 701 or only the source driver circuitportion 704 may be formed over the first substrate 701. In this case, asubstrate over which a source driver circuit, a gate driver circuit, orthe like is formed (e.g., a driver circuit board formed using asingle-crystal semiconductor film or a polycrystalline semiconductorfilm) may be formed on the first substrate 701. Note that there is noparticular limitation on the method of connecting a separately prepareddriver circuit substrate, and a chip on glass (COG) method, a wirebonding method, or the like can be used.

The pixel portion 702, the source driver circuit portion 704, and thegate driver circuit portion 706 included in the display device 700include a plurality of transistors.

The display device 700 can include any of a variety of elements. Asexamples of the elements, electroluminescent (EL) element (e.g., an ELelement containing organic and inorganic materials, an organic ELelement, an inorganic EL element, or an LED), a light-emittingtransistor element (a transistor which emits light depending oncurrent), an electron emitter, a liquid crystal element, an electronicink display, an electrophoretic element, an electrowetting element, aplasma display panel (PDP), a micro electro mechanical systems (MEMS)display (e.g., a grating light valve (GLV), a digital micromirror device(DMD), a digital micro shutter (DMS) element, or an interferometricmodulator display (IMOD) element), and a piezoelectric ceramic displaycan be given.

An example of a display device including an EL element is an EL display.Examples of display devices including electron emitters are a fieldemission display (FED) and an SED-type flat panel display (SED:surface-conduction electron-emitter display). Examples of displaydevices including liquid crystal elements include a liquid crystaldisplay (e.g., a transmissive liquid crystal display, a transflectiveliquid crystal display, a reflective liquid crystal display, adirect-view liquid crystal display, or a projection liquid crystaldisplay). Display devices having electronic ink or electrophoreticelements include electronic paper and the like. In the case of atransflective liquid crystal display or a reflective liquid crystaldisplay, some of or all of pixel electrodes function as reflectiveelectrodes. For example, some or all of pixel electrodes are formed tocontain aluminum, silver, or the like. In such a case, a memory circuitsuch as an SRAM can be provided under the reflective electrodes. Thus,the power consumption can be further reduced.

As a display method in the display device 700, a progressive method, aninterlace method, or the like can be employed. Furthermore, colorelements controlled in a pixel at the time of color display are notlimited to three colors: R, G, and B (R, G, and B correspond to red,green, and blue, respectively). For example, four pixels of the R pixel,the G pixel, the B pixel, and a W (white) pixel may be included.Alternatively, a color element may be composed of two colors among R, G,and B as in PenTile layout. The two colors may differ among colorelements. Alternatively, one or more colors of yellow, cyan, magenta,and the like may be added to RGB. Furthermore, the size of a displayregion may be different depending on respective dots of the colorcomponents. Embodiments of the disclosed invention are not limited to adisplay device for color display; the disclosed invention can also beapplied to a display device for monochrome display.

A coloring layer (also referred to as a color filter) may be used toobtain a full-color display device in which white light (W) is used fora backlight (e.g., an organic EL element, an inorganic EL element, anLED, or a fluorescent lamp). As the coloring layer, red (R), green (G),blue (B), yellow (Y), or the like may be combined as appropriate, forexample. With the use of the coloring layer, higher colorreproducibility can be obtained than in the case without the coloringlayer. In this case, by providing a region with the coloring layer and aregion without the coloring layer, white light in the region without thecoloring layer may be directly utilized for display. By partly providingthe region without the coloring layer, a decrease in luminance due tothe coloring layer can be suppressed, and 20% to 30% of powerconsumption can be reduced in some cases when an image is displayedbrightly. Note that in the case where full-color display is performedusing a self-luminous element such as an organic EL element or aninorganic EL element, elements may emit light of their respective colorsR, G, B, Y, and W. By using a self-luminous element, power consumptioncan be further reduced as compared to the case of using the coloringlayer in some cases.

As a coloring system, any of the following systems may be used: theabove-described color filter system in which part of white light isconverted into red light, green light, and blue light through colorfilters; a three-color system in which red light, green light, and bluelight are used; and a color conversion system or a quantum dot system inwhich part of blue light is converted into red light or green light.

In this embodiment, a structure including a liquid crystal element andan EL element as display elements is described with reference to FIG.40, FIG. 41, and FIG. 42. Note that FIG. 40 and FIG. 41 are each across-sectional view taken along the dashed-dotted line Q-R shown inFIG. 39 and show a structure including a liquid crystal element as adisplay element. FIG. 42 is a cross-sectional view taken alongdashed-dotted line Q-R in FIG. 39 and illustrates the structureincluding an EL element as a display element.

Portions common to FIG. 40, FIG. 41, and FIG. 42 are described first,and then different portions are described.

<3-1. Common Portions in Display Devices>

The display device 700 illustrated in FIG. 40, FIG. 41, and FIG. 42include a lead wiring portion 711, the pixel portion 702, the sourcedriver circuit portion 704, and the FPC terminal portion 708. Note thatthe lead wiring portion 711 includes the signal line 710. The pixelportion 702 includes a transistor 750 and a capacitor 790. The sourcedriver circuit portion 704 includes a transistor 752.

The transistor 750 and the transistor 752 each have a structure similarto that of the transistor 100B described above. Note that the transistor750 and the transistor 752 may each have the structure of any of theother transistors described in the above embodiments.

The transistors used in this embodiment each include an oxidesemiconductor film which is highly purified and in which formation ofoxygen vacancies is suppressed. The transistor can have low off-statecurrent. Accordingly, an electrical signal such as an image signal canbe held for a longer period, and a writing interval can be set longer inan on state. Accordingly, the frequency of refresh operation can bereduced, which leads to an effect of suppressing power consumption.

In addition, the transistor used in this embodiment can have relativelyhigh field-effect mobility and thus is capable of high speed operation.For example, with such a transistor which can operate at high speed usedfor a liquid crystal display device, a switching transistor in a pixelportion and a driver transistor in a driver circuit portion can beformed over one substrate. That is, a semiconductor device formed usinga silicon wafer or the like is not additionally needed as a drivercircuit, by which the number of components of the semiconductor devicecan be reduced. In addition, the transistor which can operate at highspeed can be used also in the pixel portion, whereby a high-qualityimage can be provided.

A capacitor 790 includes a lower electrode that is formed through a stepof processing the same conductive film as a conductive film functioningas a first gate electrode of the transistor 750 and an upper electrodethat is formed through a step of processing the same conductive film asa conductive film functioning as a source electrode or a drain electrodeof the transistor 750. Furthermore, between the lower electrode and theupper electrode, an insulating film that is formed through a step offorming the same insulating film as an insulating film functioning as afirst gate insulating film of the transistor 750 and an insulating filmthat is formed through a step of forming the same insulating film as aninsulating film functioning as a protective insulating film of thetransistor 750 are provided. That is, the capacitor 790 has astacked-layer structure in which the insulating films functioning as adielectric film are positioned between a pair of electrodes.

In FIG. 40, FIG. 41, and FIG. 42, a planarization insulating film 770 isprovided over the transistor 750, the transistor 752, and the capacitor790.

Although FIG. 40, FIG. 41, and FIG. 42 each illustrate an example inwhich the transistor 750 included in the pixel portion 702 and thetransistor 752 included in the source driver circuit portion 704 havethe same structure, one embodiment of the present invention is notlimited thereto. For example, the pixel portion 702 and the sourcedriver circuit portion 704 may include different transistors.Specifically, a structure in which a top-gate transistor is used in thepixel portion 702 and a bottom-gate transistor is used in the sourcedriver circuit portion 704, or a structure in which a bottom-gatetransistor is used in the pixel portion 702 and a top-gate transistor isused in the source driver circuit portion 704 may be employed. Note thatthe term “source driver circuit portion 704” can be replaced by the term“gate driver circuit portion”.

The signal line 710 is formed through the same process as the conductivefilms functioning as source electrodes and drain electrodes of thetransistors 750 and 752. In the case where the signal line 710 is formedusing a material including a copper element, signal delay or the likedue to wiring resistance is reduced, which enables display on a largescreen.

The FPC terminal portion 708 includes a connection electrode 760, ananisotropic conductive film 780, and the FPC 716. Note that theconnection electrode 760 is formed through the same process as theconductive films functioning as source electrodes and drain electrodesof the transistors 750 and 752. The connection electrode 760 iselectrically connected to a terminal included in the FPC 716 through theanisotropic conductive film 780.

For example, a glass substrate can be used as the first substrate 701and the second substrate 705. A flexible substrate may be used as thefirst substrate 701 and the second substrate 705. Examples of theflexible substrate include a plastic substrate.

A structure body 778 is provided between the first substrate 701 and thesecond substrate 705. The structure body 778 is a columnar spacerobtained by selective etching of an insulating film and provided tocontrol the distance (cell gap) between the first substrate 701 and thesecond substrate 705. Note that a spherical spacer may be used as thestructure body 778.

Furthermore, a light-blocking film 738 functioning as a black matrix, acoloring film 736 functioning as a color filter, and an insulating film734 in contact with the light-blocking film 738 and the coloring film736 are provided on the second substrate 705 side.

<3-2. Structure Example of Display Device Using Liquid Crystal Element>

The display device 700 illustrated in FIG. 40 includes a liquid crystalelement 775. The liquid crystal element 775 includes a conductive film772, a conductive film 774, and a liquid crystal layer 776. Theconductive film 774 is provided on the second substrate 705 side andfunctions as a counter electrode. The display device 700 illustrated inFIG. 40 can display an image in such a manner that transmission ornon-transmission of light is controlled by the alignment state in theliquid crystal layer 776 which is changed depending on the voltageapplied to between the conductive film 772 and the conductive film 774.

The conductive film 772 is electrically connected to the conductive filmthat functions as a source electrode and a drain electrode included inthe transistor 750. The conductive film 772 is formed over theplanarization insulating film 770 to function as a pixel electrode,i.e., one electrode of the display element.

A conductive film that transmits visible light or a conductive film thatreflects visible light can be used for the conductive film 772. Forexample, a material including one kind selected from indium (In), zinc(Zn), and tin (Sn) is preferably used for the conductive film thattransmits visible light. For example, a material including aluminum orsilver may be used for the conductive film that reflects visible light.

In the case where a conductive film that reflects visible light is usedas the conductive film 772, the display device 700 becomes areflective-type liquid crystal display device. In the case where aconductive film that transmits visible light is used as the conductivefilm 772, the display device 700 becomes a transmissive liquid crystaldisplay device.

When a structure over the conductive film 772 is changed, a drivingmethod of the liquid crystal element can be changed. An example of thiscase is illustrated in FIG. 41. The display device 700 illustrated inFIG. 41 is an example of employing a transverse electric field mode(e.g., an FFS mode) as a driving mode of the liquid crystal element. Inthe structure illustrated in FIG. 41, an insulating film 773 is providedover the conductive film 772 and the conductive film 774 is providedover the insulating film 773. In such a structure, the conductive film774 functions as a common electrode, and an electric field generatedbetween the conductive film 772 and the conductive film 774 through theinsulating film 773 can control the alignment state of the liquidcrystal layer 776.

Although not illustrated in FIG. 40 and FIG. 41, the conductive film 772and/or the conductive film 774 may be provided with an alignment film ona side in contact with the liquid crystal layer 776. Although notillustrated in FIG. 40 and FIG. 41, an optical member (opticalsubstrate) or the like, such as a polarizing member, a retardationmember, or an anti-reflection member, may be provided as appropriate.For example, circular polarization may be employed by using a polarizingsubstrate and a retardation substrate. In addition, a backlight, a sidelight, or the like may be used as a light source.

In the case where a liquid crystal element is used as the displayelement, a thermotropic liquid crystal, a low-molecular liquid crystal,a high-molecular liquid crystal, a polymer-dispersed liquid crystal, aferroelectric liquid crystal, an anti-ferroelectric liquid crystal, orthe like can be used. Such a liquid crystal material exhibits acholesteric phase, a smectic phase, a cubic phase, a chiral nematicphase, an isotropic phase, or the like depending on conditions.

Alternatively, in the case of employing a horizontal electric fieldmode, a liquid crystal exhibiting a blue phase for which an alignmentfilm is unnecessary may be used. A blue phase is one of liquid crystalphases, which is generated just before a cholesteric phase changes intoan isotropic phase while temperature of cholesteric liquid crystal isincreased. Since the blue phase appears only in a narrow temperaturerange, a liquid crystal composition in which several weight percent ormore of a chiral material is mixed is used for the liquid crystal layerin order to improve the temperature range. The liquid crystalcomposition which includes liquid crystal exhibiting a blue phase and achiral material has a short response time and optical isotropy, whichmakes the alignment process unneeded. An alignment film does not need tobe provided and rubbing treatment is thus not necessary; accordingly,electrostatic discharge damage caused by the rubbing treatment can beprevented and defects and damage of the liquid crystal display device inthe manufacturing process can be reduced. Moreover, the liquid crystalmaterial which exhibits a blue phase has a small viewing angledependence.

In the case where a liquid crystal element is used as the displayelement, a twisted nematic (TN) mode, an in-plane-switching (IPS) mode,a fringe field switching (FFS) mode, an axially symmetric alignedmicro-cell (ASM) mode, an optical compensated birefringence (OCB) mode,a ferroelectric liquid crystal (FLC) mode, an antiferroelectric liquidcrystal (AFLC) mode, or the like can be used.

Furthermore, a normally black liquid crystal display device such as atransmissive liquid crystal display device utilizing a verticalalignment (VA) mode may also be used. There are some examples of avertical alignment mode; for example, a multi-domain vertical alignment(MVA) mode, a patterned vertical alignment (PVA) mode, an ASV mode, orthe like can be employed.

<3-3. Display Device Including Light-Emitting Element>

The display device 700 illustrated in FIG. 42 includes a light-emittingelement 782. The light-emitting element 782 includes a conductive film772, an EL layer 786, and a conductive film 788. The display device 700shown in FIG. 42 is capable of displaying an image by light emissionfrom the EL layer 786 included in the light-emitting element 782. Notethat the EL layer 786 contains an organic compound or an inorganiccompound such as a quantum dot.

Examples of materials that can be used for an organic compound include afluorescent material and a phosphorescent material. Examples ofmaterials that can be used for a quantum dot include a colloidal quantumdot material, an alloyed quantum dot material, a core-shell quantum dotmaterial, and a core quantum dot material. The quantum dot containingelements belonging to Groups 12 and 16, elements belonging to Groups 13and 15, or elements belonging to Groups 14 and 16, may be used.Alternatively, a quantum dot material containing an element such ascadmium (Cd), selenium (Se), zinc (Zn), sulfur (S), phosphorus (P),indium (In), tellurium (Te), lead (Pb), gallium (Ga), arsenic (As), oraluminum (Al) may be used.

The above-described organic compound and the inorganic compound can bedeposited by a method such as an evaporation method (including a vacuumevaporation method), a droplet discharging method (also referred to asan ink-jet method), a coating method, or a gravure printing method. Alow molecular material, a middle molecular material (including anoligomer and a dendrimer), or a high molecular material may be includedin the EL layer 786.

Here, a method for forming the EL layer 786 by a droplet dischargemethod is described with reference to FIGS. 43A to 43D. FIGS. 43A to 43Dare cross-sectional views illustrating the method for forming the ELlayer 786.

First, the conductive film 772 is formed over the planarizationinsulating film 770, and an insulating film 730 is formed to cover partof the conductive film 772 (see FIG. 43A).

Next, a droplet 784 is discharged to an exposed portion of theconductive film 772, which is an opening of the insulating film 730,from a droplet discharge apparatus 783, so that a layer 785 containing acomposition is formed. The droplet 784 is a composition containing asolvent and is attached over the conductive film 772 (see FIG. 43B).

Note that the method for discharging the droplet 784 may be performedunder reduced pressure.

Then, the solvent is removed from the layer 785 containing thecomposition, and the resulting layer is solidified to form the EL layer786 (see FIG. 43C).

The solvent may be removed by drying or heating.

Next, the conductive film 788 is formed over the EL layer 786; thus, thelight-emitting element 782 is formed (see FIG. 43D)

When the EL layer 786 is formed by a droplet discharging method asdescribed above, the composition can be selectively discharged;accordingly, waste of material can be reduced. Furthermore, alithography process or the like for shaping is not needed, and thus, theprocess can be simplified and cost reduction can be achieved.

The droplet discharge method described above is a general term for ameans including a nozzle equipped with a composition discharge openingor a means to discharge droplets such as a head having one or aplurality of nozzles.

Next, a droplet discharge apparatus used for the droplet dischargemethod is described with reference to FIG. 44. FIG. 44 is a conceptualdiagram illustrating a droplet discharge apparatus 1400.

The droplet discharge apparatus 1400 includes a droplet discharge means1403. In addition, the droplet discharge means 1403 is equipped with ahead 1405 and a head 1412.

The heads 1405 and 1412 are connected to a control means 1407, and thiscontrol means 1407 is controlled by a computer 1410; thus, apreprogrammed pattern can be drawn.

The drawing may be conducted at a timing, for example, based on a marker1411 formed over a substrate 1402. Alternatively, the reference pointmay be determined on the basis of an outer edge of the substrate 1402.Here, the marker 1411 is detected by an imaging means 1404 and convertedinto a digital signal by an image processing means 1409. Then, thedigital signal is recognized by the computer 1410, and then, a controlsignal is generated and transmitted to the control means 1407.

An image sensor or the like using a charge coupled device (CCD) or acomplementary metal oxide semiconductor (CMOS) can be used as theimaging means 1404. Data about a pattern to be formed over the substrate1402 is stored in a storage medium 1408, and the control signal istransmitted to the control means 1407 based on the data, so that each ofthe heads 1405 and 1412 of the droplet discharging means 1403 can beindividually controlled. The heads 1405 and 1412 are supplied with amaterial to be discharged from material supply sources 1413 and 1414through pipes, respectively.

Inside the head 1405, a space as indicated by a dotted line 1406 to befilled with a liquid material and a nozzle which is a discharge outletare provided. Although it is not shown, an inside structure of the head1412 is similar to that of the head 1405. When the nozzle sizes of theheads 1405 and 1412 are different from each other, different materialswith different widths can be discharged simultaneously. Each head candischarge and draw a plurality of light emitting materials. In the caseof drawing over a large area, the same material can be simultaneouslydischarged to be drawn from a plurality of nozzles in order to improvethroughput. When a large substrate is used, the heads 1405 and 1412 canfreely scan the substrate in directions indicated by arrows X, Y, and Zin FIG. 44, and a region in which a pattern is drawn can be freely set.Thus, a plurality of the same patterns can be drawn over one substrate.

Further, a step of discharging the composition may be performed underreduced pressure. Also, a substrate may be heated when the compositionis discharged. After discharging the composition, either drying orbaking or the both is performed. Both the drying and baking are heattreatments but different in purpose, temperature, and time period. Thesteps of drying and baking are performed under normal pressure or underreduced pressure by laser irradiation, rapid thermal annealing, heatingusing a heating furnace, or the like. Note that the timing of the heattreatment and the number of times of the heat treatment are notparticularly limited. The temperature for performing each of the stepsof drying and baking in a favorable manner depends on the materials ofthe substrate and the properties of the composition.

In the above manner, the EL layer 786 can be formed with the dropletdischarge apparatus.

The display device 700 shown in FIG. 42 is described again.

In the display device 700 in FIG. 42, an insulating film 730 is providedover the planarization insulating film 770 and the conductive film 772.The insulating film 730 covers part of the conductive film 772. Notethat the light-emitting element 782 has a top emission structure.Therefore, the conductive film 788 has a light-transmitting property andtransmits light emitted from the EL layer 786. Although the top-emissionstructure is described as an example in this embodiment, one embodimentof the present invention is not limited thereto. A bottom-emissionstructure in which light is emitted to the conductive film 772 side, ora dual-emission structure in which light is emitted to both theconductive film 772 side and the conductive film 788 side may beemployed.

The coloring film 736 is provided to overlap with the light-emittingelement 782, and the light-blocking film 738 is provided to overlap withthe insulating film 730 and to be included in the lead wiring portion711 and in the source driver circuit portion 704. The coloring film 736and the light-blocking film 738 are covered with the insulating film734. A space between the light-emitting element 782 and the insulatingfilm 734 is filled with a sealing film 732. Although a structure withthe coloring film 736 is described as the display device 700 in FIG. 42,the structure is not limited thereto. In the case where the EL layer 786is formed by a separate coloring method, the coloring film 736 is notnecessarily provided.

<3-4. Structure Example of Display Device Provided with Input/OutputDevice>

An input/output device may be provided in the display device 700illustrated in FIG. 41 and FIG. 42. As an example of the input/outputdevice, a touch panel or the like can be given.

FIG. 45 illustrates a structure in which the display device 700 shown inFIG. 41 includes a touch panel 791. FIG. 46 illustrates a structure inwhich the display device 700 shown in FIG. 42 includes the touch panel791.

FIG. 45 is a cross-sectional view of the structure in which the touchpanel 791 is provided in the display device 700 illustrated in FIG. 41.FIG. 46 is a cross-sectional view of the structure in which the touchpanel 791 is provided in the display device 700 illustrated in FIG. 42.

First, the touch panel 791 illustrated in FIG. 45 and FIG. 46 isdescribed below.

The touch panel 791 illustrated in FIG. 45 and FIG. 46 is an in-celltouch panel provided between the substrate 705 and the coloring film736. The touch panel 791 is formed on the substrate 705 side before thelight-blocking film 738 and the coloring film 736 are formed.

The touch panel 791 includes the light-blocking film 738, an insulatingfilm 792, an electrode 793, an electrode 794, an insulating film 795, anelectrode 796, and an insulating film 797. A change in the mutualcapacitance between the electrode 793 and the electrode 794 can besensed when an object such as a finger or a stylus approaches, forexample.

A portion in which the electrode 793 intersects with the electrode 794is illustrated in the upper portion of the transistor 750 illustrated inFIG. 45 and FIG. 46. Through openings in the insulating film 795, theelectrode 796 is electrically connected to the two electrodes 793between which the electrode 794 is positioned. Note that a structure inwhich a region where the electrode 796 is provided is provided in thepixel portion 702 is illustrated in FIG. 45 and FIG. 46 as an example;however, one embodiment of the present invention is not limited thereto.For example, the region where the electrode 796 is provided may beprovided in the source driver circuit portion 704.

The electrodes 793 and 794 are provided in a region overlapping with thelight-blocking film 738. As illustrated in FIG. 45, it is preferablethat the electrode 793 do not overlap with the light-emitting element782. As illustrated in FIG. 46, it is preferable that the electrode 793do not overlap with the liquid crystal element 775. In other words, theelectrode 793 has an opening in its region overlapping with thelight-emitting element 782 and the liquid crystal element 775. That is,the electrode 793 has a mesh shape. With this structure, the electrode793 does not block light emitted from the light-emitting element 782.Alternatively, the electrode 793 can have a structure which does notblock light transmitted through the liquid crystal element 775. Thus,since luminance is hardly reduced even when the touch panel 791 isplaced, a display device with high visibility and low power consumptioncan be achieved. Note that the electrode 794 can have a similarstructure.

In addition, since the electrodes 793 and 794 do not overlap with thelight-emitting element 782, the electrodes 793 and 794 can be formedusing a metal material with low visible light transmittance. In the casewhere the electrode 793 and the electrode 794 do not overlap with theliquid crystal element 775, a metal material having low transmittancewith respect to visible light can be used for the electrode 793 and theelectrode 794.

Accordingly, the resistance of the electrodes 793 and 794 can be reducedas compared with an electrode using an oxide material with high visiblelight transmittance, so that the sensitivity of the touch panel can beincreased.

For example, conductive nanowires may be used for the electrodes 793,794, and 796. The nanowires may have a mean diameter of greater than orequal to 1 nm and less than or equal to 100 nm, preferably greater thanor equal to 5 nm and less than or equal to 50 nm, further preferablygreater than or equal to 5 nm and less than or equal to 25 nm. As thenanowire, a carbon nanotube or a metal nanowire such as an Ag nanowire,a Cu nanowire, or an Al nanowire may be used. For example, in the casewhere an Ag nanowire is used for any one of or all of the electrodes664, 665, and 667, the transmittance of visible light can be greaterthan or equal to 89% and the sheet resistance can be greater than orequal to 40 Ω/square and less than or equal to 100 Ω/square.

Although the structure of the in-cell touch panel is illustrated in FIG.45 and FIG. 46, one embodiment of the present invention is not limitedthereto. For example, a touch panel formed over the display device 700(an on-cell touch panel), or a touch panel attached to the displaydevice 700 (an out-cell touch panel) may be used.

In this manner, the display device of one embodiment of the presentinvention can be combined with various types of touch panels.

At least part of this embodiment can be implemented in combination withany of the other embodiments described in this specification asappropriate.

Embodiment 4

In this embodiment, an example of a semiconductor device of oneembodiment of the present invention will be described. A transistor inthis embodiment is suitable for miniaturization.

<4-1. Structure Example of Transistor Suitable for Miniaturization>

FIGS. 47A to 47C illustrate a top surface of a transistor 200. FIG. 47Aillustrates a top surface of the transistor 200. For simplification ofthe figure, some films are omitted in FIG. 47A. FIG. 47B is across-sectional view taken along dashed-dotted line X1-X2 in FIG. 47A.FIG. 47C is a cross-sectional view taken along dashed-dotted line Y1-Y2in FIG. 47A.

The transistor 200 includes a conductor 205 (a conductor 205 a and aconductor 205 b) and a conductor 260 (a conductor 260 a and a conductor260 b) that function as gate electrodes; an insulator 220, an insulator222, an insulator 224, and an insulator 250 that function as gateinsulating layers; an oxide semiconductor 230 (an oxide semiconductor230 a, an oxide semiconductor 230 b, and an oxide semiconductor 230 c)that includes a region where a channel is formed; a conductor 240 a thatfunctions as one of a source and a drain; a conductor 240 b thatfunctions as the other of the source and the drain; and an insulator 280that includes excess oxygen.

The oxide semiconductor 230 includes the oxide semiconductor 230 a, theoxide semiconductor 230 b over the oxide semiconductor 230 a, and theoxide semiconductor 230 c over the oxide semiconductor 230 b. When thetransistor 200 is turned on, a current flows (a channel is formed)mainly in the oxide semiconductor 230 b. Although current sometimesflows through a region in the vicinity of the interface (a mixed regionin some cases) between the oxide semiconductor 230 b and the oxidesemiconductors 230 a and 230 c, the oxide semiconductors 230 a and 230 cfunction as insulators at the other region.

FIGS. 47A to 47C illustrate a stacked-layer structure in which theconductor 260 serving as a gate electrode includes the conductor 260 aand the conductor 260 b. The insulator 270 is provided over theconductor 260 serving as a gate electrode.

The conductor 205 is formed using a metal film containing an elementselected from molybdenum, titanium, tantalum, tungsten, aluminum,copper, chromium, neodymium, and scandium; a metal nitride filmcontaining any of the above elements as its component (e.g., a titaniumnitride film, a molybdenum nitride film, or a tungsten nitride film); orthe like. Alternatively, a conductive material such as indium tin oxide,indium oxide containing tungsten oxide, indium zinc oxide containingtungsten oxide, indium oxide containing titanium oxide, indium tin oxidecontaining titanium oxide, indium zinc oxide, or indium tin oxide towhich silicon oxide is added can also be used.

For example, a conductor having a barrier property with respect tohydrogen, e.g., tantalum nitride, may be used as the conductor 205 a,and tungsten, which has high conductivity, may be stacked thereover asthe conductor 205 b. The use of the combination of the materials canprevent diffusion of hydrogen into the oxide semiconductor 230 whileconductivity of a wiring is ensured. A two-layer structure of aconductor 205 a and a conductor 205 b is shown in FIGS. 47A to 47C, butthe structure of the conductor 205 is not limited thereto, and asingle-layer structure or a stacked-layer structure of three or morelayers may be used.

Each of the insulators 220 and 224 is preferably an insulator containingoxygen, such as a silicon oxide film or a silicon oxynitride film. Inparticular, the insulator 224 is preferably an insulator containingexcess oxygen (containing oxygen in excess of that in the stoichiometriccomposition). In the case where such an insulator containing excessoxygen is provided in contact with an oxide in the transistor 200,oxygen vacancies in the oxide can be compensated. Note that theinsulators 220 and 224 are not necessarily formed of the same material.

The insulator 222 preferably has a single-layer structure or astacked-layer structure using one or more of insulators such as siliconoxide, silicon oxynitride, silicon nitride oxide, aluminum oxide,hafnium oxide, tantalum oxide, zirconium oxide, lead zirconate titanate(PZT), strontium titanate (SrTiO₃), and (Ba,Sr)TiO₃ (BST). Aluminumoxide, bismuth oxide, germanium oxide, niobium oxide, silicon oxide,titanium oxide, tungsten oxide, yttrium oxide, or zirconium oxide may beadded to the insulator, for example. The insulator may be subjected tonitriding treatment. A layer of silicon oxide, silicon oxynitride, orsilicon nitride may be stacked over the insulator.

Note that the insulator 222 may have a stacked-layer structure of two ormore layers. In this case, the stacked layers are not necessarily formedof the same material but may be formed of different materials.

In the case where the insulator 222 including a high-k material isprovided between the insulator 220 and the insulator 224, electrons canbe trapped in the insulator 222 under specific conditions, and thethreshold voltage can be increased. As a result, the insulator 222 isnegatively charged in some cases.

For example, in the case where the insulator 220 and the insulator 224are formed using silicon oxide and the insulator 222 is formed using amaterial having a lot of electron trap states such as hafnium oxide,aluminum oxide, or tantalum oxide, the state where the potential of theconductor 205 is higher than the potential of the source electrode andthe drain electrode is kept at a temperature higher than the operatingtemperature or the storage temperature of the semiconductor device(e.g., at a temperature of 125° C. or higher and 450° C. or lower,typically 150° C. or higher and 300° C. or lower) for 10 milliseconds orlonger, typically one minute or longer. Thus, electrons are moved fromthe oxide in the transistor 200 to the conductor 205. At this time, someof the moving electrons are trapped by the electron trap states of theinsulator 222.

In the transistor in which a necessary amount of electrons is trapped bythe electron trap states of the insulator 222, the threshold voltage isshifted in the positive direction. By controlling the voltage of theconductor 205, the amount of electrons to be trapped can be controlled,and thus the threshold voltage can be controlled. The transistor 200having the structure is a normally-off transistor which is in anon-conduction state (also referred to as an off state) even when thegate voltage is 0 V.

The treatment for trapping the electrons may be performed in themanufacturing process of the transistor. For example, the treatment ispreferably performed at any step before factory shipment, such as afterthe formation of a conductor connected to a source conductor or a drainconductor of the transistor, after the preceding process (waferprocessing), after a wafer-dicing step, or after packaging.

The threshold voltages can be controlled by appropriate adjustment ofthe thicknesses of the insulator 220, the insulator 222, and theinsulator 224. A transistor having a low leakage current in an off statecan be provided. A transistor with stable electrical characteristics canbe provided. A transistor having a high on-state current can beprovided. A transistor with a small subthreshold swing value can beprovided. A highly reliable transistor can be provided.

The oxide semiconductor 230 a, the oxide semiconductor 230 b, and theoxide semiconductor 230 c are formed using metal oxide such as In-M-Znoxide (M is Al, Ga, Y, or Sn). In—Ga oxide or In—Zn oxide may be used asthe oxide semiconductor 230.

The insulator 250 can have a single-layer structure or a stacked-layerstructure using one or more of insulators such as silicon oxide, siliconoxynitride, silicon nitride oxide, aluminum oxide, hafnium oxide,tantalum oxide, zirconium oxide, lead zirconate titanate (PZT),strontium titanate (SrTiO₃), and (Ba,Sr)TiO₃ (BST). Aluminum oxide,bismuth oxide, germanium oxide, niobium oxide, silicon oxide, titaniumoxide, tungsten oxide, yttrium oxide, or zirconium oxide may be added tothe insulator, for example. The insulator may be subjected to nitridingtreatment. A layer of silicon oxide, silicon oxynitride, or siliconnitride may be stacked over the insulator.

As the insulator 250, like the insulator 224, an oxide insulator thatcontains oxygen in excess of the stoichiometric composition ispreferably used. When such an insulator containing excess oxygen isprovided in contact with the oxide semiconductor 230, oxygen vacanciesin the oxide semiconductor 230 can be reduced.

As the insulator 250, an insulating film formed of aluminum oxide,aluminum oxynitride, gallium oxide, gallium oxynitride, yttrium oxide,yttrium oxynitride, hafnium oxide, hafnium oxynitride, silicon nitride,or the like, which has barrier properties with respect to oxygen andhydrogen, can be used. The insulator formed of such a material functionsas a layer that prevents release of oxygen from the oxide semiconductor230 or entry of an impurity such as hydrogen from the outside.

Note that the insulator 250 may have a stacked-layer structure similarto that of the insulator 220, the insulator 222, and the insulator 224.When the insulator 250 includes an insulator in which a necessary amountof electrons is trapped by electron trap states, the threshold voltageof the transistor 200 can be shifted in the positive direction. Thetransistor 200 having the structure is a normally-off transistor whichis in a non-conduction state (also referred to as an off state) evenwhen the gate voltage is 0 V.

In addition to the insulator 250, a barrier film may be provided betweenthe oxide semiconductor 230 and the conductor 260 in the semiconductordevice illustrated in FIGS. 47A to 47C. The oxide semiconductor 230 cmay have a barrier property.

For example, an insulating film containing excess oxygen is provided incontact with the oxide semiconductor 230 and covered by a barrier film,whereby the composition of the oxide can be almost the same as thestoichiometric composition or can be in a supersaturated statecontaining more oxygen than that in the stoichiometric composition. Itis also possible to prevent entry of impurities such as hydrogen intothe oxide semiconductor 230.

One of a pair of the conductor 240 a and the conductor 240 b functionsas a source electrode, and the other pair functions as a drainelectrode.

Any of metals such as aluminum, titanium, chromium, nickel, copper,yttrium, zirconium, molybdenum, silver, tantalum, and tungsten, or analloy containing any of the metals as its main component can be used foreach of the conductors 240 a and 240 b. Although a single layerstructure is shown in figures, a stacked-layer structure of two or morelayers may be used.

For example, a titanium film and an aluminum film are may be stacked.Other examples include a two-layer structure where an aluminum film isstacked over a tungsten film, a two-layer structure where a copper filmis stacked over a copper-magnesium-aluminum alloy film, a two-layerstructure where a copper film is stacked over a titanium film, and atwo-layer structure where a copper film is stacked over a tungsten film.

Other examples include a three-layer structure where a titanium film ora titanium nitride film is formed, an aluminum film or a copper film isstacked over the titanium film or the titanium nitride film, and atitanium film or a titanium nitride film is formed over the aluminumfilm or the copper film; and a three-layer structure where a molybdenumfilm or a molybdenum nitride film is formed, an aluminum film or acopper film is stacked over the molybdenum film or the molybdenumnitride film, and a molybdenum film or a molybdenum nitride film isformed over the aluminum film or the copper film. Note that atransparent conductive material containing indium oxide, tin oxide, orzinc oxide may be used.

The conductor 260 functioning as a gate electrode can be formed using,for example, a metal selected from aluminum, chromium, copper, tantalum,titanium, molybdenum, and tungsten, an alloy containing any of thesemetals as its component, an alloy containing any of these metals incombination, or the like. Furthermore, one or both of manganese andzirconium may be used. Alternatively, a semiconductor typified bypolycrystalline silicon doped with an impurity element such asphosphorus, or a silicide such as nickel silicide may be used.

For example, a two-layer structure in which a titanium film is stackedover an aluminum film. Other examples include a two-layer structurewhere a titanium film is stacked over a titanium nitride film, atwo-layer structure where a tungsten film is stacked over a titaniumnitride film, and a two-layer structure where a tungsten film is stackedover a tantalum nitride film or a tungsten nitride film.

Other examples include a three-layer structure where a titanium film isformed, an aluminum film is stacked over the titanium film, and atitanium film is formed over the aluminum film. Alternatively, an alloyfilm or a nitride film that contains aluminum and one or more elementsselected from titanium, tantalum, tungsten, molybdenum, chromium,neodymium, and scandium may be used.

The conductor 260 can also be formed using a light-transmittingconductive material such as indium tin oxide, indium oxide containingtungsten oxide, indium zinc oxide containing tungsten oxide, indiumoxide containing titanium oxide, indium tin oxide containing titaniumoxide, indium zinc oxide, or indium tin oxide to which silicon oxide isadded. It is also possible to have a stacked-layer structure formedusing the above light-transmitting conductive material and the abovemetal.

The conductor 260 a is formed by a thermal CVD method, an MOCVD method,and an ALD method. In particular, the conductor 260 a is preferablyformed by an atomic layer deposition (ALD) method. Plasma damage to theinsulator 250 can be reduced by using an ALD method and the like. Inaddition, the ALD method is preferable because coverage can be improved.Accordingly, a highly reliable transistor 200 can be provided.

The conductor 260 b is formed by a material with high conductivity suchas tantalum, tungsten, copper, or aluminum.

The insulator 270 may be provided to cover the conductor 260. In thecase where the insulator 280 is formed using an oxide material fromwhich oxygen is released, the insulator 270 is formed using a substancehaving a barrier property with respect to oxygen to prevent theconductor 260 from being oxidized by the released oxygen.

For example, the insulator 270 can be formed using metal oxide such asaluminum oxide. The insulator 270 is formed to a thickness with whichthe oxidation of the conductor 260 is prevented. For example, thethickness of the insulator 270 is set greater than or equal to 1 nm andless than or equal to 10 nm, preferably greater than or equal to 3 nmand less than or equal to 7 nm.

Thus, the oxidation of the conductor 260 can be prevented, and oxygenreleased from the insulator 280 can be supplied to the oxidesemiconductor 230 efficiently.

An insulator 280 is provided over the transistor 200. The insulator 280preferably includes oxide containing oxygen in excess of that in thestoichiometric composition. That is, in the insulator 280, a regioncontaining oxygen in excess of that in the stoichiometric composition(hereinafter also referred to as excess-oxygen region) is preferablyformed. In particular, in the case of using an oxide semiconductor inthe transistor 200, when an insulator including an excess-oxygen regionis provided as an interlayer film or the like in the vicinity of thetransistor 200, oxygen vacancies in the transistor 200 are reduced,whereby the reliability can be improved.

As the insulator including the excess-oxygen region, specifically, anoxide material that releases part of oxygen by heating is preferablyused.

For example, as such a material, a material containing silicon oxide orsilicon oxynitride is preferably used. Alternatively, a metal oxide canbe used. Note that in this specification, silicon oxynitride refers to amaterial that contains oxygen at a higher proportion than nitrogen, andsilicon nitride oxide refers to a material that contains nitrogen at ahigher proportion than oxygen.

The insulator 280 covering the transistor 200 may function as aplanarization film that covers a roughness thereunder.

<4-2. Application Example of Transistor Suitable for Miniaturization>

An example of stacking transistors with different compositions isdescribed below.

A semiconductor device shown in FIG. 48 includes a transistor 400, atransistor 200, and a capacitor 410.

The transistor 200 is a transistor in which a channel is formed in asemiconductor layer including an oxide semiconductor. Since theoff-state current of the transistor 200 is small, by using thetransistor 200 in the semiconductor device (memory device), stored datacan be held for a long time. In other words, it is possible to obtain asemiconductor device (memory device) which does not require refreshoperation or has an extremely low frequency of the refresh operation,which leads to a sufficient reduction in power consumption.

The semiconductor device includes the transistor 400, the transistor200, and the capacitor 410 as shown in FIG. 48. The transistor 200 isprovided over the transistor 400, and the capacitor 410 is provided overthe transistor 400 and the transistor 200.

The transistor 400 is provided over a substrate 401 and includes aconductor 406, an insulator 404, a semiconductor region 402 that is apart of the substrate 401, and low-resistance regions 408 a and 408 bfunctioning as a source region and a drain region.

The transistor 400 may be a p-channel transistor or an n-channeltransistor.

It is preferable that a region of the semiconductor region 402 where achannel is formed, a region in the vicinity thereof, the low-resistanceregions 408 a and 408 b functioning as a source region and a drainregion, and the like contain a semiconductor such as a silicon-basedsemiconductor, further preferably single crystal silicon. Alternatively,a material including germanium (Ge), silicon germanium (SiGe), galliumarsenide (GaAs), gallium aluminum arsenide (GaAlAs), or the like may becontained. Silicon whose effective mass is controlled by applying stressto the crystal lattice and thereby changing the lattice spacing may becontained. Alternatively, the transistor 400 may be ahigh-electron-mobility transistor (HEMT) with GaAs and GaAlAs or thelike.

The low-resistance regions 408 a and 408 b contain an element whichimparts n-type conductivity, such as arsenic or phosphorus, or anelement which imparts p-type conductivity, such as boron, in addition toa semiconductor material used for the semiconductor region 402.

The conductor 406 functioning as a gate electrode can be formed using asemiconductor material such as silicon containing the element whichimparts n-type conductivity, such as arsenic or phosphorus, or theelement which imparts p-type conductivity, such as boron, or aconductive material such as a metal material, an alloy material, or ametal oxide material.

Note that a material of the conductor determines the work function,whereby the threshold voltage can be adjusted. Specifically, it ispreferable to use titanium nitride, tantalum nitride, or the like as theconductor. Furthermore, in order to ensure the conductivity andembeddability of the conductor, it is preferable to use a laminatedlayer of metal materials such as tungsten and aluminum as the conductor.In particular, tungsten is preferable in terms of heat resistance.

Note that the transistor 400 shown in FIG. 48 is just an example and isnot limited to the structure shown therein; an appropriate transistormay be used in accordance with a circuit configuration or a drivingmethod.

An insulator 420, an insulator 422, an insulator 424, and an insulator426 are stacked sequentially and cover the transistor 400.

As the insulator 420, the insulator 422, the insulator 424, and theinsulator 426, for example, silicon oxide, silicon oxynitride, siliconnitride oxide, silicon nitride, aluminum oxide, aluminum oxynitride,aluminum nitride oxide, or aluminum nitride may be used.

The insulator 422 functions as a planarization film for eliminating alevel difference caused by the transistor 400 or the like underlying theinsulator 422. A top surface of the insulator 422 may be planarized byplanarization treatment using a chemical mechanical polishing (CMP)method or the like to increase the level of planarity.

The insulator 424 is preferably formed using, for example, a film havinga barrier property that prevents hydrogen or impurities from diffusingfrom the substrate 401, the transistor 400, or the like into a regionwhere the transistor 200 is formed.

As an example of the film having a barrier property with respect tohydrogen, silicon nitride formed by a CVD method can be given. Diffusionof hydrogen into a semiconductor element including an oxidesemiconductor, such as the transistor 200, degrades the characteristicsof the semiconductor element in some cases. Therefore, a film thatprevents hydrogen diffusion is preferably provided between thetransistor 200 and the transistor 400. Specifically, the film thatprevents hydrogen diffusion is a film from which hydrogen is less likelyto be released.

Note that the dielectric constant of the insulator 426 is preferablylower than that of the insulator 424. For example, the relativedielectric constant of the insulator 426 is preferably lower than 4,further preferably lower than 3. For example, the relative dielectricconstant of the insulator 424 is preferably 0.7 times or less that ofthe insulator 426, further preferably 0.6 times or less that of theinsulator 426. In the case where a material with a low dielectricconstant is used as an interlayer film, the parasitic capacitancebetween wirings can be reduced.

A conductor 428, a conductor 430, and the like that are electricallyconnected to the capacitor 410 or the transistor 200 are embedded in theinsulator 420, the insulator 422, the insulator 424, and the insulator426. Note that the conductor 428 and the conductor 430 each function asa plug or a wiring. Note that a plurality of structures of conductorsfunctioning as plugs or wirings are collectively denoted by the samereference numeral in some cases, as described later. Furthermore, inthis specification and the like, a wiring and a plug electricallyconnected to the wiring may be a single component. That is, there arecases where a part of a conductor functions as a wiring and a part of aconductor functions as a plug.

As a material of each of plugs and wirings (e.g., the conductor 428 andthe conductor 430), a conductive material such as a metal material, analloy material, a metal nitride material, or a metal oxide material canbe used in a single-layer structure or a stacked-layer structure. It ispreferable to use a high-melting-point material that has both heatresistance and conductivity, such as tungsten or molybdenum, and it isparticularly preferable to use tungsten. Alternatively, a low-resistanceconductive material such as aluminum or copper is preferably used. Theuse of a low-resistance conductive material can reduce wiringresistance.

Furthermore, the conductor 428 and the conductor 430 preferably includea conductor having a barrier property with respect to hydrogen. Theconductor having a barrier property with respect to hydrogen is formedparticularly in an opening portion of the insulator 424 having a barrierproperty with respect to hydrogen. In such a structure, the transistor400 and the transistor 200 can be separated by a layer having a barrierproperty, so that diffusion of hydrogen from the transistor 400 to thetransistor 200 can be prevented.

Note that as the conductor having a barrier property with respect tohydrogen, tantalum nitride may be used, for example. By stackingtantalum nitride and tungsten, which has high conductivity, diffusion ofhydrogen from the transistor 400 can be prevented while the conductivityof a wiring is ensured. In this case, a tantalum nitride layer having abarrier property with respect to hydrogen is preferably in contact withthe insulator 424 having a barrier property with respect to hydrogen.

A wiring layer may be provided over the insulator 426 and the conductor430. For example, in FIG. 48, an insulator 450, an insulator 452, and aninsulator 454 are stacked sequentially. The conductor 456 is formed inthe insulator 450, the insulator 452, and the insulator 454. Theconductor 456 functions as a plug or a wiring. Note that the conductor456 can be formed using a material similar to that used for forming theconductor 428 and the conductor 430.

In addition, the conductor 456 is preferably formed using alow-resistance conductive material such as aluminum or copper. The useof a low-resistance conductive material can reduce wiring resistance.When copper is used as the conductor 456, the conductor 456 ispreferably stacked with the conductor which inhibits diffusion ofcopper. As the conductor which inhibits diffusion of copper, forexample, tantalum, an alloy containing tantalum such as tantalumnitride, ruthenium, an alloy containing ruthenium, or the like ispreferably used.

Furthermore, an insulator which inhibits diffusion of copper or has abarrier property against oxygen and hydrogen is preferably used as theinsulator 450. For example, a silicon nitride film can be used as a filmwhich inhibits diffusion of copper. Therefore, the insulator 450 can beformed using a material similar to that used for forming the insulator424.

In particular, it is preferable to provide the conductor which inhibitsdiffusion of copper in contact with an opening of the insulator 450which inhibits diffusion of copper. Copper is preferably stacked overthe conductor which inhibits diffusion of copper. In such a structure,diffusion of copper around wirings can be prevented.

An insulator 458, an insulator 210, an insulator 212, and an insulator214 are stacked in this order over the insulator 454. A materialinhibiting diffusion of copper or a material having a barrier propertyagainst oxygen or hydrogen is preferably used for one or all of theinsulator 458, the insulator 210, the insulator 212, and the insulator214.

The insulator 458 and the insulator 212 are preferably formed using, forexample, a film inhibiting diffusion of copper or a film having abarrier property that prevents hydrogen or impurities from diffusingfrom a region where the substrate 401 or the transistor 400 is formed orthe like into a region where the transistor 200 is formed. Therefore,the insulator 458 and the insulator 212 can be formed using a materialsimilar to that used for forming the insulator 424.

The insulator 210 can be formed using a material similar to that of theinsulator 420. For example, a silicon oxide film, a silicon oxynitridefilm, or the like can be used as the insulator 210.

As the insulator 214, metal oxide such as aluminum oxide, hafnium oxide,or tantalum oxide is preferably used, for example.

In particular, aluminum oxide has an excellent blocking effect thatprevents permeation of oxygen and impurities such as hydrogen andmoisture which cause a change in electrical characteristics of thetransistor. Accordingly, the use of aluminum oxide can prevent entry ofimpurities such as hydrogen and moisture into the transistor 200 in andafter a manufacturing process of the transistor. In addition, release ofoxygen from oxide in the transistor 200 can be prevented. Therefore,aluminum oxide is suitably used as a protective film for the transistor200.

An insulator 216 is provided over the insulator 214. The insulator 216can be formed using a material similar to that used for forming theinsulator 420. For example, a silicon oxide film, a silicon oxynitridefilm, or the like can be used as the insulator 216.

A conductor 218, a conductor 205 forming the transistor 200, and thelike are embedded in the insulator 458, the insulator 210, the insulator212, the insulator 214, and the insulator 216. Note that the conductor218 functions as a plug or a wiring that is electrically connected tothe capacitor 410 or the transistor 400. The conductor 218 can be formedusing a material similar to that used for forming the conductor 428 andthe conductor 430.

In particular, the conductor 218 in contact with the insulator 458, theinsulator 212, and the insulator 214 is preferably a conductorinhibiting diffusion of copper or having a barrier property againstoxygen, hydrogen, and water. In this structure, the transistor 400 andthe transistor 200 can be completely separated by a layer inhibitingdiffusion of copper or having a barrier property against oxygen,hydrogen, and water. In other words, diffusion of copper from theconductor 456 can be inhibited and diffusion of hydrogen from thetransistor 400 to the transistor 200 can be prevented.

The transistor 200 and the insulator 280 are provided over the insulator214. Note that the transistor 200 shown in FIG. 48 is just an exampleand is not limited to the structure shown therein; an appropriatetransistor may be used in accordance with a circuit configuration or adriving method.

An insulator 282, an insulator 284, and an insulator 470 are stackedsequentially over the insulator 280. A conductor 244 and the like areembedded in an insulator 220, an insulator 222, an insulator 224, theinsulator 280, the insulator 282, the insulator 284, and the insulator470. A conductor 245 and the like which connect a conductor in an abovelayer are provided over the conductor such as the conductor 240 a andthe conductor 240 b included in the transistor 200. Note that theconductor 244 functions as a plug or a wiring that is electricallyconnected to the capacitor 410, the transistor 200, or the transistor400. The conductor 244 can be formed using a material similar to thatused for forming the conductor 428 and the conductor 430.

A material having a barrier property against oxygen or hydrogen ispreferably used for one or both of the insulator 282 and the insulator284. Thus, the insulator 282 can be formed using a material similar tothat used for forming the insulator 214. The insulator 284 can be formedusing a material similar to that used for forming the insulator 212.

As the insulator 282, metal oxide such as aluminum oxide, hafnium oxide,or tantalum oxide is preferably used, for example.

In particular, aluminum oxide has an excellent blocking effect thatprevents permeation of oxygen and impurities such as hydrogen andmoisture which cause a change in electrical characteristics of thetransistor. Accordingly, the use of aluminum oxide can prevent entry ofimpurities such as hydrogen and moisture into the transistor 200 in andafter a manufacturing process of the transistor. In addition, release ofoxygen from oxide in the transistor 200 can be prevented. Therefore,aluminum oxide is suitably used as a protective film for the transistor200.

The insulator 284 is preferably formed using, for example, a film havinga barrier property that prevents hydrogen or impurities from diffusingfrom a region where the capacitor 410 is formed into a region where thetransistor 200 is formed. Therefore, the insulator 284 can be formedusing a material similar to that used for forming the insulator 424.

As an example of the film having a barrier property against hydrogen,silicon nitride formed by a CVD method can be given. Diffusion ofhydrogen into a semiconductor element including an oxide semiconductor,such as the transistor 200, degrades the characteristics of thesemiconductor element in some cases. Therefore, a film that preventshydrogen diffusion is preferably provided between the transistor 200 andthe transistor 400. Specifically, the film that prevents hydrogendiffusion is a film from which hydrogen is less likely to be released.

Therefore, a structure can be obtained in which the transistor 200 andthe insulator 280 including the excess-oxygen region are positionedbetween a stacked-layer structure of the insulator 210, the insulator212, and the insulator 214 and a stacked-layer structure of theinsulator 282 and the insulator 284. The insulator 210, the insulator212, the insulator 214, the insulator 282 and the insulator 284 have abarrier property that prevents diffusion of oxygen or impurities such ashydrogen and water.

Accordingly, oxygen released from the insulator 280 and the transistor200 can be prevented from diffusing into the layer where the capacitor410 is formed or the layer where the transistor 400 is formed.Furthermore, impurities such as hydrogen and water can be prevented fromdiffusing from a layer over the insulator 282 and a layer under theinsulator 214 into the transistor 200.

That is, oxygen can be efficiently supplied from the excess-oxygenregion of the insulator 280 to oxide where a channel is formed in thetransistor 200, so that oxygen vacancies can be reduced. Moreover,oxygen vacancies can be prevented from being formed by impurities in theoxide where a channel is formed in the transistor 200. Thus, the oxidewhere a channel is formed in the transistor 200 can be an oxidesemiconductor with a low density of defect states and stablecharacteristics. That is, a change in electrical characteristics of thetransistor 200 can be prevented and the reliability can be improved.

The capacitor 410 and a conductor 474 are provided over the insulator470. The capacitor 410 is provided over the insulator 470 and includesthe conductor 462, the insulator 480, the insulator 482, the insulator484, and the conductor 466. Note that the conductor 474 functions as aplug or a wiring that is electrically connected to the capacitor 410,the transistor 200, or the transistor 400.

The conductor 462 can be formed using a conductive material such as ametal material, an alloy material, or a metal oxide material. It ispreferable to use a high-melting-point material which has both heatresistance and conductivity, such as tungsten or molybdenum, and it isparticularly preferable to use tungsten. In the case where the conductor462 is formed concurrently with another component such as a conductor,Cu (copper), Al (aluminum), or the like which is a low-resistance metalmaterial may be used.

Note that the conductor 474 can be formed using a material similar tothat used for forming the conductor 462 functioning as an electrode ofthe capacitor.

The insulator 480, the insulator 482, the insulator 484 are providedover the conductor 474 and the conductor 462. As the insulator 480, theinsulator 482, and the insulator 484, silicon oxide, silicon oxynitride,silicon nitride oxide, silicon nitride, aluminum oxide, aluminumoxynitride, aluminum nitride oxide, aluminum nitride, hafnium oxide,hafnium oxynitride, hafnium nitride oxide, hafnium nitride, or the likemay be used. Although a three-layer structure is shown in the drawings,a single layer, two-layer, or stacked-layer structure of four or morelayers may be used.

For example, a material with high dielectric strength such as siliconoxynitride is preferably used as the insulator 480 and the insulator484. In addition, as the insulator 484, a high dielectric constant(high-k) material such as aluminum oxide is preferably stacked with amaterial with high dielectric strength such as silicon oxynitride. Withthis structure, the capacitor 410 can have a sufficient capacitanceowing to a high dielectric constant (high-k) insulator and can have ahigher dielectric strength owing to an insulator with high dielectricstrength for avoiding electrostatic breakdown.

The conductor 466 is provided over the conductor 462 with the insulator480, the insulator 482, and the insulator 484 provided therebetween.Note that the conductor 466 can be formed using a conductive materialsuch as a metal material, an alloy material, or a metal oxide material.It is preferable to use a high-melting-point material which has bothheat resistance and conductivity, such as tungsten or molybdenum, and itis particularly preferable to use tungsten. In the case where theconductor 466 is formed concurrently with another component such as aconductor, Cu (copper), Al (aluminum), or the like which is alow-resistance metal material may be used.

For example, the insulator 480, the insulator 482, and the insulator 484are provided to cover the top surface and the side surface of theconductor 462 as illustrated in FIG. 48. Furthermore, the conductor 466is provided to cover the top surface and the side surface of theconductor 462 with the insulator 480, the insulator 482, and theinsulator 484 provided therebetween.

That is, a capacitance is formed also on the side surface of theconductor 462, so that a capacitance per projected area of a capacitorcan be increased. Thus, the semiconductor device can be reduced in area,highly integrated, and miniaturized.

An insulator 460 is provided over the conductor 466 and the insulator484. The insulator 460 can be formed using a material similar to thatused for forming the insulator 420. The insulator 460 covering thecapacitor 410 may function as a planarization film that covers aroughness thereunder.

The above is the description of the application example.

At least part of this embodiment can be implemented in combination withany of the other embodiments described in this specification asappropriate.

Embodiment 5

In this embodiment, a display device that includes the semiconductordevice of one embodiment of the present invention is described withreference to FIGS. 49A to 49C.

<5. Circuit Configuration of Display Device>

The display device illustrated in FIG. 49A includes a region includingpixels of display elements (hereinafter the region is referred to as apixel portion 502), a circuit portion being provided outside the pixelportion 502 and including a circuit for driving the pixels (hereinafterthe portion is referred to as a driver circuit portion 504), circuitseach having a function of protecting an element (hereinafter thecircuits are referred to as protection circuits 506), and a terminalportion 507. Note that the protection circuits 506 are not necessarilyprovided.

Part or the whole of the driver circuit portion 504 is preferably formedover a substrate over which the pixel portion 502 is formed. Thus, thenumber of components and the number of terminals can be reduced. Whenpart or the whole of the driver circuit portion 504 is not formed overthe substrate over which the pixel portion 502 is formed, the part orthe whole of the driver circuit portion 504 can be mounted by COG ortape automated bonding (TAB).

The pixel portion 502 includes a plurality of circuits for drivingdisplay elements arranged in X rows (X is a natural number of 2 or more)and Y columns (Y is a natural number of 2 or more) (hereinafter, suchcircuits are referred to as pixel circuits 501). The driver circuitportion 504 includes driver circuits such as a circuit for supplying asignal (scan signal) to select a pixel (hereinafter, the circuit isreferred to as a gate driver 504 a) and a circuit for supplying a signal(data signal) to drive a display element in a pixel (hereinafter, thecircuit is referred to as a source driver 504 b).

The gate driver 504 a includes a shift register or the like. The gatedriver 504 a receives a signal for driving the shift register throughthe terminal portion 507 and outputs a signal. For example, the gatedriver 504 a receives a start pulse signal, a clock signal, or the likeand outputs a pulse signal. The gate driver 504 a has a function ofcontrolling the potentials of wirings supplied with scan signals(hereinafter, such wirings are referred to as scan lines GL_1 to GL_X).Note that a plurality of gate drivers 504 a may be provided to controlthe scan lines GL_1 to GL_X separately. Alternatively, the gate driver504 a has a function of supplying an initialization signal. Withoutbeing limited thereto, the gate driver 504 a can supply another signal.

The source driver 504 b includes a shift register or the like. Thesource driver 504 b receives a signal (image signal) from which a datasignal is derived, as well as a signal for driving the shift register,through the terminal portion 507. The source driver 504 b has a functionof generating a data signal to be written to the pixel circuit 501 whichis based on the image signal. In addition, the source driver 504 b has afunction of controlling output of a data signal in response to a pulsesignal produced by input of a start pulse signal, a clock signal, or thelike. Furthermore, the source driver 504 b has a function of controllingthe potentials of wirings supplied with data signals (hereinafter suchwirings are referred to as data lines DL_1 to DL_Y). Alternatively, thesource driver 504 b has a function of supplying an initializationsignal. Without being limited thereto, the source driver 504 b cansupply another signal.

The source driver 504 b includes a plurality of analog switches, forexample. The source driver 504 b can output, as the data signals,signals obtained by time-dividing the image signal by sequentiallyturning on the plurality of analog switches. The source driver 504 b mayinclude a shift register or the like.

A pulse signal and a data signal are input to each of the plurality ofpixel circuits 501 through one of the plurality of scan lines GLsupplied with scan signals and one of the plurality of data lines DLsupplied with data signals, respectively. Writing and holding of thedata signal to and in each of the plurality of pixel circuits 501 arecontrolled by the gate driver 504 a. For example, to the pixel circuit501 in the m-th row and the n-th column (m is a natural number of lessthan or equal to X, and n is a natural number of less than or equal toY), a pulse signal is input from the gate driver 504 a through the scanline GL_m, and a data signal is input from the source driver 504 bthrough the data line DL_n in accordance with the potential of the scanline GL_m.

The protection circuit 506 in FIG. 49A is connected to, for example, thescan line GL between the gate driver 504 a and the pixel circuit 501.Alternatively, the protection circuit 506 is connected to the data lineDL between the source driver 504 b and the pixel circuit 501.Alternatively, the protection circuit 506 can be connected to a wiringbetween the gate driver 504 a and the terminal portion 507.Alternatively, the protection circuit 506 can be connected to a wiringbetween the source driver 504 b and the terminal portion 507. Note thatthe terminal portion 507 means a portion having terminals for inputtingpower, control signals, and image signals to the display device fromexternal circuits.

The protection circuit 506 is a circuit that electrically connects awiring connected to the protection circuit to another wiring when apotential out of a certain range is applied to the wiring connected tothe protection circuit.

As shown in FIG. 49A, the protection circuits 506 are provided for thepixel portion 502 and the driver circuit portion 504, so that theresistance of the display device to overcurrent generated byelectrostatic discharge (ESD) or the like can be improved. Note that theconfiguration of the protection circuits 506 is not limited to that, andfor example, the protection circuit 506 may be configured to beconnected to the gate driver 504 a or the protection circuit 506 may beconfigured to be connected to the source driver 504 b. Alternatively,the protection circuit 506 may be configured to be connected to theterminal portion 507.

In FIG. 49A, an example in which the driver circuit portion 504 includesthe gate driver 504 a and the source driver 504 b is shown; however, thestructure is not limited thereto. For example, only the gate driver 504a may be formed and a separately prepared substrate where a sourcedriver circuit is formed (e.g., a driver circuit substrate formed with asingle crystal semiconductor film or a polycrystalline semiconductorfilm) may be mounted.

Each of the plurality of pixel circuits 501 in FIG. 49A can have thestructure illustrated in FIG. 49B, for example.

The pixel circuit 501 in FIG. 49B includes a liquid crystal element 570,a transistor 550, and a capacitor 560. As the transistor 550, any of thetransistors described in the above embodiment, for example, can be used.

The potential of one of a pair of electrodes of the liquid crystalelement 570 is set in accordance with the specifications of the pixelcircuit 501 as appropriate. The alignment state of the liquid crystalelement 570 depends on written data. A common potential may be suppliedto one of the pair of electrodes of the liquid crystal element 570included in each of the plurality of pixel circuits 501. Furthermore,the potential supplied to one of the pair of electrodes of the liquidcrystal element 570 in the pixel circuit 501 in one row may be differentfrom the potential supplied to one of the pair of electrodes of theliquid crystal element 570 in the pixel circuit 501 in another row.

As examples of a driving method of the display device including theliquid crystal element 570, any of the following modes can be given: aTN mode, an STN mode, a VA mode, an axially symmetric aligned micro-cell(ASM) mode, an optically compensated birefringence (OCB) mode, aferroelectric liquid crystal (FLC) mode, an antiferroelectric liquidcrystal (AFLC) mode, an MVA mode, a patterned vertical alignment (PVA)mode, an IPS mode, an FFS mode, a transverse bend alignment (TBA) mode,and the like. Other examples of the method of driving the display deviceinclude an electrically controlled birefringence (ECB) mode, apolymer-dispersed liquid crystal (PDLC) mode, a polymer network liquidcrystal (PNLC) mode, and a guest-host mode. A variety of liquid crystalelements and the driving methods thereof can be used.

In the pixel circuit 501 in the m-th row and the n-th column, one of asource electrode and a drain electrode of the transistor 550 iselectrically connected to the data line DL_n, and the other iselectrically connected to the other of the pair of electrodes of theliquid crystal element 570. A gate electrode of the transistor 550 iselectrically connected to the scan line GL_m. The transistor 550 has afunction of controlling whether to write a data signal by being turnedon or off.

One of a pair of electrodes of the capacitor 560 is electricallyconnected to a wiring to which a potential is supplied (hereinafterreferred to as a potential supply line VL), and the other iselectrically connected to the other of the pair of electrodes of theliquid crystal element 570. The potential of the potential supply lineVL is set in accordance with the specifications of the pixel circuit 501as appropriate. The capacitor 560 functions as a storage capacitor forstoring written data.

For example, in the display device including the pixel circuit 501 inFIG. 49B, the pixel circuits 501 are sequentially selected row by row bythe gate driver 504 a illustrated in FIG. 49A, whereby the transistors550 are turned on and a data signal is written.

When the transistors 550 are turned off, the pixel circuits 501 in whichthe data has been written are brought into a holding state. Thisoperation is sequentially performed row by row; thus, an image can bedisplayed.

Alternatively, each of the plurality of pixel circuits 501 in FIG. 49Acan have the structure illustrated in FIG. 49C, for example.

The pixel circuit 501 illustrated in FIG. 49C includes transistors 552and 554, a capacitor 562, and a light-emitting element 572. Any of thetransistors described in the above embodiment, for example, can be usedas one or both of the transistors 552 and 554.

One of a source electrode and a drain electrode of the transistor 552 iselectrically connected to a wiring to which a data signal is supplied(hereinafter referred to as a signal line DL_n). A gate electrode of thetransistor 552 is electrically connected to a wiring to which a gatesignal is supplied (hereinafter referred to as a scan line GL_m).

The transistor 552 has a function of controlling whether to write a datasignal by being turned on or off.

One of a pair of electrodes of the capacitor 562 is electricallyconnected to a wiring to which a potential is supplied (hereinafterreferred to as a potential supply line VL_a), and the other iselectrically connected to the other of the source electrode and thedrain electrode of the transistor 552.

The capacitor 562 functions as a storage capacitor for storing writtendata.

One of a source electrode and a drain electrode of the transistor 554 iselectrically connected to the potential supply line VL_a. Furthermore, agate electrode of the transistor 554 is electrically connected to theother of the source electrode and the drain electrode of the transistor552.

One of an anode and a cathode of the light-emitting element 572 iselectrically connected to a potential supply line VL_b, and the other iselectrically connected to the other of the source electrode and thedrain electrode of the transistor 554.

As the light-emitting element 572, an organic electroluminescent element(also referred to as an organic EL element) can be used, for example.Note that the light-emitting element 572 is not limited to an organic ELelement; an inorganic EL element including an inorganic material may beused.

Note that a high power supply potential VDD is supplied to one of thepotential supply line VL_a and the potential supply line VL_b, and a lowpower supply potential VSS is supplied to the other.

For example, in the display device including the pixel circuit 501 inFIG. 49C, the pixel circuits 501 are sequentially selected row by row bythe gate driver 504 a illustrated in FIG. 49A, whereby the transistor552 is turned on and a data signal is written.

When the transistor 552 is turned off, the pixel circuits 501 in whichthe data has been written are brought into a holding state. Furthermore,the amount of current flowing between the source electrode and the drainelectrode of the transistor 554 is controlled in accordance with thepotential of the written data signal. The light-emitting element 572emits light with luminance corresponding to the amount of flowingcurrent. This operation is sequentially performed row by row; thus, animage is displayed.

At least part of this embodiment can be implemented in combination withany of the other embodiments described in this specification asappropriate.

Embodiment 6

In this embodiment, circuit configuration examples to which thetransistors described in the above embodiments can be applied will bedescribed with reference to FIGS. 50A to 50C, FIGS. 51A to 51C, FIGS.52A and 52B, and FIGS. 53A and 53B.

<6. Configuration Example of Inverter Circuit>

FIG. 50A is a circuit diagram of an inverter which can be used for ashift register, a buffer, or the like included in the driver circuit. Aninverter 800 outputs a signal whose logic is inverted from the logic ofa signal supplied to an input terminal IN to an output terminal OUT. Theinverter 800 includes a plurality of OS transistors. A signal S_(BG) canswitch electrical characteristics of the OS transistors.

FIG. 50B illustrates an example of the inverter 800. The inverter 800includes OS transistors 810 and 820. The inverter 800 can be formedusing only n-channel transistors; thus, the inverter 800 can be formedat lower cost than an inverter formed using a complementary metal oxidesemiconductor (i.e., a CMOS inverter).

Note that the inverter 800 including the OS transistors can be providedover a CMOS circuit including Si transistors. Since the inverter 800 canbe provided so as to overlap with the CMOS circuit, no additional areais required for the inverter 800, and thus, an increase in the circuitarea can be suppressed.

Each of the OS transistors 810 and 820 includes a first gate functioningas a front gate, a second gate functioning as a back gate, a firstterminal functioning as one of a source and a drain, and a secondterminal functioning as the other of the source and the drain.

The first gate of the OS transistor 810 is connected to its secondterminal. The second gate of the OS transistor 810 is connected to awiring that supplies the signal S_(BG). The first terminal of the OStransistor 810 is connected to a wiring which supplies a voltage VDD.The second terminal of the OS transistor 810 is connected to the outputterminal OUT.

The first gate of the OS transistor 820 is connected to the inputterminal IN. The second gate of the OS transistor 820 is connected tothe input terminal IN. The first terminal of the OS transistor 820 isconnected to the output terminal OUT. The second terminal of the OStransistor 820 is connected to a wiring which supplies a voltage VSS.

FIG. 50C is a timing chart illustrating the operation of the inverter800. The timing chart in FIG. 50C illustrates changes of a signalwaveform of the input terminal IN, a signal waveform of the outputterminal OUT, a signal waveform of the signal S_(BG), and the thresholdvoltage of the OS transistor 810.

The signal S_(BG) can be supplied to the second gate of the OStransistor 810 to control the threshold voltage of the OS transistor810.

The signal S_(BG) includes a voltage V_(BG) _(_) _(A) for shifting thethreshold voltage in the negative direction and a voltage V_(BG) _(_)_(B) for shifting the threshold voltage in the positive direction. Thethreshold voltage of the OS transistor 810 can be shifted in thenegative direction to be a threshold voltage V_(TH) _(_) _(A) when thevoltage V_(BG) _(_) _(A) is applied to the second gate. The thresholdvoltage of the OS transistor 810 can be shifted in the positivedirection to be a threshold voltage V_(TH) _(_) _(B) when the voltageV_(BG) _(_) _(B) is applied to the second gate.

To visualize the above description, FIG. 51A shows an I_(d)-V_(g) curve,which is one of indicators of the transistor's electricalcharacteristics.

When a high voltage such as the voltage V_(BG) _(_) _(A) is applied tothe second gate, the electrical characteristics of the OS transistor 810can be shifted to match a curve shown by a dashed line 840 in FIG. 51A.When a low voltage such as the voltage V_(BG) _(_) _(B) is applied tothe second gate, the electrical characteristics of the OS transistor 810can be shifted to match a curve shown by a solid line 841 in FIG. 51A.As shown in FIG. 51A, switching the signal S_(BG) between the voltageV_(BG) _(_) _(A) and the voltage V_(BG) _(_) _(B) enables the thresholdvoltage of the OS transistor 810 to be shifted in the positive directionor the negative direction.

The shift of the threshold voltage in the positive direction toward thethreshold voltage V_(TH) _(_) _(B) can make current less likely to flowin the OS transistor 810. FIG. 51B visualizes the state.

As illustrated in FIG. 51B, a current I_(B) that flows in the OStransistor 810 can be extremely low. Thus, when a signal supplied to theinput terminal IN is at a high level and the OS transistor 820 is on(ON), the voltage of the output terminal OUT can drop sharply.

Since a state in which a current is less likely to flow in the OStransistor 810 as illustrated in FIG. 51B can be obtained, a signalwaveform 831 of the output terminal in the timing chart in FIG. 50C canbe made steep. Shoot-through current between the wiring that suppliesthe voltage VDD and the wiring that supplies the voltage VSS can be low,leading to low-power operation.

The shift of the threshold voltage in the negative direction toward thethreshold voltage V_(TH) _(_) _(A) can make current flow easily in theOS transistor 810. FIG. 51C visualizes the state. As illustrated in FIG.51C, a current IA flowing at this time can be higher than at least thecurrent I_(B). Thus, when a signal supplied to the input terminal IN isat a low level and the OS transistor 820 is off (OFF), the voltage ofthe output terminal OUT can be increased sharply. Since a state in whichcurrent is likely to flow in the OS transistor 810 as shown in FIG. 51Ccan be obtained, a signal waveform 832 of the output terminal in thetiming chart in FIG. 50C can be made steep.

Note that the threshold voltage of the OS transistor 810 is preferablycontrolled by the signal S_(BG) before the state of the OS transistor820 is switched, i.e., before Time T1 or T2. For example, as in FIG.50C, it is preferable that the threshold voltage of the OS transistor810 be switched from the threshold voltage V_(TH) _(_) _(A) to thethreshold voltage V_(TH) _(_) _(B) before time T1 at which the level ofthe signal supplied to the input terminal IN is switched to a highlevel. Moreover, as in FIG. 50C, it is preferable that the thresholdvoltage of the OS transistor 810 be switched from the threshold voltageV_(TH) _(_) _(B) to the threshold voltage V_(T) _(_) _(A) before time T2at which the level of the signal supplied to the input terminal IN isswitched to a low level.

Although the timing chart in FIG. 50C shows the structure in which thelevel of the signal S_(BG) is switched in accordance with the signalsupplied to the input terminal IN, a different structure may be employedin which voltage for controlling the threshold voltage is held by thesecond gate of the OS transistor 810 in a floating state, for example.FIG. 52A illustrates an example of such a circuit configuration.

The circuit configuration in FIG. 52A is the same as that in FIG. 50B,except that an OS transistor 850 is added. A first terminal of the OStransistor 850 is connected to the second gate of the OS transistor 810.A second terminal of the OS transistor 850 is connected to a wiringwhich supplies the voltage V_(BG) _(_) _(B) (or the voltage V_(BG) _(_)_(A)). A first gate of the OS transistor 850 is connected to a wiringwhich supplies a signal S_(F). A second gate of the OS transistor 850 isconnected to the wiring which supplies the voltage V_(BG) _(_) _(B) (orthe voltage V_(BG) _(_) _(A)).

The operation with the circuit configuration in FIG. 52A will bedescribed with reference to a timing chart in FIG. 52B.

The voltage for controlling the threshold voltage of the OS transistor810 is supplied to the second gate of the OS transistor 810 before TimeT3 at which the level of the signal supplied to the input terminal IN ischanged to a high level. The signal S_(F) is set to a high level and theOS transistor 850 is turned on, so that the voltage V_(BG) _(_) _(B) forcontrolling the threshold voltage is supplied to a node N_(BG).

The OS transistor 850 is turned off after the voltage of the node N_(BG)becomes V_(BG) _(_) _(B). Since the off-state current of the OStransistor 850 is extremely low, the voltage V_(BG) _(_) _(B) held bythe node N_(BG) can be retained while the OS transistor 850 remains off.Therefore, the number of times of operation of supplying the voltageV_(BG) _(_) _(B) to the second gate of the OS transistor 850 can bereduced and accordingly the power consumed to rewrite the voltage V_(BG)_(_) _(B) can be reduced.

Although FIGS. 50B and 52A illustrate the case where the voltage issupplied to the second gate of the OS transistor 810 by control from theoutside, a different configuration in which voltage for controlling thethreshold voltage is generated on the basis of the signal supplied tothe input terminal IN and supplied to the second gate of the OStransistor 810 may be employed, for example. FIG. 53A illustrates anexample of such a circuit structure.

The circuit configuration in FIG. 53A is the same as that in FIG. 50B,except that a CMOS inverter 860 is provided between the input terminalIN and the second gate of the OS transistor 810. An input terminal ofthe CMOS inverter 860 is connected to the input terminal IN. An outputterminal of the CMOS inverter 860 is connected to the second gate of theOS transistor 810.

The operation with the circuit structure in FIG. 53A will be describedwith reference to a timing chart in FIG. 53B. The timing chart in FIG.53B illustrates changes of a signal waveform of the input terminal IN, asignal waveform of the output terminal OUT, an output waveform IN_B ofthe CMOS inverter 860, and a threshold voltage of the OS transistor 810.

The output waveform IN_B which corresponds to a signal whose logic isinverted from the logic of the signal supplied to the input terminal INcan be used as a signal that controls the threshold voltage of the OStransistor 810. Therefore, the threshold voltage of the OS transistor810 can be controlled as described with reference to FIGS. 51A to 51C.For example, the signal supplied to the input terminal IN is at a highlevel and the OS transistor 820 is turned on at time T4 in FIG. 53B. Atthis time, the output waveform IN_B is at a low level. Accordingly,current can be made less likely to flow in the OS transistor 810; thus,the voltage of the output terminal OUT can be sharply decreased.

Moreover, the signal supplied to the input terminal IN is at a low leveland the OS transistor 820 is turned off at Time T5 in FIG. 53B. At thistime, the output waveform IN_B is at a high level. Accordingly, currentcan easily flow in the OS transistor 810; thus, a rise in the voltage ofthe output terminal OUT can be made steep.

As described above, in the structure of the inverter including the OStransistor in this embodiment, the voltage of the back gate is switchedin accordance with the logic of the signal supplied to the inputterminal IN. In such a structure, the threshold voltage of the OStransistor can be controlled. The control of the threshold voltage ofthe OS transistor by the signal supplied to the input terminal IN cancause a steep change in the voltage of the output terminal OUT.Moreover, shoot-through current between the wirings that supply powersupply voltages can be reduced. Thus, power consumption can be reduced.

At least part of this embodiment can be implemented in combination withany of the other embodiments described in this specification asappropriate.

Embodiment 7

In this embodiment, examples of a semiconductor device in which thetransistor including an oxide semiconductor (OS transistor) described inany of the above embodiments is used in a plurality of circuits will bedescribed with reference to FIGS. 54A to 54E, FIGS. 55A and 55B, FIGS.56A and 56B, and FIGS. 57A to 57C.

<7. Circuit Configuration Example of Semiconductor Device>

FIG. 54A is a block diagram of a semiconductor device 900. Thesemiconductor device 900 includes a power supply circuit 901, a circuit902, a voltage generation circuit 903, a circuit 904, a voltagegeneration circuit 905, and a circuit 906.

The power supply circuit 901 is a circuit that generates a voltageV_(ORG) used as a reference. The voltage V_(ORG) is not necessarily onevoltage and can be a plurality of voltages. The voltage V_(ORG) can begenerated on the basis of a voltage V₀ supplied from the outside of thesemiconductor device 900. The semiconductor device 900 can generate thevoltage V_(ORG) on the basis of one power supply voltage supplied fromthe outside. Thus, the semiconductor device 900 can operate withoutsupply of a plurality of power supply voltages from the outside.

The circuits 902, 904, and 906 operate with different power supplyvoltages. For example, the power supply voltage of the circuit 902 is avoltage applied on the basis of the voltage V_(ORG) and the voltageV_(SS) (V_(ORG)>V_(SS)). For example, the power supply voltage of thecircuit 904 is a voltage applied on the basis of the voltage V_(POG) andthe voltage V_(SS) (V_(POG)>V_(SS)). For example, the power supplyvoltages of the circuit 906 are voltages applied on the basis of thevoltage V_(ORG), the voltage V_(SS), and a voltage V_(NEG)(V_(ORG)>V_(SS)>V_(NEG)). When the voltage V_(SS) is equal to a groundpotential (GND), the kinds of voltages generated in the power supplycircuit 901 can be reduced.

The voltage generation circuit 903 is a circuit that generates thevoltage V_(POG). The voltage generation circuit 903 can generate thevoltage V_(POG) on the basis of the voltage V_(ORG) supplied from thepower supply circuit 901. Thus, the semiconductor device 900 includingthe circuit 904 can operate on the basis of one power supply voltagesupplied from the outside.

The voltage generation circuit 905 is a circuit that generates thevoltage V_(NEG). The voltage generation circuit 905 can generate thevoltage V_(NEG) on the basis of the voltage V_(ORG) supplied from thepower supply circuit 901. Thus, the semiconductor device 900 includingthe circuit 906 can operate on the basis of one power supply voltagesupplied from the outside.

FIG. 54B illustrates an example of the circuit 904 that operates withthe voltage V_(POG) and FIG. 54C illustrates an example of a waveform ofa signal for operating the circuit 904.

FIG. 54B illustrates a transistor 911. A signal supplied to a gate ofthe transistor 911 is generated on the basis of, for example, thevoltage V_(POG) and the voltage V_(SS). The signal is generated on thebasis of the voltage V_(POG) to turn on the transistor 911 and on thebasis of the voltage V_(SS) to turn off the transistor 911. Asillustrated in FIG. 54C, the voltage V_(POG) is higher than the voltageV_(ORG). Thus, a source (S) and a drain (D) of the transistor 911 can beelectrically connected to each other more surely. As a result, thefrequency of malfunction of the circuit 904 can be reduced.

FIG. 54D illustrates an example of the circuit 906 that operates withthe voltage V_(NEG) and FIG. 54E illustrates an example of a waveform ofa signal for operating the circuit 906.

FIG. 54D illustrates a transistor 912 having a back gate. A signalsupplied to a gate of the transistor 912 is generated on the basis of,for example, the voltage V_(ORG) and the voltage V_(SS). The signal isgenerated on the basis of the voltage V_(ORG) to turn on the transistor912 and on the basis of the voltage V_(SS) to turn off the transistor912. A signal supplied to the back gate of the transistor 912 isgenerated on the basis of the voltage V_(NEG). As illustrated in FIG.54E, the voltage V_(NEG) is lower than the voltage V_(SS) (GND). Thus,the threshold voltage of the transistor 912 can be controlled to shiftin the positive direction. Thus, the transistor 912 can be surely turnedoff and the amount of current flowing between the source (S) and thedrain (D) can be small. As a result, the frequency of malfunction of thecircuit 906 can be reduced and the power consumption thereof can bereduced.

The voltage V_(NEG) may be directly supplied to the back gate of thetransistor 912. Alternatively, a signal supplied to the gate of thetransistor 912 may be generated on the basis of the voltage V_(ORG) andthe voltage V_(NEG) and the generated signal may also be supplied to theback gate of the transistor 912.

FIGS. 55A and 55B illustrate a modification example of FIGS. 54D and54E.

In a circuit diagram illustrated in FIG. 55A, a transistor 922 whoseconduction state can be controlled by a control circuit 921 is providedbetween the voltage generation circuit 905 and the circuit 906. Thetransistor 922 is an n-channel OS transistor. A control signal S_(BG)output from the control circuit 921 is a signal for controlling theconduction state of the transistor 922. Transistors 912A and 912Bincluded in the circuit 906 are OS transistors like the transistor 922.

A timing chart in FIG. 55B shows changes in the potential of the controlsignal S_(BG) and the potential of a node N_(BG). The potential of thenode N_(BG) indicates the states of potentials of back gates of thetransistors 912A and 912B. When the control signal S_(BG) is at a highlevel, the transistor 922 is turned on and the voltage of the nodeN_(BG) becomes the voltage V_(NEG). Then, when the control signal S_(BG)is at a low level, the node N_(BG) is brought into an electricallyfloating state. Since the transistor 922 is an OS transistor, itsoff-state current is small. Accordingly, even when the node N_(BG) is inan electrically floating state, the voltage V_(NEG) which has beensupplied can be held.

FIG. 56A illustrates an example of a circuit configuration applicable tothe above-described voltage generation circuit 903. The voltagegeneration circuit 903 illustrated in FIG. 56A is a five-stage chargepump including diodes D1 to D5, capacitors C1 to C5, and an inverterINV. A clock signal CLK is supplied to the capacitors C1 to C5 directlyor through the inverter INV. When the power supply voltage of theinverter INV is a voltage applied on the basis of the voltage V_(ORG)and the voltage V_(SS), the voltage V_(POG), which has been increased toa positive voltage having a positively quintupled value of the voltageV_(ORG) by application of the clock signal CLK, can be obtained. Notethat a forward voltage of the diodes D1 to D5 is 0 V. A desired voltageV_(POG) can be obtained when the number of stages of the charge pump ischanged.

FIG. 56B illustrates an example of a circuit configuration applicable tothe above-described voltage generation circuit 905. The voltagegeneration circuit 905 illustrated in FIG. 56B is a four-stage chargepump including the diodes D1 to D5, the capacitors C1 to C5, and theinverter INV. A clock signal CLK is supplied to the capacitors C1 to C5directly or through the inverter INV. When the power supply voltage ofthe inverter INV is a voltage applied on the basis of the voltageV_(ORG) and the voltage V_(SS), the voltage V_(NEG), which has beenreduced from the ground voltage, i.e., the voltage V_(SS) to a negativevoltage having a negatively quadrupled value of the voltage V_(ORG) byapplication of the clock signal CLK, can be obtained. Note that aforward voltage of the diodes D1 to D5 is 0 V. A desired voltage V_(NEG)can be obtained when the number of stages of the charge pump is changed.

The circuit configuration of the voltage generation circuit 903 is notlimited to the configuration in the circuit diagram illustrated in FIG.56A. Modification examples of the voltage generation circuit 903 areillustrated in FIGS. 57A to 57C. Note that further modification examplesof the voltage generation circuit 903 can be realized by changingvoltages supplied to wirings or arrangement of elements in voltagegeneration circuits 903A to 903C illustrated in FIGS. 57A to 57C.

A voltage generation circuit 903A illustrated in FIG. 57A includestransistors M1 to M10, capacitors C11 to C14, and an inverter INV1. Theclock signal CLK is supplied to gates of the transistors M1 to M10directly or through the inverter INV1. The voltage V_(POG) can beobtained by increasing the voltage V_(ORG) by a voltage four times thepotential difference between the voltage V_(ORG) and the voltage V_(SS)with the application of the clock signal CLK. A desired voltage V_(POG)can be obtained when the number of stages is changed. In the voltagegeneration circuit 903A in FIG. 57A, off-state current of each of thetransistors M1 to M10 can be low when the transistors M1 to M10 are OStransistors, and leakage of charge held in the capacitors C11 to C14 canbe suppressed. Accordingly, raising from the voltage V_(ORG) to thevoltage V_(POG) can be efficiently performed.

The voltage generation circuit 903B illustrated in FIG. 57B includestransistors M11 to M14, capacitors C15 and C16, and an inverter INV2.The clock signal CLK is supplied to gates of the transistors M11 to M14directly or through the inverter INV2. The voltage V_(POG) can beobtained by increasing the voltage V_(ORG) by a voltage twice thepotential difference between the voltage V_(ORG) and the voltage V_(SS)with the application of the clock signal CLK. In the voltage generationcircuit 903B in FIG. 57B, off-state current of each of the transistorsM11 to M14 can be low when the transistors M11 to M14 are OStransistors, and leakage of charge held in the capacitors C15 and C16can be suppressed. Accordingly, raising from the voltage V_(ORG) to thevoltage V_(POG) can be efficiently performed.

A voltage generation circuit 903C shown in FIG. 57C includes an inductorInd1, a transistor M15, a diode D6, and a capacitor C17. The conductionstate of the transistor M15 is controlled by a control signal EN. Owingto the control signal EN, the voltage V_(POG) which is obtained byincreasing the voltage V_(ORG) can be obtained. Since the voltagegeneration circuit 903C in FIG. 57C increases the voltage using theinductor Ind1, the voltage can be efficiently increased.

As described above, in any of the structures of this embodiment, avoltage required for circuits included in a semiconductor device can beinternally generated. Thus, in the semiconductor device, the number ofpower supply voltages supplied from the outside can be reduced.

At least part of this embodiment can be implemented in combination withany of the other embodiments described in this specification asappropriate.

Embodiment 8

In this embodiment, a display module and electronic devices, each ofwhich includes a semiconductor device of one embodiment of the presentinvention, will be described with reference to FIG. 58, FIGS. 59A to59E, FIGS. 60A to 60G, and FIGS. 61A and 61B.

<8-1. Display Module>

In a display module 7000 illustrated in FIG. 58, a touch panel 7004connected to an FPC 7003, a display panel 7006 connected to an FPC 7005,a backlight 7007, a frame 7009, a printed board 7010, and a battery 7011are provided between an upper cover 7001 and a lower cover 7002.

The semiconductor device of one embodiment of the present invention canbe used for the display panel 7006, for example.

The shapes and sizes of the upper cover 7001 and the lower cover 7002can be changed as appropriate in accordance with the sizes of the touchpanel 7004 and the display panel 7006.

The touch panel 7004 can be a resistive touch panel or a capacitivetouch panel and overlap with the display panel 7006. Alternatively, acounter substrate (sealing substrate) of the display panel 7006 can havea touch panel function. Alternatively, a photosensor may be provided ineach pixel of the display panel 7006 to form an optical touch panel.

The backlight 7007 includes a light source 7008. One embodiment of thepresent invention is not limited to the structure in FIG. 58, in whichthe light source 7008 is provided over the backlight 7007. For example,a structure in which the light source 7008 is provided at an end portionof the backlight 7007 and a light diffusion plate is further providedmay be employed. Note that the backlight 7007 need not be provided inthe case where a self-luminous light-emitting element such as an organicEL element is used or in the case where a reflective panel or the likeis employed.

The frame 7009 protects the display panel 7006 and functions as anelectromagnetic shield for blocking electromagnetic waves generated bythe operation of the printed board 7010. The frame 7009 may alsofunction as a radiator plate.

The printed board 7010 includes a power supply circuit and a signalprocessing circuit for outputting a video signal and a clock signal. Asa power source for supplying power to the power supply circuit, anexternal commercial power source or the separate battery 7011 may beused. The battery 7011 can be omitted in the case where a commercialpower source is used.

The display module 7000 may be additionally provided with a member suchas a polarizing plate, a retardation plate, or a prism sheet.

<8-2. Electronic Device 1>

Next, FIGS. 59A to 59E illustrate examples of electronic devices.

FIG. 59A is an external view of a camera 8000 to which a finder 8100 isattached.

The camera 8000 includes a housing 8001, a display portion 8002,operation buttons 8003, a shutter button 8004, and the like.Furthermore, an attachable lens 8006 is attached to the camera 8000.

Although the lens 8006 of the camera 8000 here is detachable from thehousing 8001 for replacement, the lens 8006 may be included in thehousing 8001.

Images can be taken with the camera 8000 at the press of the shutterbutton 8004. In addition, images can be taken at the touch of thedisplay portion 8002 which serves as a touch panel.

The housing 8001 of the camera 8000 includes a mount including anelectrode, so that the finder 8100, a stroboscope, or the like can beconnected to the housing 8001.

The finder 8100 includes a housing 8101, a display portion 8102, abutton 8103, and the like.

The housing 8101 includes a mount for engagement with the mount of thecamera 8000 so that the finder 8100 can be connected to the camera 8000.The mount includes an electrode, and an image or the like received fromthe camera 8000 through the electrode can be displayed on the displayportion 8102.

The button 8103 functions as a power supply button. With the button8103, the display portion 8102 can be turned on and off.

A display device of one embodiment of the present invention can be usedin the display portion 8002 of the camera 8000 and the display portion8102 of the finder 8100.

Although the camera 8000 and the finder 8100 are separate and detachableelectronic devices in FIG. 59A, the housing 8001 of the camera 8000 mayinclude a finder having a display device.

FIG. 59B is an external view of a head-mounted display 8200.

The head-mounted display 8200 includes a mounting portion 8201, a lens8202, a main body 8203, a display portion 8204, a cable 8205, and thelike. The mounting portion 8201 includes a battery 8206.

Power is supplied from the battery 8206 to the main body 8203 throughthe cable 8205. The main body 8203 includes a wireless receiver or thelike to receive video data, such as image data, and display it on thedisplay portion 8204. The movement of the eyeball and the eyelid of auser is captured by a camera in the main body 8203 and then coordinatesof the points the user looks at are calculated using the captured datato utilize the eye of the user as an input means.

The mounting portion 8201 may include a plurality of electrodes so as tobe in contact with the user. The main body 8203 may be configured tosense current flowing through the electrodes with the movement of theuser's eyeball to recognize the direction of his or her eyes. The mainbody 8203 may be configured to sense current flowing through theelectrodes to monitor the user's pulse. The mounting portion 8201 mayinclude sensors, such as a temperature sensor, a pressure sensor, or anacceleration sensor so that the user's biological information can bedisplayed on the display portion 8204. The main body 8203 may beconfigured to sense the movement of the user's head or the like to movean image displayed on the display portion 8204 in synchronization withthe movement of the user's head or the like.

The display device of one embodiment of the present invention can beused in the display portion 8204.

FIGS. 59C to 59E are external views of a head-mounted display 8300. Thehead-mounted display 8300 includes a housing 8301, a display portion8302, fixing bands 8304, and a pair of lenses 8305.

A user can see display on the display portion 8302 through the lenses8305. It is favorable that the display portion 8302 be curved. When thedisplay portion 8302 is curved, a user can feel high realistic sensationof images. Although the structure described in this embodiment as anexample has one display portion 8302, the number of display portions8302 provided is not limited to one. For example, two display portions8302 may be provided, in which case one display portion is provided forone corresponding user's eye, so that three-dimensional display usingparallax or the like is possible.

The display device of one embodiment of the present invention can beused in the display portion 8302. The display device including thesemiconductor device of one embodiment of the present invention has anextremely high resolution; thus, even when an image is magnified usingthe lenses 8305 as illustrated in FIG. 59E, the user does not perceivepixels, and thus a more realistic image can be displayed.

<8-3. Electronic Device 2>

Next, FIGS. 59A to 59E illustrate examples of electronic devices thatare different from those illustrated in FIGS. 60A to 60G.

Electronic devices illustrated in FIGS. 60A to 60G include a housing9000, a display portion 9001, a speaker 9003, an operation key 9005(including a power switch or an operation switch), a connection terminal9006, a sensor 9007 (a sensor having a function of measuring force,displacement, position, speed, acceleration, angular velocity,rotational frequency, distance, light, liquid, magnetism, temperature,chemical substance, sound, time, hardness, electric field, current,voltage, electric power, radiation, flow rate, humidity, gradient,oscillation, odor, or infrared ray), a microphone 9008, and the like.

The electronic devices illustrated in FIGS. 60A to 60G can have avariety of functions. For example, a function of displaying a lot ofinformation (e.g., a still image, a moving image, and a text image) on adisplay portion; a touch panel function; a function of displaying acalendar, date, time, and the like; a function of controlling processingwith a lot of software (programs); a wireless communication function; afunction of being connected to a variety of computer networks with awireless communication function; a function of transmitting andreceiving a lot of data with a wireless communication function; afunction of reading a program or data stored in a memory medium anddisplaying the program or data on a display portion. Note that functionswhich can be provided for the electronic devices illustrated in FIGS.60A to 60G are not limited them, and the electronic devices can have avariety of functions. Although not illustrated in FIGS. 60A to 60G, theelectronic devices may each have a plurality of display portions. Theelectronic devices may have a camera or the like and a function oftaking a still image, a function of taking a moving image, a function ofstoring the taken image in a memory medium (an external memory medium ora memory medium incorporated in the camera), a function of displayingthe taken image on the display portion, or the like.

The electronic devices illustrated in FIGS. 60A to 60G will be describedin detail below.

FIG. 60A is a perspective view illustrating a television device 9100.The television device 9100 can include the display portion 9001 having alarge screen size of, for example, 50 inches or more, or 100 inches ormore.

FIG. 60B is a perspective view of a portable information terminal 9101.The portable information terminal 9101 functions as, for example, one ormore of a telephone set, a notebook, an information browsing system, andthe like. Specifically, the portable information terminal can be used asa smartphone. Note that the portable information terminal 9101 mayinclude the speaker 9003, the connection terminal 9006, the sensor 9007,or the like. The portable information terminal 9101 can displaycharacters and image information on its plurality of surfaces. Forexample, three operation buttons 9050 (also referred to as operationicons, or simply, icons) can be displayed on one surface of the displayportion 9001. Furthermore, information 9051 indicated by dashedrectangles can be displayed on another surface of the display portion9001. Examples of the information 9051 include display indicatingreception of an incoming email, social networking service (SNS) message,call, and the like; the title and sender of an email and SNS message;the date; the time; remaining battery; and the reception strength of anantenna. Instead of the information 9051, the operation buttons 9050 orthe like may be displayed on the position where the information 9051 isdisplayed.

FIG. 60C is a perspective view of a portable information terminal 9102.The portable information terminal 9102 has a function of displayinginformation on three or more surfaces of the display portion 9001. Here,information 9052, information 9053, and information 9054 are displayedon different surfaces. For example, a user of the portable informationterminal 9102 can see the display (here, the information 9053) with theportable information terminal 9102 put in a breast pocket of his/herclothes. Specifically, a caller's phone number, name, or the like of anincoming call is displayed in a position that can be seen from above theportable information terminal 9102. Thus, the user can see the displaywithout taking out the portable information terminal 9102 from thepocket and decide whether to answer the call.

FIG. 60D is a perspective view illustrating a wrist-watch-type portableinformation terminal 9200. The portable information terminal 9200 iscapable of executing a variety of applications such as mobile phonecalls, e-mailing, viewing and editing texts, music reproduction,Internet communication, and computer games. The display surface of thedisplay portion 9001 is bent, and images can be displayed on the bentdisplay surface. The portable information terminal 9200 can employ nearfield communication that is a communication method based on an existingcommunication standard. In that case, for example, mutual communicationbetween the portable information terminal and a headset capable ofwireless communication can be performed, and thus hands-free calling ispossible. The portable information terminal 9200 includes the connectionterminal 9006, and data can be directly transmitted to and received fromanother information terminal via a connector. Power charging through theconnection terminal 9006 is possible. Note that the charging operationmay be performed by wireless power feeding without using the connectionterminal 9006.

FIGS. 60E to 60G are perspective views of a foldable portableinformation terminal 9201. FIG. 60E is a perspective view of thefoldable portable information terminal 9201 that is opened. FIG. 60F isa perspective view of the foldable portable information terminal 9201that is being opened or being folded. FIG. 60G is a perspective view ofthe foldable portable information terminal 9201 that is folded. When theportable information terminal 9201 is opened, a seamless large displayregion is highly browsable. The display portion 9001 of the portableinformation terminal 9201 is supported by three housings 9000 joinedtogether by hinges 9055. By folding the portable information terminal9201 at a connection portion between two housings 9000 with the hinges9055, the portable information terminal 9201 can be reversibly changedin shape from an opened state to a folded state. For example, theportable information terminal 9201 can be bent with a radius ofcurvature of greater than or equal to 1 mm and less than or equal to 150mm.

Next, FIGS. 61A and 61B illustrate examples of electronic devices thatare different from those illustrated in FIGS. 59A to 59E and FIGS. 60Ato 60G. FIGS. 61A and 61B are perspective views of a display deviceincluding a plurality of display panels. Note that the plurality ofdisplay panels are wound in the perspective view in FIG. 61A and areunwound in the perspective view in FIG. 61B.

A display device 9500 illustrated in FIGS. 61A and 61B includes aplurality of display panels 9501, a hinge 9511, and a bearing 9512. Theplurality of display panels 9501 each include a display region 9502 anda light-transmitting region 9503.

Each of the plurality of display panels 9501 is flexible. Two adjacentdisplay panels 9501 are provided so as to partly overlap with eachother. For example, the light-transmitting regions 9503 of the twoadjacent display panels 9501 can be overlapped each other. A displaydevice having a large screen can be obtained with the plurality ofdisplay panels 9501. The display device is highly versatile because thedisplay panels 9501 can be wound depending on its use.

Moreover, although the display regions 9502 of the adjacent displaypanels 9501 are separated from each other in FIGS. 61A and 61B, withoutlimitation to this structure, the display regions 9502 of the adjacentdisplay panels 9501 may overlap with each other without any space sothat a continuous display region 9502 is obtained, for example.

The electronic devices described in this embodiment each include thedisplay portion for displaying some sort of data. Note that thesemiconductor device of one embodiment of the present invention can alsobe used for an electronic device that does not have a display portion.

At least part of this embodiment can be implemented in combination withany of the other embodiments described in this specification asappropriate.

Example

In this example, samples (Samples C1 to C4, Sample D1, and Sample E1)including transistors were fabricated, and the electricalcharacteristics of the transistors were evaluated.

<1-1. Structures of Samples>

In Samples C1 to C4, an oxide semiconductor film is used in a channelregion. In Sample D1, n-type low temperature poly silicon (LTPS) is usedin a channel region. In Sample E1, p-type LTPS is used in a channelregion. That is, Samples C1 to C4 are samples of one embodiment of thepresent invention and Samples D1 and E1 are samples for comparison.

Note that Samples C1 to C4 with different transistor sizes werefabricated through the same process.

The sizes of transistors in Sample C1, Sample C2, Sample C3, and SampleC4 were L/W=2 μm/3 μm, L/W=3 μm/3 μm, L/W=6 μm/3 μm, and L/W=10 μm/3 μm,respectively.

The size of each transistor in Samples D1 and E1 for comparison wasL/W=6 μm/3 μm.

<1-2. Fabrication Method of Samples C1 to C4>

First, a fabrication method of Samples C1 to C4 is described.

Samples C1 to C4 were fabricated by a method similar to that forfabricating Sample A3 in Embodiment 1.

<1-3. Fabrication Method of Samples D1 and E1>

In Samples D1 and E1, LTPS is used for a semiconductor layer and thefabrication method of the transistor is similar to that of Samples C1 toC4.

<1-4. I_(d)-V_(g) Characteristics of Transistors>

FIG. 62, FIG. 63, FIG. 64, and FIG. 65 show I_(d)-V_(g) characteristicsof transistors formed in Sample C1, Sample C2, Sample C3, and Sample C4,respectively. FIG. 66 and FIG. 67 show I_(d)-V_(g) characteristics oftransistors formed in Sample D1 and Sample E1, respectively.

As conditions for measuring the I_(d)-V_(g) characteristics of eachtransistor, a voltage applied to the conductive film serving as a firstgate electrode (hereinafter the voltage is also referred to as gatevoltage (V_(g))) and a voltage applied to the conductive film serving asthe second gate electrode (hereinafter the voltage is also referred toas back gate voltage (V_(bg))) were changed from −10 V to +10 V inincrements of 0.25 V. A voltage applied to the conductive film servingas a source electrode (hereinafter the voltage is also referred to assource voltage (V_(s))) was 0 V (comm) and different voltages(hereinafter the voltages are also referred to as drain voltage (V_(d)))were applied to the conductive film serving as a drain electrode in eachsample.

As the measurement conditions of the I_(d)-V_(g) characteristics oftransistors formed in Samples C1 to C4, the drain voltages (V_(d)) were3 V, 4 V, 5 V, 6 V, 7 V, 8 V, 9 V, and 10 V. As the measurementconditions of the I_(d)-V_(g) characteristics of transistors formed inSamples D1 and E1, the drain voltages (V_(d)) were 5 V, 10 V, 15 V, and20 V.

In FIG. 62, FIG. 63, FIG. 64, and FIG. 65, the measurement results whenthe drain voltages (V_(d)) were 3 V, 4 V, 5 V, 6 V, 7 V, 8 V, 9 V, and10 V overlap with each other. In FIG. 66 and FIG. 67, the measurementresults when the drain voltages (V_(d)) were 5 V, 10 V, 15 V, and 20 Voverlap with each other.

In FIG. 62, FIG. 63, FIG. 64, FIG. 65, FIG. 66, and FIG. 67, the firstvertical axis represents I_(d) (A), the second vertical axis representsfield-effect mobility (μFE) (cm²/Vs), and the horizontal axis representsV_(g) (V).

As shown in FIG. 62, FIG. 63, FIG. 64, and FIG. 65, in Samples C1 to C4of one embodiment of the present invention, mobility curves insaturation regions have favorable saturation. Then, from the mobilitycurves of Samples C1 to C4 in FIG. 62, FIG. 63, FIG. 64, and FIG. 65 inthe range of V_(g) from 3 V to 10 V, the maximum values and the minimumvalues of the field-effect mobilities and values each obtained bysubtracting the minimum value from the maximum value are obtained. Table3 shows the results.

TABLE 3 μ_(FE) [cm²/Vs] V_(d) [V] Max Min Max − Min Sample C1 3 23.8 6.517.4 4 27.5 9.5 18.0 5 30.0 12.9 17.1 6 31.8 16.7 15.1 7 33.4 21.0 12.48 35.2 25.6 9.6 9 37.0 30.3 6.7 10 39.2 34.2 4.9 Sample C2 3 24.5 5.718.8 4 26.6 8.2 18.4 5 27.7 11.0 16.8 6 28.6 14.1 14.5 7 29.4 17.7 11.78 30.2 21.5 8.7 9 30.7 24.9 5.9 10 31.7 28.1 3.6 Sample C3 3 21.1 6.115.0 4 21.8 8.7 13.1 5 22.4 11.6 10.8 6 22.9 14.7 8.2 7 23.5 17.8 5.6 823.9 20.4 3.5 9 24.2 20.4 3.8 10 24.7 20.6 4.1 Sample C4 3 22.5 6.2 16.44 23.0 8.8 14.2 5 23.3 11.8 11.5 6 23.5 15.1 8.4 7 23.7 18.3 5.4 8 23.919.4 4.5 9 24.1 19.3 4.8 10 24.2 19.0 5.2

As shown in FIG. 62, FIG. 63, FIG. 64, FIG. 65, and Table 3, in thesemiconductor device of one embodiment of the present invention, themobility curve has favorable saturation and a difference between themaximum value and the minimum value of the field-effect mobility in thesaturation region is less than or equal to 15 cm²/Vs. In contrast, ineach of Samples D1 and E1 for comparison, a difference between themaximum value and the minimum value of the field-effect mobility islarge as shown in FIG. 66 and FIG. 67.

As described above, in the semiconductor device of one embodiment of thepresent invention, the saturation of the mobility curve is extremelyfavorable. When a transistor having such a characteristic is used as atransistor for a pixel of an organic EL display, for example, highreliability can be obtained. Alternatively, when the above transistor isused for a sensor or the like, stable output characteristics can beobtained. The above characteristic is not achieved when LTPS is used fora semiconductor layer of a transistor, and is an excellent effectobtained when the oxide semiconductor film of one embodiment of thepresent invention is used for a semiconductor layer of a transistor.

Next, FIG. 68 shows calculation results of the threshold voltages(V_(th)) of Samples C1 to C4. The threshold voltages (V_(th)) of thetransistors are calculated by a constant current method. The constantcurrent method is a method in which, from the results of I_(d)-V_(g)characteristics, I_(d) is normalized to be L/W=1 and V_(g) in the casewhere a constant current (here, 1 nA) flows is set to a thresholdvoltage (V_(th)).

As shown in FIG. 68, the threshold voltages of Samples C1 to C4 aresubstantially constant even when V_(d) is increased. Thus, Samples C1 toC4 of one embodiment of the present invention have stable electricalcharacteristics.

Note that the structures described in this example can be used incombination with any of the structures described in the otherembodiments as appropriate.

EXPLANATION OF REFERENCE

100A: transistor, 100B: transistor, 100C: transistor, 100D: transistor,100E: transistor, 100F: transistor, 100G: transistor, 100H: transistor,100J: transistor, 102: substrate, 104: insulating film, 106: conductivefilm, 108: oxide semiconductor film, 108_1: oxide semiconductor film,108_2: oxide semiconductor film, 108_3: oxide semiconductor film, 108 d:drain region, 108 f: regions, 108 i: channel region, 108 s: sourceregion, 110: insulating film, 112: conductive film, 112_1: conductivefilm, 112_2: conductive film, 116: insulating film, 118: insulatingfilm, 120 a: conductive film, 120 b: conductive film, 122: insulatingfilm, 141 a: opening, 141 b: opening, 143: opening, 200: transistor,205: conductor, 205 a: conductor, 205 b: conductor, 210: insulator, 212:insulator, 214: insulator, 216: insulator, 218: conductor, 220:insulator, 222: insulator, 224: insulator, 230: oxide semiconductor, 230a: oxide semiconductor, 230 b: oxide semiconductor, 230 c: oxidesemiconductor, 240 a: conductor, 240 b: conductor, 244: conductor, 245:conductor, 250: insulator, 260: conductor, 260 a: conductor, 260 b:conductor, 270: insulator, 280: insulator, 282: insulator, 284:insulator, 400: transistor, 401: substrate, 402: semiconductor region,404: insulator, 406: conductor, 408 a: low-resistance region, 408 b:low-resistance region, 410: capacitor, 420: insulator, 422: insulator,424: insulator, 426: insulator, 428: conductor, 430: conductor, 450:insulator, 452: insulator, 454: insulator, 456: conductor, 458:insulator, 460: insulator, 462: conductor, 466: conductor, 470:insulator, 474: conductor, 480: insulator, 482: insulator, 484:insulator, 501: pixel circuit, 502: pixel portion, 504: driver circuitportion, 504 a: gate driver, 504 b: source driver, 506: protectioncircuit, 507: terminal portion, 550: transistor, 552: transistor, 554:transistor, 560: capacitor, 562: capacitor, 570: liquid crystal element,572: light-emitting element, 664: electrode, 665: electrode, 667:electrode, 700: display device, 701: substrate, 702: pixel portion, 704:source driver circuit portion, 705: substrate, 706: gate driver circuitportion, 708: FPC terminal portion, 710: signal line, 711: lead wiringportion, 712: sealant, 716: FPC, 730: insulating film, 732: sealingfilm, 734: insulating film, 736: coloring film, 738: light-blockingfilm, 750: transistor, 752: transistor, 760: connection electrode, 770:planarization insulating film, 772: conductive film, 773: insulatingfilm, 774: conductive film, 775: liquid crystal element, 776: liquidcrystal layer, 778: structure body, 780: anisotropic conductive film,782: light-emitting element, 783: droplet discharge apparatus, 784:droplet, 785: layer, 786: EL layer, 788: conductive film, 790:capacitor, 791: touch panel, 792: insulating film, 793: electrode, 794:electrode, 795: insulating film, 796: electrode, 797: insulating film,800: inverter, 810: OS transistor, 820: OS transistor, 831: signalwaveform, 832: signal waveform, 840: dashed line, 841: solid line, 850:OS transistor, 860: CMOS inverter, 900: semiconductor device, 901: powersupply circuit, 902: circuit, 903: voltage generation circuit, 903A:voltage generation circuit, 903B: voltage generation circuit, 903C:voltage generation circuit, 904: circuit, 905: voltage generationcircuit, 906: circuit, 911: transistor, 912: transistor, 912A:transistor, 912B: transistor, 921: control circuit, 922: transistor,1400: droplet discharge apparatus, 1402: substrate, 1403: dropletdischarge means, 1404: imaging means, 1405: head, 1406: dotted line,1407: control means, 1408: storage medium, 1409: image processing means,1410: computer, 1411: marker, 1412: head, 1413: material supply source,1414: material supply source, 7000: display module, 7001: upper cover,7002: lower cover, 7003: FPC, 7004: touch panel, 7005: FPC, 7006:display panel, 7007: backlight, 7008: light source, 7009: frame, 7010:printed board, 7011: battery, 8000: camera, 8001: housing, 8002: displayportion, 8003: operation buttons, 8004: shutter button, 8006: lens,8100: finder, 8101: housing, 8102: display portion, 8103: button, 8200:head-mounted display, 8201: mounting portion, 8202: lens, 8203: mainbody, 8204: display portion, 8205: cable, 8206: battery, 8300:head-mounted display, 8301: housing, 8302: display portion, 8304: fixingbands, 8305: lenses, 9000: housing, 9001: display portion, 9003:speaker, 9005: operation key, 9006: connection terminal, 9007: sensor,9008: microphone, 9050: operation buttons, 9051: information, 9052:information, 9053: information, 9054: information, 9055: hinges, 9100:television device, 9101: portable information terminal, 9102: portableinformation terminal, 9200: portable information terminal, 9201:portable information terminal, 9500: display device, 9501: displaypanels, 9502: display region, 9503: region, 9511: hinge, 9512: bearing.

This application is based on Japanese Patent Application serial no.2016-024579 filed with Japan Patent Office on Feb. 12, 2016, andJapanese Patent Application serial no. 2016-125375 filed with JapanPatent Office on Jun. 24, 2016, the entire contents of which are herebyincorporated by reference.

1. A transistor comprising: a first gate electrode, an oxidesemiconductor film, and a second gate electrode, wherein the first gateelectrode and the second gate electrode are electrically connected toeach other, wherein a difference between a minimum value and a maximumvalue of field-effect mobility measured in a saturation region of thetransistor is less than or equal to 15 cm²/Vs, and wherein thefield-effect mobility is measured when voltages applied to the firstgate electrode and the second gate electrode are in a range from 3 V to10 V and a voltage applied to a drain region of the oxide semiconductorfilm is in a range from 10 V to 20 V.
 2. The transistor according toclaim 1, wherein the oxide semiconductor film comprises In, M (M is atleast one of Al, Ga, Y, and Sn), and Zn.
 3. The transistor according toclaim 2, wherein an atomic ratio of In to M and Zn is in a neighborhoodof In:M:Zn=4:2:3, and wherein when the proportion of In is 4, theproportion of M is greater than or equal to 1.5 and less than or equalto 2.5, and the proportion of Zn is greater than or equal to 2 and lessthan or equal to
 4. 4. The transistor according to claim 1, wherein asubstrate temperature during deposition of the oxide semiconductor filmis room temperature.
 5. The transistor according to claim 1, furthercomprising a source electrode and a drain electrode electricallyconnected to the oxide semiconductor film.
 6. The transistor accordingto claim 1, wherein a hydrogen concentration of the oxide semiconductorfilm measured by secondary ion mass spectrometry (SIMS) is lower than1×10¹⁸ atoms/cm³.
 7. A semiconductor device comprising the transistoraccording to claim
 1. 8. A transistor comprising: a first gateelectrode, an oxide semiconductor film, and a second gate electrode,wherein the first gate electrode and the second gate electrode areelectrically connected to each other, wherein the oxide semiconductorfilm comprises nanocrystals, wherein a difference between a minimumvalue and a maximum value of field-effect mobility measured in asaturation region of the transistor is less than or equal to 15 cm²/Vs,and wherein the field-effect mobility is measured when voltages appliedto the first gate electrode and the second gate electrode are in a rangefrom 3 V to 10 V and a voltage applied to a drain region of the oxidesemiconductor film is in a range from 10 V to 20 V.
 9. The transistoraccording to claim 8, wherein the oxide semiconductor film comprises In,M (M is at least one of Al, Ga, Y, and Sn), and Zn.
 10. The transistoraccording to claim 9, wherein an atomic ratio of In to M and Zn is in aneighborhood of In:M:Zn=4:2:3, and wherein when the proportion of In is4, the proportion of M is greater than or equal to 1.5 and less than orequal to 2.5, and the proportion of Zn is greater than or equal to 2 andless than or equal to
 4. 11. The transistor according to claim 8,wherein a substrate temperature during deposition of the oxidesemiconductor film is room temperature.
 12. The transistor according toclaim 8, further comprising a source electrode and a drain electrodeelectrically connected to the oxide semiconductor film.
 13. Thetransistor according to claim 8, wherein a hydrogen concentration of theoxide semiconductor film measured by secondary ion mass spectrometry(SIMS) is lower than 1×10¹⁸ atoms/cm³.
 14. A semiconductor devicecomprising the transistor according to claim
 8. 15. A semiconductordevice comprising: a transistor comprising: a first gate electrode; afirst insulating film over the first gate electrode; an oxidesemiconductor film over the first insulating film; a second insulatingfilm over the oxide semiconductor film; a second gate electrode over thesecond insulating film; and a third insulating film over the oxidesemiconductor film and the second gate electrode, wherein the oxidesemiconductor film comprises a channel region overlapping with thesecond gate electrode, a source region in contact with the thirdinsulating film, and a drain region in contact with the third insulatingfilm, wherein the first gate electrode and the second gate electrode areelectrically connected to each other, wherein a difference between aminimum value and a maximum value of field-effect mobility measured in asaturation region of the transistor is less than or equal to 15 cm²/Vs,and wherein the field-effect mobility is measured when voltages appliedto the first gate electrode and the second gate electrode are in a rangefrom 3 V to 10 V and a voltage applied to the drain region is in a rangefrom 10 V to 20 V.
 16. The semiconductor device according to claim 15,wherein the oxide semiconductor film comprises In, M (M is Al, Ga, Y,and Sn), and Zn.
 17. The semiconductor device according to claim 16,wherein an atomic ratio of In to M and Zn is in a neighborhood ofIn:M:Zn=4:2:3, and wherein when the proportion of In is 4, theproportion of M is greater than or equal to 1.5 and less than or equalto 2.5, and the proportion of Zn is greater than or equal to 2 and lessthan or equal to
 4. 18. A display device comprising: the semiconductordevice according to claim 15; and a display element.
 19. A displaymodule comprising: the display device according to claim 18; and a touchsensor.